JPH056490B2 - - Google Patents

Info

Publication number
JPH056490B2
JPH056490B2 JP400486A JP400486A JPH056490B2 JP H056490 B2 JPH056490 B2 JP H056490B2 JP 400486 A JP400486 A JP 400486A JP 400486 A JP400486 A JP 400486A JP H056490 B2 JPH056490 B2 JP H056490B2
Authority
JP
Japan
Prior art keywords
temperature
mold
liquid
pipe
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP400486A
Other languages
Japanese (ja)
Other versions
JPS62161512A (en
Inventor
Isao Kaneoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OOSAKA REIKEN KK
Original Assignee
OOSAKA REIKEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OOSAKA REIKEN KK filed Critical OOSAKA REIKEN KK
Priority to JP400486A priority Critical patent/JPS62161512A/en
Publication of JPS62161512A publication Critical patent/JPS62161512A/en
Publication of JPH056490B2 publication Critical patent/JPH056490B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0288Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process
    • B29C35/0294Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process using tempering units for temperature control of moulds or cores

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、プラスチツク成形加工時における金
型の温度を一定に保ち、成形条件と成形品の品質
を安定させるために用いる金型温度調節機に関す
るものである。
Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a mold temperature controller used to keep the temperature of a mold constant during plastic molding processing and to stabilize molding conditions and quality of molded products. It is related to.

[従来技術とその問題点] 最近においては、金型を用いたプラスチツク成
形加工が盛んであり、この成形時における金型温
度は、成形品の品質および成形能率に及ぼす影響
が非常に大きい。したがつて、金型を所定温度に
十分よく調節することは極めて重要である。
[Prior art and its problems] Recently, plastic molding using a mold has become popular, and the mold temperature during molding has a very large effect on the quality of the molded product and the molding efficiency. Therefore, it is extremely important that the mold is well-adjusted to the predetermined temperature.

このため、金型内の冷却穴に適当な温度に調節
した液体を強制循環させることにより、金型温度
を調節可能にした金型温度調節機が使用されてい
る。
For this reason, a mold temperature controller is used that can adjust the mold temperature by forcibly circulating a liquid adjusted to an appropriate temperature through cooling holes in the mold.

この金型温度調節機の構造は、第4図に示すよ
うに、熱媒循環ポンプ1と循環液体を加熱する電
熱線ヒータ2とからなつており、配管3内を循環
液体が、図中矢印方向に示すように、ポンプ1か
らヒータ2、ヒータ2から金型4、金型4からポ
ンプ1の順に循環されるように構成されている。
前記金型4からポンプ1間の配管3aには、冷却
液体を給入するため流入管5と循環液体の排出管
6とが接続され、この流入管5がポンプ1に近い
側に配されている。
As shown in Fig. 4, the structure of this mold temperature controller consists of a heat medium circulation pump 1 and an electric wire heater 2 that heats the circulating liquid. As shown in the direction, it is configured to circulate in the order from the pump 1 to the heater 2, from the heater 2 to the mold 4, and from the mold 4 to the pump 1.
An inflow pipe 5 for supplying cooling liquid and a discharge pipe 6 for circulating liquid are connected to the pipe 3a between the mold 4 and the pump 1, and the inflow pipe 5 is arranged on the side closer to the pump 1. There is.

このような金型温度調節機によつて、金型温度
をX℃に設定した場合、第5図に示すように、潤
滑液体の温度がX℃ラインで一定とならず上下に
振れて波形状となる。
When the mold temperature is set to X°C using such a mold temperature controller, the temperature of the lubricating liquid is not constant on the X°C line, but fluctuates up and down, creating a wave shape, as shown in Figure 5. becomes.

これは、配管3内を通る循環液体をヒータ2に
より加熱したり、流入管5から冷却液体を給入し
たりすることにより、循環液体の温度を調節し
て、金型温度を一定に保つようにしているためで
ある。
This is done by heating the circulating liquid passing through the piping 3 with the heater 2 or by supplying cooling liquid from the inflow pipe 5, thereby adjusting the temperature of the circulating liquid and keeping the mold temperature constant. This is because they are doing so.

すなわち、ヒータ2から金型4間の配管3b内
に設けた温調計7が液温X℃を感知するとヒータ
2が切れるが、このとき、図示の如くオーバーシ
ユートした状態となる。そして、液温がX℃を所
定温度上回ると配管3内に流入管5から冷却液体
が給入され、液温を下げ、温調計7がX℃で感知
して冷却液体の給入が止められる。そして、循環
液体の温度は下がりX℃ラインを下回り、温調計
7がそれを感知してヒータ2を入れる。この繰返
しにより、第5図に示すように液温は波形状の曲
線に示すように変動する。
That is, when the temperature controller 7 provided in the pipe 3b between the heater 2 and the mold 4 senses the liquid temperature X°C, the heater 2 is turned off, but at this time, the heater 2 is in an overshot state as shown in the figure. When the liquid temperature exceeds a predetermined temperature of X°C, cooling liquid is supplied into the pipe 3 from the inflow pipe 5 to lower the liquid temperature, and the temperature controller 7 senses the temperature at X°C, and the supply of cooling liquid is stopped. It will be done. Then, the temperature of the circulating liquid falls below the X°C line, and the temperature controller 7 senses this and turns on the heater 2. By repeating this process, the liquid temperature fluctuates as shown in a wave-shaped curve as shown in FIG.

また、金型温度X℃に設定した状態から設定温
度をY℃に下げる場合には、第6図に示すよう
に、X℃ラインから急激に下がり、Y℃ラインで
かなりの振幅で変動し、前記X℃ラインと同様の
波形状の曲線となる。
In addition, when lowering the set temperature from the mold temperature set at X°C to Y°C, as shown in Figure 6, it drops rapidly from the X°C line and fluctuates with a considerable amplitude at the Y°C line. It becomes a wavy curve similar to the above-mentioned X°C line.

これは、ほぼ液温X℃の状態の配管3内に、流
入管5から冷却液体が吸入され、このとき、冷却
液体と循環液体との温度差が大きいため、配管3
内の液温が急激に下がり、温調計7が液温Y℃を
感知すると冷却液体の給入が止められるが、図示
の如くかなりオーバーシユートした状態となる。
このように、液温がY℃に近づいた状態では、振
幅がかなり大きく、そして、前記と同様に、配管
3内の循環液体をヒータ2により加熱したり、流
入管5から冷却液体を給入したりすることによ
り、前記X℃ラインと同様の波形状の曲線とな
る。
This is because the cooling liquid is sucked into the pipe 3 from the inflow pipe 5 when the liquid temperature is approximately X°C, and at this time, there is a large temperature difference between the cooling liquid and the circulating liquid.
When the temperature of the liquid in the tank suddenly drops and the temperature controller 7 detects a liquid temperature of Y° C., the supply of cooling liquid is stopped, but as shown in the figure, the state is considerably overshot.
In this way, when the liquid temperature approaches Y°C, the amplitude is quite large, and as described above, the circulating liquid in the pipe 3 is heated by the heater 2, or the cooling liquid is supplied from the inflow pipe 5. By doing so, a wavy curve similar to the above-mentioned X°C line is obtained.

本発明の目的としては、金型温度の変動を小さ
くすることであり、すなわち、図面に示す温度の
振幅を小さくして、できるだけ設定温度の直線に
近づけることである。また、この金型温度調節機
の配管内から排出する循環液体の温度を下げるこ
とである。これは、配管3内の液温を下げるため
に、流入管5から冷却液体を給入する際、その給
入分だけ配管3内から循環液体を提出する必要が
あり、この循環液体がかなり高温で、そのまま排
出することが危険であるとともに、冷却液体系の
機械に悪影響を及ぼす等の不都合があり、このた
め、循環液体の温度を下げて排出することが好ま
しい。
The purpose of the present invention is to reduce fluctuations in mold temperature, that is, to reduce the amplitude of the temperature shown in the drawings and to bring it as close to the set temperature straight line as possible. Another purpose is to lower the temperature of the circulating liquid discharged from the pipes of this mold temperature controller. This is because when supplying cooling liquid from the inflow pipe 5 to lower the temperature of the liquid in the pipe 3, it is necessary to supply circulating liquid from the pipe 3 by the amount that has been supplied, and this circulating liquid has a considerably high temperature. Therefore, it is dangerous to discharge the circulating liquid as it is, and there are also disadvantages such as having an adverse effect on the cooling liquid system machines.For this reason, it is preferable to lower the temperature of the circulating liquid before discharging it.

[問題点を解決するための手段] 本発明は、配管内を循環液体が、ポンプからヒ
ータ、ヒータから金型、金型からポンプの順に循
環するように構成された金型温度調節機におい
て、前記金型からポンプ間の配管に、冷却液体の
流入管と循環液体の排出管とを接続し、ポンプに
近い側に前記流入管を配し、前記流入管と排出管
とがそれぞれ熱交換器内を通るように配すること
により、上記の問題点を解決するものである。
[Means for Solving the Problems] The present invention provides a mold temperature controller configured such that a circulating liquid circulates in piping in the order from the pump to the heater, from the heater to the mold, and from the mold to the pump. An inflow pipe for cooling liquid and a discharge pipe for circulating liquid are connected to the pipe between the mold and the pump, the inflow pipe is arranged on the side closer to the pump, and the inflow pipe and the discharge pipe are connected to a heat exchanger, respectively. By arranging it so that it passes through the inside, the above problem is solved.

[作用] 本発明に係る金型温度調節機は、流入管と排出
管とがそれぞれ熱交換器内を通るように配されて
いるので、熱交換器の内部において、冷却液体は
排出する循環液体の熱により加熱されて循環液体
の温度に近づいて給入され、逆に排出する循環液
体は冷却液体により冷却されて、冷却液体に近づ
いた温度に下げて排出され、冷却液体と循環液体
との温度差が小さくなる。
[Function] In the mold temperature controller according to the present invention, the inflow pipe and the discharge pipe are arranged so as to pass through the inside of the heat exchanger, so that the cooling liquid is circulated within the heat exchanger to be discharged. The circulating liquid is heated by the heat of the cooling liquid, approaches the temperature of the circulating liquid, and is supplied, and conversely, the circulating liquid that is discharged is cooled by the cooling liquid, and is discharged after being lowered to a temperature close to that of the cooling liquid. The temperature difference becomes smaller.

[実施例] 以下に本発明の一実施例を第1図〜第3図に基
づいて説明する。
[Example] An example of the present invention will be described below based on FIGS. 1 to 3.

この金型温度調節機10は、配管12内を循環
液体が、第1図の矢印方向に示すように、ポンプ
14からヒータ16、ヒータ16から金型18、
金型18からポンプ14の順に循環するように構
成され、前記金型からポンプ間の配管12aに、
冷却液体の流入管20と循環液体の排出管22と
を接続し、ポンプ14に近い側に前記流入管20
を配し、これら流入管20と排出管22とがそれ
ぞれ熱交換器24内を通るように配されている。
In this mold temperature controller 10, a liquid circulates in a pipe 12 from a pump 14 to a heater 16, from the heater 16 to a mold 18, as shown in the arrow direction in FIG.
It is configured to circulate in the order from the mold 18 to the pump 14, and a pipe 12a between the mold and the pump,
The cooling liquid inflow pipe 20 and the circulating liquid discharge pipe 22 are connected, and the inflow pipe 20 is connected to the side near the pump 14.
The inflow pipe 20 and the discharge pipe 22 are arranged so as to pass through the inside of the heat exchanger 24, respectively.

この金型温度調節機10の使用状態を説明する
と、金型温度をX℃に設定した場合、ヒータから
金型間の配管12bに設けられた温調計26が液
温X℃を感知するとヒータ16が切れ、このと
き、第2図に示すようにオーバーシユートした状
態となる。
To explain how this mold temperature controller 10 is used, when the mold temperature is set at X°C, when the temperature controller 26 installed in the pipe 12b between the heater and the mold detects the liquid temperature X°C, the heater 16 is cut off, and at this time, an overshot state occurs as shown in FIG.

そして、液温がX℃が若干上回ると配管12内
に熱交換器24を通つた流入管20から冷却液体
が給入され、液温を下げ、温調計26がX℃を感
知して冷却液体の給入が止められる。このとき、
冷却液体を配管12内に入れた分だけ配管12内
の循環液体を排出する必要があり、排出管22か
らこの排出される配管12内の循環液体が熱交換
器24内を通り金型温度調節機10の外部に排出
される。
When the liquid temperature slightly exceeds X°C, cooling liquid is supplied into the pipe 12 from the inflow pipe 20 passing through the heat exchanger 24 to lower the liquid temperature, and the temperature controller 26 detects X°C and cools the liquid. Liquid supply is stopped. At this time,
It is necessary to discharge the circulating liquid in the piping 12 by the amount of cooling liquid put into the piping 12, and the circulating liquid in the piping 12 discharged from the discharge pipe 22 passes through the heat exchanger 24 to adjust the mold temperature. It is discharged to the outside of the machine 10.

この熱交換器24内には、冷却液体と排出され
る循環液体とが連通するため、冷却液体は排出す
る循環液体の熱により加熱され、逆に排出する循
環液体は冷却液体により冷却され、冷却液体と配
管12内の循環液体との温度差が小さくなり、ま
た、排出される循環液体の温度が下げられる。
In this heat exchanger 24, the cooling liquid and the circulating liquid to be discharged communicate with each other, so that the cooling liquid is heated by the heat of the circulating liquid to be discharged, and conversely, the circulating liquid to be discharged is cooled by the cooling liquid, and the circulating liquid to be discharged is cooled. The temperature difference between the liquid and the circulating liquid in the pipe 12 is reduced, and the temperature of the circulating liquid to be discharged is lowered.

そして、循環液体の温度は下がりX℃ラインを
下回り、温調計26がそれを感知してヒータ16
を入れる。この繰返しにより、金型18の温度を
調節する。この場合、熱交換器24によつて、冷
却液体と配管12内の循環液体との温度差が小さ
いので、第2図に示すように液温は緩やかな波形
状の曲線に示すように変動し、振幅が小さく、金
型18の好適な温度調節を行なうことができる。
Then, the temperature of the circulating liquid falls below the X°C line, and the temperature controller 26 senses this, and the heater 16
Put in. By repeating this process, the temperature of the mold 18 is adjusted. In this case, since the temperature difference between the cooling liquid and the circulating liquid in the pipe 12 is small due to the heat exchanger 24, the liquid temperature fluctuates as shown in the gentle wave-shaped curve as shown in FIG. , the amplitude is small, and the temperature of the mold 18 can be suitably controlled.

次に、金型温度X℃に設定した状態から設定温
度をY℃に下げる場合には、ほぼ液温X℃の状態
の配管12内に、流入管20からかなりの量の冷
却液体を給入し、配管12内の液温を下げ、温調
計26が液温Y℃を感知すると冷却液体の給水を
止める。このとき、第3図に示すように、X℃ラ
インからY℃ラインまで下がり、少しオーバーシ
ユートした状態となる。そして、前記X℃ライン
と同様の緩やかな波形状の曲線となる。
Next, when lowering the set temperature from the mold temperature set at X°C to Y°C, a considerable amount of cooling liquid is supplied from the inlet pipe 20 into the pipe 12 where the liquid temperature is approximately X°C. Then, the temperature of the liquid in the pipe 12 is lowered, and when the temperature controller 26 senses the liquid temperature Y°C, the supply of cooling liquid is stopped. At this time, as shown in FIG. 3, the temperature drops from the X°C line to the Y°C line, resulting in a slight overshoot state. Then, it becomes a gentle wavy curve similar to the above-mentioned X°C line.

このように、オーバーシユートした状態が小さ
く、振幅が小さく緩やかな波形状の曲線となるの
は、冷却液体と排出する循環液体が熱交換器24
内で熱交換されて、冷却液体と配管12内の循環
液体との温度差が小さくされているためである。
In this way, the overshot state is small, the amplitude is small, and the waveform curve is gentle because the cooling liquid and the circulating liquid to be discharged are connected to the heat exchanger 24.
This is because the temperature difference between the cooling liquid and the circulating liquid in the pipe 12 is reduced by heat exchange within the pipe 12.

前記循環液体としては、どこにでもあり管理し
易い水が最適であるが、水の場合、大気圧で100
℃を超えて加熱するとキヤビテーシヨンを起し、
ポンプ14が空回りして、ポンプ14に悪影響を
及ぼしてしまう。特に、本発明の金型温度調節機
10の仕様が、水を用いて金型温度を100℃を超
えて設定可能とする場合等には、配管12内を加
圧してキヤビテーシヨンを起さないようにする必
要がある。このため、第1図に示すように、ポン
プ14の吸入側と吐出側に圧力検出計28,28
を設置して配管12内の圧力を制御している。
The most suitable circulating liquid is water, which is ubiquitous and easy to manage.
Heating above ℃ will cause cavitation,
The pump 14 runs idly, which adversely affects the pump 14. In particular, when the specifications of the mold temperature controller 10 of the present invention are such that the mold temperature can be set above 100°C using water, the inside of the pipe 12 is pressurized to prevent cavitation. It is necessary to For this reason, as shown in FIG.
is installed to control the pressure inside the pipe 12.

排出管22には、バルブ32が取り付けられ、
循環液体を排出すると同時に、その排出された量
だけ流入管20から冷却液体が吸入されるように
なつている。さらに、金型からポンプ間の配管1
2aとヒータから金型間の配管12bとには、リ
リーフ弁34を有するバイパス管36が取り付け
られ、金型18内の循環液体の流速が遅くなつた
場合、ポンプ14の吐出側の圧力が高くなり、ポ
ンプ14に悪影響を及ぼすので、このリリーフ弁
34が開いて、循環液体を金型18を通さずに循
環させるようにしている。
A valve 32 is attached to the discharge pipe 22,
At the same time as the circulating liquid is discharged, the amount of cooling liquid that has been discharged is sucked in from the inlet pipe 20. Furthermore, piping 1 between the mold and the pump
A bypass pipe 36 having a relief valve 34 is attached to the pipe 12b between the heater and the mold 2a, so that when the flow rate of the circulating liquid in the mold 18 becomes slow, the pressure on the discharge side of the pump 14 becomes high. This has an adverse effect on the pump 14, so the relief valve 34 is opened to allow the circulating liquid to circulate without passing through the mold 18.

なお、ポンプ14、ヒータ16および熱交換器
24は、型式や大きさ等、特に限定するものでな
く、手頃なものを使用すればよい。
Note that the pump 14, heater 16, and heat exchanger 24 are not particularly limited in type or size, and any convenient ones may be used.

[発明の効果] 本発明に係る金型温度調節機は、上記の記載か
ら明らかなように、流入管と排出管とがそれぞれ
熱交換器内を通り、その内部において、冷却液体
は排出する循環液体の熱により加熱され、逆に排
出する循環液体は冷却液体により冷却されて、冷
却液体と循環液体との温度差が小さくなるように
なつているため、従来のものに比べ、第2図およ
び第3図に示すように、液温は緩やかな波形状の
曲線で振幅が小さく、また、オーバーシユートし
た状態における振幅も小さい。
[Effects of the Invention] As is clear from the above description, the mold temperature controller according to the present invention has a circulation system in which the inflow pipe and the discharge pipe each pass through a heat exchanger, and the cooling liquid is discharged inside the heat exchanger. The circulating liquid that is heated by the heat of the liquid and conversely discharged is cooled by the cooling liquid, so that the temperature difference between the cooling liquid and the circulating liquid becomes smaller. As shown in FIG. 3, the liquid temperature has a gentle waveform curve with a small amplitude, and the amplitude in an overshot state is also small.

したがつて、金型温度の変動が小さく、金型温
度調節機から排出する循環液体の温度を下げるこ
とができ、金型の好適な温度調節を行なうことが
できる。
Therefore, fluctuations in mold temperature are small, the temperature of the circulating liquid discharged from the mold temperature controller can be lowered, and the mold temperature can be suitably controlled.

このように、金型を所定温度に十分よく調節す
ることができるので、成形品の品質および成形能
率を向上することができる。
In this way, the mold can be sufficiently adjusted to a predetermined temperature, so that the quality of the molded product and the molding efficiency can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明に係る金型温度調節機の構成
を示す概略図、第2図は、金型温度をX℃に設定
した状態の本発明に係る金型温度調節機内の循環
液体の温度変化を示すグラフ、第3図は、金型温
度をX℃からY℃に下げた状態の前図と同様のグ
ラフ、第4図は、従来の金型温度調節機の構成を
示す概略図、第5図は、金型温度をX℃に設定し
た状態の従来の金型温度調節機内の循環液体の温
度変化を示すグラフ、第6図は、金型温度をX℃
からY℃に下げた状態の前図と同様のグラフであ
る。 符号の説明、10……金型温度調節機、12…
…配管、12a……金型からポンプ間の配管、1
2b……ヒータから金型間の配管、14……ポン
プ、16……ヒータ、18……金型、20……流
入管、22……排出管、24……熱交換器、26
……温調計、28……圧力検出計、32……バル
ブ、34……リリーフ弁、36……バイパス管。
FIG. 1 is a schematic diagram showing the configuration of the mold temperature controller according to the present invention, and FIG. 2 is a diagram showing the circulating liquid in the mold temperature controller according to the present invention with the mold temperature set at X°C. A graph showing temperature changes. Figure 3 is a graph similar to the previous figure when the mold temperature has been lowered from X°C to Y°C. Figure 4 is a schematic diagram showing the configuration of a conventional mold temperature controller. , Fig. 5 is a graph showing the temperature change of the circulating liquid in a conventional mold temperature controller when the mold temperature is set to
This is a graph similar to the previous figure when the temperature was lowered from 0 to Y°C. Explanation of symbols, 10... Mold temperature controller, 12...
...Piping, 12a...Piping between the mold and the pump, 1
2b... Piping between the heater and the mold, 14... Pump, 16... Heater, 18... Mold, 20... Inflow pipe, 22... Outlet pipe, 24... Heat exchanger, 26
... Temperature controller, 28 ... Pressure detector, 32 ... Valve, 34 ... Relief valve, 36 ... Bypass pipe.

Claims (1)

【特許請求の範囲】[Claims] 1 配管内を循環液体が、ポンプからヒータ、ヒ
ータから金型、金型からポンプの順に循環するよ
うに構成された金型温度調節機において、前記金
型からポンプ間の配管に、冷却液体の流入管と循
環液体の排出管とを接続し、ポンプに近い側に前
記流入管を配し、前記流入管と排出管とがそれぞ
れ熱交換器内を通るように配されてなることを特
徴とする金型温度調節機。
1 In a mold temperature controller configured so that a circulating liquid circulates in the piping in the order of pump to heater, heater to mold, and mold to pump, cooling liquid is supplied to the piping between the mold and the pump. An inflow pipe and a discharge pipe for the circulating liquid are connected, the inflow pipe is arranged on the side closer to the pump, and the inflow pipe and the discharge pipe are respectively arranged to pass inside the heat exchanger. mold temperature controller.
JP400486A 1986-01-10 1986-01-10 Mold temp. controlling system Granted JPS62161512A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP400486A JPS62161512A (en) 1986-01-10 1986-01-10 Mold temp. controlling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP400486A JPS62161512A (en) 1986-01-10 1986-01-10 Mold temp. controlling system

Publications (2)

Publication Number Publication Date
JPS62161512A JPS62161512A (en) 1987-07-17
JPH056490B2 true JPH056490B2 (en) 1993-01-26

Family

ID=11572841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP400486A Granted JPS62161512A (en) 1986-01-10 1986-01-10 Mold temp. controlling system

Country Status (1)

Country Link
JP (1) JPS62161512A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8318061B2 (en) 2008-11-06 2012-11-27 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Mold temperature control circuit of injection molding device and method for discharging heating medium
US9011750B2 (en) 2010-04-21 2015-04-21 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Injection molding device and method for discharging heat medium for injection molding device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100424091B1 (en) * 2001-04-12 2004-03-26 김동학 Thermal Control Apparatus of Mold
CN103991202A (en) * 2014-04-29 2014-08-20 成都龙泉鑫锐模具塑料厂 Temperature adjusting method of heat energy recovery type injection mold

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8318061B2 (en) 2008-11-06 2012-11-27 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Mold temperature control circuit of injection molding device and method for discharging heating medium
US9011750B2 (en) 2010-04-21 2015-04-21 Mitsubishi Heavy Industries Plastic Technology Co., Ltd. Injection molding device and method for discharging heat medium for injection molding device

Also Published As

Publication number Publication date
JPS62161512A (en) 1987-07-17

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