JPH056490B2 - - Google Patents

Info

Publication number
JPH056490B2
JPH056490B2 JP400486A JP400486A JPH056490B2 JP H056490 B2 JPH056490 B2 JP H056490B2 JP 400486 A JP400486 A JP 400486A JP 400486 A JP400486 A JP 400486A JP H056490 B2 JPH056490 B2 JP H056490B2
Authority
JP
Japan
Prior art keywords
temperature
mold
liquid
pipe
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP400486A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62161512A (ja
Inventor
Isao Kaneoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OOSAKA REIKEN KK
Original Assignee
OOSAKA REIKEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OOSAKA REIKEN KK filed Critical OOSAKA REIKEN KK
Priority to JP400486A priority Critical patent/JPS62161512A/ja
Publication of JPS62161512A publication Critical patent/JPS62161512A/ja
Publication of JPH056490B2 publication Critical patent/JPH056490B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0288Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process
    • B29C35/0294Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process using tempering units for temperature control of moulds or cores

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP400486A 1986-01-10 1986-01-10 金型温度調節機 Granted JPS62161512A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP400486A JPS62161512A (ja) 1986-01-10 1986-01-10 金型温度調節機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP400486A JPS62161512A (ja) 1986-01-10 1986-01-10 金型温度調節機

Publications (2)

Publication Number Publication Date
JPS62161512A JPS62161512A (ja) 1987-07-17
JPH056490B2 true JPH056490B2 (de) 1993-01-26

Family

ID=11572841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP400486A Granted JPS62161512A (ja) 1986-01-10 1986-01-10 金型温度調節機

Country Status (1)

Country Link
JP (1) JPS62161512A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8318061B2 (en) 2008-11-06 2012-11-27 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Mold temperature control circuit of injection molding device and method for discharging heating medium
US9011750B2 (en) 2010-04-21 2015-04-21 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Injection molding device and method for discharging heat medium for injection molding device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100424091B1 (ko) * 2001-04-12 2004-03-26 김동학 금형의 온도제어 장치
CN103991202A (zh) * 2014-04-29 2014-08-20 成都龙泉鑫锐模具塑料厂 一种热能回收式注塑模具的温度调节方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8318061B2 (en) 2008-11-06 2012-11-27 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Mold temperature control circuit of injection molding device and method for discharging heating medium
US9011750B2 (en) 2010-04-21 2015-04-21 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Injection molding device and method for discharging heat medium for injection molding device

Also Published As

Publication number Publication date
JPS62161512A (ja) 1987-07-17

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