JPH0562735B2 - - Google Patents
Info
- Publication number
- JPH0562735B2 JPH0562735B2 JP60008731A JP873185A JPH0562735B2 JP H0562735 B2 JPH0562735 B2 JP H0562735B2 JP 60008731 A JP60008731 A JP 60008731A JP 873185 A JP873185 A JP 873185A JP H0562735 B2 JPH0562735 B2 JP H0562735B2
- Authority
- JP
- Japan
- Prior art keywords
- developer
- polyoxyethylene
- ether
- surfactant
- metacresol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 claims description 25
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 17
- -1 polyoxyethylene nonylphenyl ether Polymers 0.000 claims description 16
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 13
- 239000004094 surface-active agent Substances 0.000 claims description 9
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 claims description 8
- 239000003504 photosensitizing agent Substances 0.000 claims description 8
- 229940100630 metacresol Drugs 0.000 claims description 7
- DVEKCXOJTLDBFE-UHFFFAOYSA-N n-dodecyl-n,n-dimethylglycinate Chemical compound CCCCCCCCCCCC[N+](C)(C)CC([O-])=O DVEKCXOJTLDBFE-UHFFFAOYSA-N 0.000 claims description 6
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 229940094506 lauryl betaine Drugs 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 claims description 3
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 3
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 20
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 11
- 229920003986 novolac Polymers 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000007864 aqueous solution Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 6
- 238000003786 synthesis reaction Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000010354 integration Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 229960003237 betaine Drugs 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- KGWYICAEPBCRBL-UHFFFAOYSA-N 1h-indene-1-carboxylic acid Chemical compound C1=CC=C2C(C(=O)O)C=CC2=C1 KGWYICAEPBCRBL-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 1
- SZXKSDXHODZTFS-UHFFFAOYSA-N 4-[4,5-bis[4-(dimethylamino)phenyl]-1H-imidazol-2-yl]-2,6-dimethoxyphenol Chemical compound COC1=C(O)C(OC)=CC(C=2NC(=C(N=2)C=2C=CC(=CC=2)N(C)C)C=2C=CC(=CC=2)N(C)C)=C1 SZXKSDXHODZTFS-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- ALVGSDOIXRPZFH-UHFFFAOYSA-N [(1-diazonioimino-3,4-dioxonaphthalen-2-ylidene)hydrazinylidene]azanide Chemical compound C1=CC=C2C(=N[N+]#N)C(=NN=[N-])C(=O)C(=O)C2=C1 ALVGSDOIXRPZFH-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- CCGKOQOJPYTBIH-UHFFFAOYSA-N ethenone Chemical compound C=C=O CCGKOQOJPYTBIH-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- NUKZAGXMHTUAFE-UHFFFAOYSA-N hexanoic acid methyl ester Natural products CCCCCC(=O)OC NUKZAGXMHTUAFE-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 150000005691 triesters Chemical class 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/18—Diazo-type processes, e.g. thermal development, or agents therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP873185A JPS61167948A (ja) | 1985-01-21 | 1985-01-21 | ポジ型感光性組成物用現像液 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP873185A JPS61167948A (ja) | 1985-01-21 | 1985-01-21 | ポジ型感光性組成物用現像液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61167948A JPS61167948A (ja) | 1986-07-29 |
| JPH0562735B2 true JPH0562735B2 (US07709020-20100504-C00041.png) | 1993-09-09 |
Family
ID=11701096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP873185A Granted JPS61167948A (ja) | 1985-01-21 | 1985-01-21 | ポジ型感光性組成物用現像液 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61167948A (US07709020-20100504-C00041.png) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61185745A (ja) * | 1985-02-14 | 1986-08-19 | Toshiba Corp | ポジ型フオトレジスト現像液組成物 |
| JP2564485B2 (ja) * | 1986-05-19 | 1996-12-18 | 住友化学工業株式会社 | ポジ型フォトレジスト用クレゾールノボラック樹脂 |
| JPS6472155A (en) * | 1987-09-12 | 1989-03-17 | Tama Kagaku Kogyo Kk | Developing solution for positive type photoresist |
| JPH01129250A (ja) * | 1987-11-16 | 1989-05-22 | Tama Kagaku Kogyo Kk | ポジ型フォトレジスト用現像液 |
| JP2543742B2 (ja) * | 1988-04-07 | 1996-10-16 | 富士写真フイルム株式会社 | ポジ型フオトレジスト用現像液 |
| DE68917529T2 (de) * | 1988-05-31 | 1995-04-06 | Konishiroku Photo Ind | Lichtempfindliche Zusammensetzung und lichtempfindliche lithographische Druckplatte. |
| US5238771A (en) * | 1988-05-31 | 1993-08-24 | Konica Corporation | Lithographic printing plate utilizing aluminum substrate with photosensitive layer containing o-naphthoquinonediazide sulfonic acid ester, alkali soluble resin and select additive |
| US5543268A (en) * | 1992-05-14 | 1996-08-06 | Tokyo Ohka Kogyo Co., Ltd. | Developer solution for actinic ray-sensitive resist |
| JPH1124285A (ja) * | 1997-06-27 | 1999-01-29 | Kurarianto Japan Kk | レジスト用現像液 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3586504A (en) * | 1969-10-24 | 1971-06-22 | Eastman Kodak Co | Photoresist developers and methods |
| JPS589143A (ja) * | 1981-04-10 | 1983-01-19 | シツプレ−・カンパニ−・インコ−ポレ−テツド | 金属イオンを含まないフオ−トレジスト現像液組成物 |
| JPS59182444A (ja) * | 1983-04-01 | 1984-10-17 | Sumitomo Chem Co Ltd | ポジ型フオトレジストの改良現像液 |
| JPS6118944A (ja) * | 1984-05-16 | 1986-01-27 | アライド・コ−ポレ−シヨン | 低金属イオンホトレジスト現像液 |
-
1985
- 1985-01-21 JP JP873185A patent/JPS61167948A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3586504A (en) * | 1969-10-24 | 1971-06-22 | Eastman Kodak Co | Photoresist developers and methods |
| JPS589143A (ja) * | 1981-04-10 | 1983-01-19 | シツプレ−・カンパニ−・インコ−ポレ−テツド | 金属イオンを含まないフオ−トレジスト現像液組成物 |
| JPS59182444A (ja) * | 1983-04-01 | 1984-10-17 | Sumitomo Chem Co Ltd | ポジ型フオトレジストの改良現像液 |
| JPS6118944A (ja) * | 1984-05-16 | 1986-01-27 | アライド・コ−ポレ−シヨン | 低金属イオンホトレジスト現像液 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61167948A (ja) | 1986-07-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0851305B1 (en) | Rinsing and stripping process for lithography | |
| JP2540640B2 (ja) | 熱安定性フエノ―ル系樹脂組成物及び感光性組成物中でのそれらの使用 | |
| JP3968177B2 (ja) | 微細レジストパターン形成方法 | |
| KR100932087B1 (ko) | 리소그래피용 린스액 및 이를 사용한 레지스트 패턴의형성방법 | |
| TWI417682B (zh) | 微細化圖案之形成方法及用於它之光阻基板處理液 | |
| JPS58205147A (ja) | ポジ型フオトレジスト組成物 | |
| JP3024695B2 (ja) | ポジ型ホトレジスト組成物 | |
| JPH0562735B2 (US07709020-20100504-C00041.png) | ||
| JPH0650396B2 (ja) | ポジ型ホトレジスト組成物 | |
| JPH01257846A (ja) | ポジ型フオトレジスト用現像液 | |
| KR910005064B1 (ko) | 포지티브-워킹 감광성조성물 | |
| JPH0656487B2 (ja) | ポジ型ホトレジスト用組成物 | |
| JP2787943B2 (ja) | ポジ型フォトレジスト組成物 | |
| JPH0451019B2 (US07709020-20100504-C00041.png) | ||
| JPH0561195A (ja) | ポジ型ホトレジスト組成物 | |
| JPS63210923A (ja) | パタ−ン形成用樹脂組成物 | |
| JP2566045B2 (ja) | 新規ポジ型感光性組成物 | |
| JP2001117241A (ja) | リソグラフィー用リンス液 | |
| JPH0348250A (ja) | ポジ型レジスト組成物 | |
| JP2619050B2 (ja) | ポジ型感光性組成物 | |
| JPH0219851A (ja) | ポジ型フォトレジスト用現像液 | |
| JP2624541B2 (ja) | 新規なポジ型感光性組成物 | |
| JPH02109051A (ja) | ポジ型フォトレジスト組成物 | |
| JP2626067B2 (ja) | フォトレジスト組成物 | |
| JPH0242443A (ja) | ポジ型感光性組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |