JPH0561799B2 - - Google Patents
Info
- Publication number
- JPH0561799B2 JPH0561799B2 JP21049187A JP21049187A JPH0561799B2 JP H0561799 B2 JPH0561799 B2 JP H0561799B2 JP 21049187 A JP21049187 A JP 21049187A JP 21049187 A JP21049187 A JP 21049187A JP H0561799 B2 JPH0561799 B2 JP H0561799B2
- Authority
- JP
- Japan
- Prior art keywords
- copper oxide
- green sheet
- unfired
- copper
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 37
- 239000000919 ceramic Substances 0.000 claims description 27
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 24
- 239000005751 Copper oxide Substances 0.000 claims description 24
- 229910000431 copper oxide Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000007639 printing Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21049187A JPS6453597A (en) | 1987-08-25 | 1987-08-25 | Manufacture of ceramic multilayered board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21049187A JPS6453597A (en) | 1987-08-25 | 1987-08-25 | Manufacture of ceramic multilayered board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6453597A JPS6453597A (en) | 1989-03-01 |
| JPH0561799B2 true JPH0561799B2 (US20030204162A1-20031030-M00001.png) | 1993-09-07 |
Family
ID=16590229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21049187A Granted JPS6453597A (en) | 1987-08-25 | 1987-08-25 | Manufacture of ceramic multilayered board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6453597A (US20030204162A1-20031030-M00001.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0529765A (ja) * | 1990-08-23 | 1993-02-05 | Ngk Insulators Ltd | セラミツク多層配線基板およびその製造方法 |
| TW507484B (en) * | 2000-03-15 | 2002-10-21 | Matsushita Electric Ind Co Ltd | Method of manufacturing multi-layer ceramic circuit board and conductive paste used for the same |
-
1987
- 1987-08-25 JP JP21049187A patent/JPS6453597A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6453597A (en) | 1989-03-01 |
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