JPH0558569B2 - - Google Patents
Info
- Publication number
- JPH0558569B2 JPH0558569B2 JP61159212A JP15921286A JPH0558569B2 JP H0558569 B2 JPH0558569 B2 JP H0558569B2 JP 61159212 A JP61159212 A JP 61159212A JP 15921286 A JP15921286 A JP 15921286A JP H0558569 B2 JPH0558569 B2 JP H0558569B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- semiconductor
- metal plate
- substrate
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61159212A JPS6315430A (ja) | 1986-07-07 | 1986-07-07 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61159212A JPS6315430A (ja) | 1986-07-07 | 1986-07-07 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6315430A JPS6315430A (ja) | 1988-01-22 |
| JPH0558569B2 true JPH0558569B2 (cg-RX-API-DMAC10.html) | 1993-08-26 |
Family
ID=15688773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61159212A Granted JPS6315430A (ja) | 1986-07-07 | 1986-07-07 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315430A (cg-RX-API-DMAC10.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2883787B2 (ja) * | 1993-07-20 | 1999-04-19 | 富士電機株式会社 | パワー半導体装置用基板 |
| US5675181A (en) * | 1995-01-19 | 1997-10-07 | Fuji Electric Co., Ltd. | Zirconia-added alumina substrate with direct bonding of copper |
| KR100765604B1 (ko) | 2004-11-26 | 2007-10-09 | 산요덴키가부시키가이샤 | 회로 장치 및 그 제조 방법 |
| JP5061717B2 (ja) * | 2007-05-18 | 2012-10-31 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
-
1986
- 1986-07-07 JP JP61159212A patent/JPS6315430A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6315430A (ja) | 1988-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |