JPH0560660B2 - - Google Patents

Info

Publication number
JPH0560660B2
JPH0560660B2 JP61284627A JP28462786A JPH0560660B2 JP H0560660 B2 JPH0560660 B2 JP H0560660B2 JP 61284627 A JP61284627 A JP 61284627A JP 28462786 A JP28462786 A JP 28462786A JP H0560660 B2 JPH0560660 B2 JP H0560660B2
Authority
JP
Japan
Prior art keywords
wafer
suction
cleaning
suction surface
pure water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61284627A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63137448A (ja
Inventor
Makoto Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61284627A priority Critical patent/JPS63137448A/ja
Publication of JPS63137448A publication Critical patent/JPS63137448A/ja
Publication of JPH0560660B2 publication Critical patent/JPH0560660B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP61284627A 1986-11-29 1986-11-29 半導体ウエハ処理装置 Granted JPS63137448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61284627A JPS63137448A (ja) 1986-11-29 1986-11-29 半導体ウエハ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61284627A JPS63137448A (ja) 1986-11-29 1986-11-29 半導体ウエハ処理装置

Publications (2)

Publication Number Publication Date
JPS63137448A JPS63137448A (ja) 1988-06-09
JPH0560660B2 true JPH0560660B2 (US07655688-20100202-C00086.png) 1993-09-02

Family

ID=17680912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61284627A Granted JPS63137448A (ja) 1986-11-29 1986-11-29 半導体ウエハ処理装置

Country Status (1)

Country Link
JP (1) JPS63137448A (US07655688-20100202-C00086.png)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2588731B2 (ja) * 1987-10-22 1997-03-12 東芝機械株式会社 ロボット式ウエハ搬送装置
JPH0286868A (ja) * 1988-09-21 1990-03-27 Daiken Kagaku Kogyo Kk 塗膜装置
JPH04186860A (ja) * 1990-11-21 1992-07-03 Hitachi Ltd 搬送機構
US5271702A (en) * 1992-02-03 1993-12-21 Environmental Research Institute Of Michigan Robotic substrate manipulator
US5966635A (en) * 1997-01-31 1999-10-12 Motorola, Inc. Method for reducing particles on a substrate using chuck cleaning
JP4672924B2 (ja) * 2001-08-02 2011-04-20 株式会社ディスコ 吸着パッド洗浄装置及び該装置を用いた吸着パッド洗浄方法
JP4748263B2 (ja) * 2009-09-28 2011-08-17 東京エレクトロン株式会社 塗布、現像装置
JP7339860B2 (ja) * 2019-11-15 2023-09-06 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
JPS63137448A (ja) 1988-06-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees