JPH056666Y2 - - Google Patents
Info
- Publication number
- JPH056666Y2 JPH056666Y2 JP18727485U JP18727485U JPH056666Y2 JP H056666 Y2 JPH056666 Y2 JP H056666Y2 JP 18727485 U JP18727485 U JP 18727485U JP 18727485 U JP18727485 U JP 18727485U JP H056666 Y2 JPH056666 Y2 JP H056666Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- lead
- sealed semiconductor
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 48
- 239000008188 pellet Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 description 14
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 238000007789 sealing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18727485U JPH056666Y2 (sl) | 1985-12-06 | 1985-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18727485U JPH056666Y2 (sl) | 1985-12-06 | 1985-12-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6296859U JPS6296859U (sl) | 1987-06-20 |
| JPH056666Y2 true JPH056666Y2 (sl) | 1993-02-19 |
Family
ID=31137604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18727485U Expired - Lifetime JPH056666Y2 (sl) | 1985-12-06 | 1985-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056666Y2 (sl) |
-
1985
- 1985-12-06 JP JP18727485U patent/JPH056666Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6296859U (sl) | 1987-06-20 |
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