JPH0566025B2 - - Google Patents

Info

Publication number
JPH0566025B2
JPH0566025B2 JP58072896A JP7289683A JPH0566025B2 JP H0566025 B2 JPH0566025 B2 JP H0566025B2 JP 58072896 A JP58072896 A JP 58072896A JP 7289683 A JP7289683 A JP 7289683A JP H0566025 B2 JPH0566025 B2 JP H0566025B2
Authority
JP
Japan
Prior art keywords
cooling
chip
module according
chip module
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58072896A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59200495A (ja
Inventor
Minoru Yamada
Akira Masaki
Masakazu Yamamoto
Keiichiro Nakanishi
Takashi Nishida
Takahiro Ooguro
Fumyuki Kobayashi
Kuninori Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58072896A priority Critical patent/JPS59200495A/ja
Priority to US06/604,003 priority patent/US4558395A/en
Publication of JPS59200495A publication Critical patent/JPS59200495A/ja
Publication of JPH0566025B2 publication Critical patent/JPH0566025B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP58072896A 1983-04-27 1983-04-27 マルチチツプ・モジユ−ル Granted JPS59200495A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58072896A JPS59200495A (ja) 1983-04-27 1983-04-27 マルチチツプ・モジユ−ル
US06/604,003 US4558395A (en) 1983-04-27 1984-04-26 Cooling module for integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58072896A JPS59200495A (ja) 1983-04-27 1983-04-27 マルチチツプ・モジユ−ル

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP17225194A Division JPH0750375A (ja) 1994-07-25 1994-07-25 冷却装置

Publications (2)

Publication Number Publication Date
JPS59200495A JPS59200495A (ja) 1984-11-13
JPH0566025B2 true JPH0566025B2 (en, 2012) 1993-09-20

Family

ID=13502570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58072896A Granted JPS59200495A (ja) 1983-04-27 1983-04-27 マルチチツプ・モジユ−ル

Country Status (2)

Country Link
US (1) US4558395A (en, 2012)
JP (1) JPS59200495A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07278937A (ja) * 1994-03-30 1995-10-24 Miyuki Kawashima 帽 子

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
JPH06101523B2 (ja) * 1985-03-04 1994-12-12 株式会社日立製作所 集積回路チツプ冷却装置
US4759403A (en) * 1986-04-30 1988-07-26 International Business Machines Corp. Hydraulic manifold for water cooling of multi-chip electric modules
JPH0797617B2 (ja) * 1986-05-23 1995-10-18 株式会社日立製作所 冷媒漏洩防止装置
EP0290497B1 (en) * 1986-10-14 1993-03-17 Unisys Corporation Liquid cooling system for integrated circuits
JPS6436057A (en) * 1987-07-31 1989-02-07 Fujitsu Ltd Cooling mechanism of electronic apparatus
US4791983A (en) * 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly
JP2786193B2 (ja) * 1987-10-26 1998-08-13 株式会社日立製作所 半導体冷却装置
DE3853197T2 (de) * 1987-12-07 1995-06-29 Nippon Electric Co Kühlungssystem für integrierte Schaltungspackung.
JPH0642388Y2 (ja) * 1988-03-15 1994-11-02 日本電気株式会社 マルチチップ・パッケージ
US4809134A (en) * 1988-04-18 1989-02-28 Unisys Corporation Low stress liquid cooling assembly
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component
US4909315A (en) * 1988-09-30 1990-03-20 Microelectronics And Computer Technology Corporation Fluid heat exchanger for an electronic component
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
DE4008425A1 (de) * 1990-03-16 1991-09-19 Asea Brown Boveri Stromrichtermodul
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
JP2724033B2 (ja) * 1990-07-11 1998-03-09 株式会社日立製作所 半導体モジユール
JP3000307B2 (ja) * 1991-08-28 2000-01-17 株式会社日立製作所 冷却装置付き半導体装置およびその製造方法
DE69321501T2 (de) * 1992-02-10 1999-03-04 Nec Corp., Tokio/Tokyo Kühlvorrichtung für Bauteile mit elektronischen Schaltungen
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5436793A (en) * 1993-03-31 1995-07-25 Ncr Corporation Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
EP0709885A3 (en) 1994-10-31 1997-08-27 At & T Corp Assembly with integrated, closed cooling circuit system
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
US5920457A (en) * 1996-09-25 1999-07-06 International Business Machines Corporation Apparatus for cooling electronic devices using a flexible coolant conduit
US6108208A (en) * 1997-12-08 2000-08-22 Unisys Corporation Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US7147045B2 (en) * 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US6246582B1 (en) 1998-12-30 2001-06-12 Honeywell Inc. Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
US6212075B1 (en) 1998-12-30 2001-04-03 Honeywell Inc. Adapter kit to allow extended width wedgelock for use in a circuit card module
US6246583B1 (en) 1999-03-04 2001-06-12 International Business Machines Corporation Method and apparatus for removing heat from a semiconductor device
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US7305843B2 (en) * 1999-06-08 2007-12-11 Thermotek, Inc. Heat pipe connection system and method
US6222264B1 (en) 1999-10-15 2001-04-24 Dell Usa, L.P. Cooling apparatus for an electronic package
JP2001244391A (ja) * 1999-12-21 2001-09-07 Toyota Central Res & Dev Lab Inc マルチチップモジュールの冷却構造
US6462949B1 (en) 2000-08-07 2002-10-08 Thermotek, Inc. Electronic enclosure cooling system
US6397931B1 (en) * 2001-02-27 2002-06-04 The United States Of America As Represented By The Secretary Of The Air Force Finned heat exchanger
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US7133907B2 (en) 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US7198096B2 (en) 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US6834712B2 (en) * 2001-11-27 2004-12-28 Thermotek, Inc. Stacked low profile cooling system and method for making same
US6819561B2 (en) * 2002-02-22 2004-11-16 Satcon Technology Corporation Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US7143615B2 (en) 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
EP1543244A1 (de) * 2002-09-28 2005-06-22 ebm-papst St. Georgen GmbH & Co. KG Anordnung und verfahren zur w rmeabfuhr von einem zu k hlenden bauteil
US6945054B1 (en) 2002-10-04 2005-09-20 Richard S. Norman Method and apparatus for cooling microelectronic complexes including multiple discrete functional modules
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
JP2005229030A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 液冷システムを備えた電子機器
US20050213306A1 (en) * 2004-03-25 2005-09-29 Lockheed Martin Corporation Environmental control method and apparatus for electronic device enclosures
US20050241803A1 (en) * 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation
JP4551261B2 (ja) * 2005-04-01 2010-09-22 株式会社日立製作所 冷却ジャケット
US7515418B2 (en) * 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US8537540B2 (en) 2010-11-02 2013-09-17 Technology Advancement Group, Inc. Field serviceable CPU module
US10297572B2 (en) * 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
US10375863B2 (en) * 2017-11-28 2019-08-06 Dell Products, L.P. Liquid cooled chassis
US10856446B2 (en) * 2018-02-08 2020-12-01 Juniper Networks, Inc. Cooling for slot mounted electrical modules
US11934213B2 (en) * 2021-02-18 2024-03-19 Asia Vital Components (China) Co., Ltd. Liquid-cooling device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07278937A (ja) * 1994-03-30 1995-10-24 Miyuki Kawashima 帽 子

Also Published As

Publication number Publication date
US4558395A (en) 1985-12-10
JPS59200495A (ja) 1984-11-13

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