JPH0565589B2 - - Google Patents
Info
- Publication number
- JPH0565589B2 JPH0565589B2 JP10051884A JP10051884A JPH0565589B2 JP H0565589 B2 JPH0565589 B2 JP H0565589B2 JP 10051884 A JP10051884 A JP 10051884A JP 10051884 A JP10051884 A JP 10051884A JP H0565589 B2 JPH0565589 B2 JP H0565589B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- heaters
- substrate electrode
- temperature detection
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 55
- 238000001514 detection method Methods 0.000 claims description 18
- 239000010409 thin film Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 239000002826 coolant Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 16
- 239000000112 cooling gas Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 10
- 239000012495 reaction gas Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10051884A JPS60245778A (ja) | 1984-05-21 | 1984-05-21 | 薄膜形成装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10051884A JPS60245778A (ja) | 1984-05-21 | 1984-05-21 | 薄膜形成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60245778A JPS60245778A (ja) | 1985-12-05 |
JPH0565589B2 true JPH0565589B2 (enrdf_load_html_response) | 1993-09-20 |
Family
ID=14276170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10051884A Granted JPS60245778A (ja) | 1984-05-21 | 1984-05-21 | 薄膜形成装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60245778A (enrdf_load_html_response) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2646861B1 (fr) * | 1989-05-09 | 1991-07-26 | Philips Nv | Appareil de traitement de substrats plans sous vide partiel |
US5177878A (en) * | 1989-05-08 | 1993-01-12 | U.S. Philips Corporation | Apparatus and method for treating flat substrate under reduced pressure in the manufacture of electronic devices |
JPH09157846A (ja) * | 1995-12-01 | 1997-06-17 | Teisan Kk | 温度調節装置 |
US6706541B1 (en) * | 1999-10-20 | 2004-03-16 | Advanced Micro Devices, Inc. | Method and apparatus for controlling wafer uniformity using spatially resolved sensors |
-
1984
- 1984-05-21 JP JP10051884A patent/JPS60245778A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60245778A (ja) | 1985-12-05 |
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