JPH0564858B2 - - Google Patents
Info
- Publication number
- JPH0564858B2 JPH0564858B2 JP8250885A JP8250885A JPH0564858B2 JP H0564858 B2 JPH0564858 B2 JP H0564858B2 JP 8250885 A JP8250885 A JP 8250885A JP 8250885 A JP8250885 A JP 8250885A JP H0564858 B2 JPH0564858 B2 JP H0564858B2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- lead frame
- lead
- etched
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 31
- 238000005530 etching Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000000465 moulding Methods 0.000 description 10
- 210000003323 beak Anatomy 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8250885A JPS61241957A (ja) | 1985-04-19 | 1985-04-19 | リードフレームの製造方法およびリードフレームを用いた半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8250885A JPS61241957A (ja) | 1985-04-19 | 1985-04-19 | リードフレームの製造方法およびリードフレームを用いた半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61241957A JPS61241957A (ja) | 1986-10-28 |
| JPH0564858B2 true JPH0564858B2 (enrdf_load_stackoverflow) | 1993-09-16 |
Family
ID=13776450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8250885A Granted JPS61241957A (ja) | 1985-04-19 | 1985-04-19 | リードフレームの製造方法およびリードフレームを用いた半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61241957A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62200750A (ja) * | 1986-02-28 | 1987-09-04 | Dainippon Printing Co Ltd | 半導体装置用リ−ドフレ−ム |
| JPH022844U (enrdf_load_stackoverflow) * | 1988-06-16 | 1990-01-10 | ||
| JPH03293756A (ja) * | 1990-04-12 | 1991-12-25 | Mitsubishi Electric Corp | 半導体装置用リードフレーム及びその製造方法 |
-
1985
- 1985-04-19 JP JP8250885A patent/JPS61241957A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61241957A (ja) | 1986-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100350046B1 (ko) | 리드프레임 및 이를 이용한 방열판이 부착된 반도체패키지 | |
| JPS6396947A (ja) | 半導体装置用リ−ドフレ−ム | |
| EP1014445A1 (en) | Carrier substrate for producing semiconductor device | |
| JPH0564858B2 (enrdf_load_stackoverflow) | ||
| CN110943064A (zh) | 引线框架及其制造方法 | |
| US4592131A (en) | Method for manufacturing resin-sealed semiconductor device | |
| JP2004319816A (ja) | リードフレーム及びその製造方法 | |
| JPH0661401A (ja) | リードフレームおよびその製造方法 | |
| EP0723293A1 (en) | Semiconductor device with a heat sink and method of producing the heat sink | |
| JP2866816B2 (ja) | リードフレーム | |
| US6635407B1 (en) | Two pass process for producing a fine pitch lead frame by etching | |
| JPH0758267A (ja) | リードフレーム | |
| JP2606736B2 (ja) | リードフレームの製造方法 | |
| JP2972016B2 (ja) | リードフレームの製造方法 | |
| JP2524645B2 (ja) | リ―ドフレ―ムおよびその製造方法 | |
| JPH10154784A (ja) | リードフレームの製造方法 | |
| JP2555989B2 (ja) | 樹脂封止型半導体装置およびリードフレーム | |
| JP2756857B2 (ja) | リードフレームの製造方法 | |
| JPH04103154A (ja) | 半導体装置及びその製造方法及びその実装方法 | |
| JPH06349900A (ja) | キャリアテープ | |
| JPS5895851A (ja) | リ−ドフレ−ム | |
| JP2991174B2 (ja) | 半導体装置用リードフレームおよびその半導体装置の製造方法 | |
| JPH11214605A (ja) | 半導体装置の製造方法およびその方法で使用するリードフレーム | |
| JPH0745772A (ja) | リードフレームの製造方法 | |
| JP2004031775A (ja) | リードフレーム及びその製造方法 |