JPH0566014B2 - - Google Patents
Info
- Publication number
- JPH0566014B2 JPH0566014B2 JP58077076A JP7707683A JPH0566014B2 JP H0566014 B2 JPH0566014 B2 JP H0566014B2 JP 58077076 A JP58077076 A JP 58077076A JP 7707683 A JP7707683 A JP 7707683A JP H0566014 B2 JPH0566014 B2 JP H0566014B2
- Authority
- JP
- Japan
- Prior art keywords
- arm
- rotating block
- chip
- mounting table
- lever
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7707683A JPS59202645A (ja) | 1983-04-30 | 1983-04-30 | チツプオリエンタ− |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7707683A JPS59202645A (ja) | 1983-04-30 | 1983-04-30 | チツプオリエンタ− |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59202645A JPS59202645A (ja) | 1984-11-16 |
JPH0566014B2 true JPH0566014B2 (enrdf_load_stackoverflow) | 1993-09-20 |
Family
ID=13623690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7707683A Granted JPS59202645A (ja) | 1983-04-30 | 1983-04-30 | チツプオリエンタ− |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59202645A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07114233B2 (ja) * | 1992-04-01 | 1995-12-06 | 株式会社ニコン | 基板の位置決め装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5820844B2 (ja) * | 1978-09-16 | 1983-04-26 | 新明和工業株式会社 | コンパクタ・コンテナ式塵芥処理システムにおけるコンテナ移送装置 |
JPS5681940A (en) * | 1979-12-10 | 1981-07-04 | Hitachi Ltd | Pellet bonding device |
JPS57147243A (en) * | 1981-03-06 | 1982-09-11 | Toshiba Seiki Kk | Positioning device for semiconductor pellet |
-
1983
- 1983-04-30 JP JP7707683A patent/JPS59202645A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59202645A (ja) | 1984-11-16 |
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