JP2558864Y2 - Lapping whetstone surface plate - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a grindstone plate of a lapping polishing apparatus having a fixed grindstone.

[0002]

2. Description of the Related Art A polishing apparatus in which segment-shaped solid synthetic whetstones are arranged and fixed on both upper and lower platens is generally referred to as a whetstone lapping type polishing apparatus, and includes a substrate for an aluminum memory disk, a silicon wafer, It is widely used for polishing flat objects such as glass wafers which require a high degree of flatness and parallelism.

[0003] A polishing apparatus of the above type usually comprises a sun gear,
It has a planetary gear mechanism consisting of a carrier that rotates and revolves in engagement with the internal gear and both gears, and the carrier is provided with a holding hole that penetrates both surfaces of the carrier and holds a body to be polished. After placing the workpiece on the upper surface of the lower platen and holding the object to be polished in the holding hole in the state, place the upper platen on the upper surface of the carrier, and independently rotate the sun gear, the internal gear, and the upper and lower platens. Is used to polish both surfaces of the object to be polished. In addition, from the viewpoint of work efficiency, it is preferable and general to set a plurality of the carriers and hold a plurality of the members to be polished in each carrier.

In the above-described polishing apparatus, after the polishing operation is completed, first, the upper platen is lifted to take out the object to be polished. At this time, the object to be polished and the platen are extremely flat and both are in close contact with each other. In this state, the object to be polished often adheres to the upper platen due to the influence of the polishing liquid used for polishing.
In this case, after the object to be polished is shifted so as to come to the gap or the end face of the segment-shaped grindstone, the object to be polished is peeled off and collected. In any case, such an operation is extremely complicated. Also,
The user may not notice that the object to be polished has adhered to the next operation and may cause an unexpected failure.

[0005] Furthermore, the object to be polished adhered to the upper surface plate may fall during the lifting of the upper surface plate. In this case, the whetstone surface of the lower platen and peripheral devices may be damaged,
The polished body itself that has fallen will be damaged.

[0006]

[Problems to be solved by the present invention] The present invention has been made in view of the above-mentioned problems.
An object of the present invention is to provide a grinding wheel lapping type polishing apparatus in which an object to be polished does not stick to the upper lapping plate when the upper lapping plate is lifted after completion of polishing.

[0007]

SUMMARY OF THE INVENTION The object of the present invention is to provide a grindstone plate attached to an upper side of a grindstone plate attached to a lapping polishing apparatus which holds a member to be polished on a carrier and polishes both surfaces of a plurality of members to be polished. A through-hole communicating with the polishing surface is drilled in the grinding wheel surface plate, and the perforation position of the through-hole in the polishing surface is only a portion overlapping the upper surface of the object to be polished when the carrier and the grinding wheel surface plate stop at a predetermined position. Further, at least one through-hole is formed in a contact portion of each of the polishing surfaces overlapping with the upper surface of the object to be polished.

[0008] In the lapping platen of the present invention, the other end of the through hole communicating with the polishing surface is open to the side surface of the grindstone.

The through hole according to the present invention is located on the upper surface of each of the polished surfaces of the grindstone when the carrier holding the polished object and the upper and lower platens are stopped at predetermined positions after polishing. Each contact portion is provided with one or more through holes. The inner diameter and number of the through holes may be appropriately set depending on the size, weight, etc. of the object to be polished, but usually 3 to 10
mm. If the inner diameter of the through hole is too large or if the number of through holes is too large, it will affect the polishing performance,
The finished state of the upper and lower surfaces of the object to be polished will be different. Conversely, if the inner diameter of the through hole is too small,
The object of the present invention cannot be achieved.

In another aspect of the present invention, in the lapping plate, the other end of the through hole communicating with the polishing surface is opened to the outside of the polishing plate, and the open end is connected to a pressing means. It may be. However, when it is opened to the outside of the polishing platen, the through-hole is usually drilled through the grindstone, the mounting plate and the lapping platen. On the other hand, when it is opened to the side surface of the grindstone, it is not necessary to pierce the mounting plate and the lapping plate.

When the other end of the through-hole is connected to a pressurizing means such as compressed air or pressurized water, the cross-section of the through-hole can be reduced and the object to be polished can be reliably removed from the polishing surface by the pressure. It can be peeled off, but it complicates the equipment.

[0012]

[Function] After the polishing operation is completed and the upper and lower platens and the carrier are stopped at predetermined positions, when the upper grindstone platen is lifted, air or the like naturally flows through the through-holes, so that the object to be polished has its own weight. Thereby, it is easily peeled off from the upper grindstone plate and does not stick to the upper polished surface.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described with reference to the drawings.

FIG. 1 is a plan view of an embodiment of the grindstone plate of the present invention when viewed from below.

FIG. 2 is a perspective view showing a main portion of the embodiment of the through hole according to the present invention. In FIG.
Is drilled in an L-shape and the other end is open to the side surface of the grindstone. When the through hole is drilled in this way, the mounting plate 2
Further, it is not necessary to pierce the lapping platen 3.

FIG. 3 shows the grinding wheel platen and the carrier 6 when the lapping polishing apparatus equipped with the grinding wheel platen finishes the polishing operation and stops at a predetermined position (hereinafter referred to as “stopping stage”).
FIG. 5 is a plan view showing the positional relationship between the above and when viewed from below. Eight holding holes 8 for holding the polished body 7 are formed in the carrier 6, and the polished body 7 is held in each holding hole 8. Further, in this embodiment, four carriers 6 are mounted in total, and the gears of each carrier mesh with the sun gear 9 and the internal gear 10.

The through holes 11 are formed one by one substantially at the center of the abutting portion of the polishing surface which overlaps with the upper surface of each of the polished bodies 7 at the time of stopping. Therefore, in the present embodiment, the through holes are formed at 32 locations on the whole grindstone platen, and each of the objects to be polished overlaps one through hole at the time of stopping.

FIG. 6 shows a conventional grindstone plate having no through holes.

[0019]

According to the present invention, the grinding wheel surface plate of the present invention has a through hole formed in the contact portion of the grinding wheel surface overlapping with the upper surface of the object to be polished, and the other end is opened to the air. At the time of lifting, air or the like is sent out from the through holes, and the object to be polished does not stick to the upper platen and is lifted together or peeled off in the middle. Therefore, the object to be polished can be easily collected, and damage to the object to be polished and the polishing grindstone due to dropping of the object to be polished can be prevented beforehand.

[Brief description of the drawings]

FIG. 1 is a plan view of one embodiment of a grindstone platen of the present invention when viewed from below.

FIG. 2 is a perspective view showing an embodiment of a through hole in the grindstone platen of FIG.

FIG. 3 is a plan view showing the positional relationship between the grindstone plate and the carrier when the lapping polishing apparatus equipped with the grindstone plate of FIG. 1 is stopped at a predetermined position, as viewed from below.

FIG. 4 is a plan view showing an example of a conventional grindstone platen.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Segment whetstone 2 Mounting plate 3 Lapping surface plate 4 Bolt 5 Groove 6 Carrier 7 Object to be polished 8 Holding hole 9 Sun gear 10 Internal gear 11 Through hole

Claims (1)

(57) [Scope of request for utility model registration] 1. A grindstone plate attached to a lapping polishing apparatus which holds a body to be polished on a carrier and grinds both sides of a plurality of polished bodies. The through-hole communicating with the side surface is drilled, and the drilling position of the through-hole in the polishing surface is only a portion that overlaps with the upper surface of the body to be polished when the carrier and the grindstone platen stop at a predetermined position, A lapping whetstone surface plate, wherein at least one through hole is formed at a contact portion of each polishing surface overlapping with an upper surface of the object to be polished.