JPH0557605A - Double side polishing machine for thin plate workpiece - Google Patents

Abstract

PURPOSE:To take out or feed a workpiece by a robot by adsorbing a workpiece and a carrier on a lower level block or an upper level block when an upper level block is separated after completion of polishing. CONSTITUTION:In the double side polishing machine for a thin plate workpiece an upper level block 2 and a lower level block 4 with polishing pads 3a, 3b mounted on the respective surfaces are relatively rotated in reverse direction in the condition in which a workpiece 5 held with a carrier 4 is sandwiched between them, and free abrasive is applied on it. Fluid spray holes 1 penetrating the upper level block 2 and the polishing pad 3a on its surface are provided so as to oppose to the workpiece 5 and the carrier 6 in the stopped condition of the polishing machine, and connected to a supply source of fluid for separating the workpiece. The spray hole 1 is provided in one position in the center of workpiece 5, or a plurality of the holes are uniformly provided on the circumference. When the polishing machine is stopped, fluid pressure is applied to the spray holes 1 opposed to the workpiece 5 so as to separate the upper level block 2. The workpiece 5 can be taken out and fed by a robot without injuring the workpiece due to its fall from the upper level block 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided polishing machine for thin plate workpieces, and in particular, it has a diameter of 50 mm to 130 mm and a thickness of 0.5 mm, such as a magnetic recording medium.
To simultaneously polishing both sides of the work piece up to 1.5 mm.

[0002]

2. Description of the Related Art A conventional double-sided polishing (lap) machine is, for example, Handbook of Mechanical Engineering (JSME, May 1, 1988).
Issued on 5th) B2-Page 150, the one shown in FIG. 357 is known. For a polishing machine that applies a free abrasive such as water, a polishing liquid, or a lubricant, and simultaneously polishes thin plates on both sides, when finishing polishing and separating the upper and lower polishing plates to take out a workpiece. The workpiece or the carrier holding the workpiece is adsorbed to the polishing pad of the upper surface plate or the lower surface plate. However, since the workpieces and carriers are light, they are adsorbed to the upper surface plate and the lower surface plate separately. Therefore, the removal and supply work was performed manually.

[0003]

In the above conventional technique, when the upper platen and the lower platen are separated after the completion of polishing,
Since the workpieces and carriers are attracted to the upper and lower stools separately, not only is it difficult for the robot to take out the workpieces, but also the workpieces and carriers that were attracted to the polishing pad of the upper stool. May fall suddenly. As a result, the mirror-finished surface will be scratched and become defective,
The carrier will be reattached to the polishing board.

An object of the present invention is that, when the upper surface plate and the lower surface plate are separated after polishing, the workpiece or carrier is adsorbed to a desired side of the lower surface plate or the upper surface plate, and the workpiece by the robot. (EN) A double-sided polishing machine for thin plate workpieces, which enables the removal and supply of the workpieces and also prevents the workpieces from being damaged by dropping from the upper surface plate.

[0005]

A double-sided polishing machine for thin plate workpieces according to the first aspect of the present invention is provided with an upper polishing plate and a lower polishing plate each having a polishing pad on each surface, and sandwiches the workpiece held by a carrier. In a double-sided polishing machine for thin plate workpieces, which is rotated in the opposite direction to apply a free abrasive, a fluid spray hole is provided to penetrate the upper surface plate and the polishing pad on the surface thereof.
The spray hole faces the workpiece when the polishing machine is stopped, and a fluid supply source for separating the workpiece is connected to the spray hole.

The double-sided polishing machine for thin plate workpieces of the invention 2 rotates in relatively opposite directions with the workpiece held by the carrier sandwiched by the upper and lower polishing plates having polishing pads on their respective surfaces. Then, in a double-sided polishing machine for thin plate workpieces to which a free abrasive is applied, a fluid spray hole penetrating the upper surface plate and the polishing pad on the surface thereof is provided, and this spray hole is in a stopped state of the polishing machine. A fluid supply source for separating the carrier is connected to the spray hole so as to face the carrier.

A double-sided polishing machine for thin plate workpieces of the invention 3 rotates in relatively opposite directions with a workpiece held by a carrier sandwiched between an upper polishing plate and a lower polishing plate having polishing pads mounted on their respective surfaces. In the double-sided polishing machine for a thin plate workpiece to which the free abrasive is applied, a fluid through hole is provided to penetrate the upper surface plate and the polishing pad on the surface thereof, and the through hole is in a stopped state of the polishing machine. A vacuum generating source for adsorbing the workpiece and a fluid supply source for separating the workpiece are switchably connected to the through hole so as to face the workpiece.

At this time, one blowing hole or through hole is provided at the center of each work or carrier as in the fourth aspect of the invention, or the blowing hole or through hole is as in the fifth aspect of the work or carrier. A plurality of them may be provided almost evenly around.

[0009]

In the invention 1 or 2, when the polishing is completed and the polishing machine is stopped, the fluid is supplied from the fluid supply source to the spray hole located at the position facing the workpiece or the carrier and penetrating the upper polishing table and the polishing pad. When the pressure is applied, all the workpieces or carriers are separated from the upper surface plate side and remain on the lower surface plate side. Therefore, the workpiece can be taken out by the robot very easily and there is no fear of dropping. Generally, the work is held on the carrier that is positively driven by the movements of both surface plates and gears, so it is important to position the spray holes facing the work and the carrier when the polishing machine is stopped. It's extremely easy.

In the invention 3, when the polishing is completed and the polishing machine is stopped, first, a vacuum pressure is applied from a vacuum generation source to a through hole which is located at a position facing the workpiece and which penetrates the upper surface plate and the polishing pad. If applied, all the workpieces will be adsorbed to the upper surface plate side.Next, if both plates are separated and a receiving plate is inserted between them, and fluid pressure is applied from a fluid supply source, all the workpieces will be received. Can be housed on a board. At this time, it is easy to leave the carrier on the lower stool side by its own weight or invention 2. Therefore, the workpiece can be taken out by the robot very easily and there is no fear of dropping.

In the invention 4, one spray hole or through hole located at the center of the work or the carrier uniformly presses the work or the carrier to the lower surface plate side.
If a plurality of workpieces or carriers are provided substantially evenly around the workpiece or carrier, the workpieces or carriers are evenly pressed to the lower surface plate side even if the relative positions of the plurality of workpieces or carriers are slightly deviated from the center of the workpiece or carrier.

[0012]

Embodiment 1 FIG. 1 is a front view of Embodiment 1 and is A- in FIG.
2 is a sectional view taken along the line BB of FIG. 1, FIG. 3 is a front view of the second embodiment, and is a sectional view taken along the line C-C of FIG. 4, and FIG. FIG. In the drawings, components having the same reference numerals have approximately the same function, and duplicate explanation may be omitted. 1 and 2, the upper surface plate 2 having the polishing pad 3a mounted on the surface thereof and the lower surface plate 4 having the polishing pad 3b mounted thereon are relatively opposite to each other by the shaft 7 and the base 8 as shown by the arrow. Rotate in the direction.
The workpiece 5 is held by a carrier 6 thinner than this, sandwiched between the polishing pads 3a and 3b, and free abrasives such as water, polishing liquid and lubricant (not shown) are applied to simultaneously polish both surfaces. ..

Outer teeth (not shown) of the carrier 6 mesh with outer teeth (not shown) of the sun gear 9, and the upper platen 2
As a result of meshing with an internal gear (not shown) having internal teeth (not shown) slightly larger than the outer diameter of the lower platen 4, the workpiece 5 in the carrier 6 revolves around its own axis and the sun gear 9, and the sun gear. It makes a spiral motion with the radius changed to 9. As a result, polishing is performed evenly between each work piece and the entire surface of one work piece. The structure is known.

As a characteristic structure of the first embodiment, a spray hole 1 penetrating the upper surface plate 2 and the polishing pad 3a on the surface thereof.
Is formed. A fluid supply source (not shown) capable of applying a fluid pressure such as air or water is connected to the spray hole 1. In the case of a magnetic recording medium having a diameter of 100 mm and a thickness of 1 mm, and a carrier having a thickness of 0.8 mm, the applied pressure is 1 atm, and the diameter of the spray holes is 3 mm to 5 mm. It is good to provide one. This may be one in the center of the workpiece or two in the same radius on the same diameter. In order to ensure that the spray holes 1 provided on the upper surface plate 2 are in the correct position on the workpiece when the polishing machine is stopped, the carrier 6 is positively and regularly driven by the sun gear 9 without slipping as described above. It is easy to do.

According to the structure of the first embodiment, when the polishing is completed and the polishing machine is stopped, the fluid supply source is located at the position facing the workpiece and is provided in the spray hole penetrating the upper polishing plate and the polishing pad. When the fluid pressure is applied from, the workpieces are all separated from the upper surface plate side and remain on the lower surface plate side. Therefore, the robot can take it out very easily and there is no fear of dropping. In addition, one spray hole located in the center of the workpiece presses the workpiece evenly to the lower surface plate side, and if multiple holes are provided almost evenly around the workpiece, the multiple relative positions will be the center of the workpiece. Even if it is slightly deviated, the work piece is evenly pressed to the lower surface plate side.

The embodiment 2 shown in FIGS. 3 and 4 is different from the embodiment 1 shown in FIGS. 1 and 2 in that the spray holes 21 are also applied to the carrier 6 and spraying for the workpiece 5 is performed. Specifically, a point at which a vacuum generation source for suctioning a workpiece 5 and a fluid supply source for separation are switchably connected to a through hole 22 corresponding to a hole, an internal gear 10 meshing with a carrier 6 and its peripheral structure are specifically described. This is the point shown. The four carriers 6 between the sun gear 9 and the internal gear 10 and having external teeth that mesh with them make a spiral motion with the radius changed with respect to the sun gear 9 while holding the workpiece 5. .. The sun gear 9 is supported by the sun shaft 12, and the internal gear 10 is fixed to the fixed base 11.

In the second embodiment, when the polishing is completed and the polishing machine is stopped, the upper surface plate and its polishing pad are located at positions facing the carrier 6 as well as the through holes 22 for the workpiece 5. When the fluid pressure is applied to the through-hole spraying hole 21 from the fluid supply source, the carrier 6 is all separated from the upper surface plate 2 side and remains on the lower surface plate side, and the workpiece is held by the carrier 6. .. The best way to use this is to start with the through hole 22 for the workpiece 5 once the polishing is finished and the polishing machine is stopped.
If a vacuum pressure is applied to the upper surface plate side by applying a vacuum pressure to the upper surface plate side, then while applying the fluid pressure to the spray holes 21, the two tanks are separated from each other, and the receiving plate (not shown) is interposed between them. If a plate is inserted and a fluid pressure is applied to the through hole 22 from a fluid supply source,
The workpieces 5 can all be housed on the backing plate. Therefore, the robot 5 can very easily take out and supply the workpiece 5, and there is no fear of dropping.

[0018]

EFFECTS OF THE INVENTION The double-sided polishing machine for thin plate workpieces according to the present invention is relatively opposite in direction with the workpiece held by the carrier sandwiched between the upper and lower polishing plates having polishing pads on their respective surfaces. In a double-sided polishing machine for thin plate workpieces, which is rotated to a free surface and which applies a free abrasive, is provided with a fluid spray hole or through hole penetrating the upper surface plate and the polishing pad on the surface thereof. Is opposed to the workpiece or the carrier when the polishing machine is stopped, and a fluid supply source for separating the workpiece or the carrier or a vacuum generation source for adsorbing the workpiece is connected to the spray hole or the through hole. It is a thing. According to this structure, when the upper surface plate and the lower surface plate are separated from each other after polishing, the workpieces or carriers are adsorbed to the surface plate all or separately, and the robot can take out and supply the workpieces. In addition, there is an effect that it is possible to prevent damage to the work piece caused by dropping from the upper surface plate. There may be one spray hole or through hole at the center of the work or carrier, but if a plurality of spray holes or through holes are provided almost evenly around the work or carrier, there will be a plurality of spray holes even if there is some relative deviation from the work or carrier. There is an effect that the center of the work or the carrier is surely located in the polygon whose corner is the hole or the through hole, and the work or the carrier is separated from the surface plate.

[Brief description of drawings]

FIG. 1 is a front view of the first embodiment with a cross section taken along the line AA of FIG.

FIG. 2 is a sectional view taken along line BB of FIG.

FIG. 3 is a front view of the second embodiment with a cross section taken along the line CC of FIG.

FIG. 4 is a sectional view taken along the line DD of FIG.

[Explanation of symbols]

 1 Blow hole 2 Upper surface plate 3a Polishing pad 3b Polishing pad 4 Lower surface plate 5 Workpiece 6 Carrier 9 Sun gear 10 Internal gear 21 Blowing hole 22 Through hole

Claims (5)

[Claims] 1. A thin plate workpiece to which a free abrasive is applied by rotating a workpiece held by a carrier by an upper platen and a lower platen having polishing pads on their respective surfaces and rotating them in opposite directions. In a double-sided polishing machine for use, a fluid spray hole penetrating the upper surface plate and the polishing pad on the surface thereof is provided, and the spray hole faces the workpiece in a stopped state of the polishing machine, and A double-sided polishing machine for thin plate workpieces, wherein a fluid supply source for separating the workpieces is connected. 2. A thin plate workpiece to which a free abrasive is applied by rotating a workpiece held by a carrier by an upper surface plate and a lower surface plate each having a polishing pad on each surface and rotating the workpieces in opposite directions. In the double-sided polishing machine for use, a spray hole for fluid is provided to penetrate the upper surface plate and the polishing pad on the surface thereof, and the spray hole faces the carrier in a stopped state of the polishing machine, and A double-sided polishing machine for thin plate workpieces, which is connected with a fluid supply source for separating the carrier. 3. A thin plate workpiece in which a free abrasive is applied by rotating a workpiece held by a carrier by an upper platen and a lower platen having polishing pads on their respective surfaces and rotating them in opposite directions. In the double-sided polishing machine for use, a fluid through hole is provided through the upper surface plate and the polishing pad on the surface thereof, and the through hole faces the workpiece in a stopped state of the polishing machine, and A double-sided polishing machine for thin plate workpieces, wherein a vacuum generation source for adsorbing the workpiece and a fluid supply source for separation are switchably connected. 4. A double-sided polishing machine for thin plate workpieces according to claim 1, 2 or 3, wherein one spray hole or through hole is provided at the center of each workpiece or carrier. Double-sided polishing machine for objects. 5. The double-sided polishing machine for a thin plate workpiece according to claim 1, 2 or 3, wherein a plurality of the spray holes or through holes are provided substantially evenly around each workpiece or the carrier. Double-sided polishing machine for thin plate workpieces.