JP2000094308A - Rectangular substrate holding jig and rectangular substrate polishing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a rectangular substrate polishing method for polishing a rectangular substrate using a rectangular substrate holding jig and a substrate holding jig capable of holding the substrate without giving impact to it, during grinding the large-size rectangular substrate at a high speed and pressure. SOLUTION: By a rectangular substrate holding jig consisting of a carrier 3 provided with an opening 3a capable of accommodating a rectangular substrate 1, and plural elastic bodies 4 for connecting the rectangular substrate 1 accommodated in the opening 3a of the carrier 3, the carrier 3 to which the rectangular substrate 1 is adhesively fixed through the plural elastic bodies 4 is inserted in a rotary ring 6 placed on a polishing pad 10, and the rectangular substrate 1 is brought into pressure-contact with the polishing pad 10. The carrier 3 and the rectangular substrate 1 are rotated-moved by the rotary ring 6 rotating with the rotation of the polishing pad 10, and thus the rectangular substrate 1 is polished at a high speed and pressure in a state where the rectangular substrate 1 is stably held without colliding with the carrier 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for holding a rectangular substrate and a jig for holding a flat surface of a wiring or an insulating film formed on a large-area rectangular glass substrate. The present invention relates to a rectangular substrate polishing method for polishing a rectangular substrate by using the method.

[0002]

2. Description of the Related Art A wiring board used for a large-area sensor, a display, or the like has a large number of fine metal wirings formed and adhered on a flat glass substrate or the like. An insulating film having a uniform thickness is attached to bury the fine wiring, an upper wiring is formed on the surface of the attached insulating film, and an insulating film is further attached thereon. For this reason, it is necessary to remove the surface of the wiring or the insulating film having an uneven shape evenly and evenly, and the polishing for flattening the surface of the wiring or the insulating film on such a substrate is usually performed. A flat lapping machine is used, and a method is employed in which a substrate is pressed against a polishing pad attached to the flat lapping machine to perform polishing.

[0003] There are various methods for holding a substrate to be polished when polishing with this kind of lapping machine.
One of these, called the carrier system, separates the pressurizing mechanism and the rotating mechanism of the substrate.Pressing is performed with a load placed on the back side of the substrate that is not polished, and rotation is performed so as to surround the substrate. It is configured to transmit the light from the side surface of the substrate by the arranged disk-shaped carrier. For example, as shown in FIG. 3, the carrier 103 is a disk larger than the rectangular substrate 101, and a hollow 103 a is formed in the center with a small clearance in the outer dimensions of the substrate. The substrate 101 is stored in 103a. The carrier 103 is inserted into a rotating ring 106 made of metal, ceramic, or the like into a cylindrical shape. The rotating ring 106 is mounted on a polishing pad 110 attached to a lapping board 111 which is driven to rotate by a rotating means (not shown), and is supported by two rollers 107, 107 arranged on the outer periphery. I have. The rotating ring 106 is provided with two rollers 107, 107 as the lapping machine 111 and the polishing pad 110 rotate.
Rotate with the support point of as a fulcrum. And carrier 1
Numeral 03 rotates by friction with the inner surface of the rotating rotating ring 106, and further, the substrate 101 accommodated in the carrier 103 also rotates. The substrate 101 is pressed against the polishing pad 110 by a pressing weight 105 placed on the back surface of the substrate 101, and the pressing weight 105 rotates integrally with the substrate 101. During polishing of the substrate 101,
The substrate support point in the carrier 103 rotates, and accordingly, the substrate 101 moves from one support point in the carrier 103 to another support point.

[0004]

By the way, when polishing a rectangular substrate using the carrier method as described above,
Since the substrate has a structure that moves freely in the carrier,
Several problems arise. That is, during one rotation of the substrate and the carrier, the support point on the inner circumference of the carrier changes four times from a position in one side of the rectangle to another side, and each time the substrate moves by the clearance in the carrier. Collides with the inside of the carrier. The impact caused by the collision may cause cracks on the side surface of the substrate, and the crushed pieces may fall on the surface of the polishing board, causing polishing scratches. Further, the substrate may vibrate due to collision of the substrate with the inner surface of the carrier, and in some cases, the substrate may come off the carrier and jump out. Furthermore, the larger the substrate and the larger the polishing load, the greater the moving force of the substrate and the greater the collision force. In addition, during high-speed polishing in which the number of revolutions of the lapping machine is large, the collision vibration increases. In order to avoid the adverse effects of such a collision, polishing is also performed by providing an elastic body on the inner surface of the carrier so as to absorb the impact of the collision,
The impact cannot be completely eliminated and the problem of substrate chipping is inevitable.

The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and it is desirable to hold a large-sized rectangular substrate without giving an impact during high-speed and high-pressure polishing of the substrate. It is an object of the present invention to provide a rectangular substrate holding jig that can be used, and a rectangular substrate polishing method for polishing a large-sized rectangular substrate using the rectangular substrate holding jig.

[0006]

In order to achieve the above object, a jig for holding a rectangular substrate according to the present invention comprises a disc-shaped carrier provided with a hole for accommodating a rectangular substrate, and a hole in the carrier. And a plurality of elastic bodies for connecting the rectangular substrate housed in the carrier to the carrier, and connecting the carrier and the rectangular substrate housed in the holes via the plurality of elastic bodies to connect the rectangular substrate to the carrier. The rectangular substrate is polished while being held so as not to move with respect to the rectangular substrate.

In the rectangular substrate holding jig of the present invention, it is preferable that the connecting portion by the elastic body is on each side of the rectangular substrate, and the connecting portion between the elastic body and the rectangular substrate is bonded and fixed by a heat-shrinkable resin. It is preferable that the connecting portion between the elastic body and the carrier is further fixed with a rubber-based adhesive.

According to a rectangular substrate polishing method of the present invention, the rectangular substrate is held in a hole of a carrier by using the rectangular substrate holding jig according to any one of claims 1 to 4, and the rectangular substrate is polished. And the carrier are connected by an elastic body,
The polishing is performed by relatively rotating the rectangular substrate while pressing the rectangular substrate against the polishing pad.

According to a rectangular substrate polishing method of the present invention, a carrier in which rectangular substrates are connected by a plurality of elastic bodies using a rectangular substrate holding jig according to any one of claims 1 to 4 is placed on a polishing pad. The rectangular substrate is pressed into contact with the polishing pad by being inserted into the mounted rotating ring, the carrier and the rectangular substrate are rotated by a rotating ring that rotates with the rotation of the polishing pad, and the rectangular substrate is rotated. It is characterized by being polished.

In the method of polishing a rectangular substrate according to the present invention, it is preferable to supply an abrasive onto the polishing pad when the rectangular substrate is relatively rotated while being pressed against the polishing pad for polishing.

[0011]

According to the present invention, since the rectangular substrate is connected to the carrier via the connecting elastic body, the rectangular substrate can be stably held without colliding with the carrier. Further, even if vibration occurs in the carrier, the vibration is not transmitted to the rectangular substrate, and the polishing uniformity is not adversely affected.

[0012] The rectangular substrate is stably and accurately held by the carrier and the connecting elastic body, so that good polishing can be performed even in high-speed high-pressure polishing.

[0013]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic configuration diagram of a substrate polishing apparatus for polishing a rectangular substrate using an embodiment of the rectangular substrate holding jig of the present invention, (a) is a sectional view thereof, and (b). Is a plan view.

The rectangular substrate holding jig according to the present invention has a disc-shaped carrier 3 having a centrally formed hollow hole 3a slightly larger than the outer dimensions of the substrate 1 so as to accommodate the large-area rectangular substrate 1. And a connecting elastic body 4 (hereinafter simply referred to as an elastic body 4) for connecting the substrate 1 housed in the hollow 3 a to the carrier 3 to restrain the substrate 1 from moving in the hollow 3 a of the carrier 3. ).
The elastic body 4 is made of a material such as neoprene rubber or urethane rubber, which has good water resistance and abrasion resistance and has a compressive strength, and is provided with cutouts 4a and 4b on both lower side edges to form a T-shaped cross section. I have. One notch 4a of the connecting elastic body 4 is in contact with the side surface and the upper surface of each side of the substrate 1 (the substrate 1 and the back pad 2 when the back pad 2 is interposed), and the other notch 4b is a carrier. 3 is formed so as to contact the side surface of each side of the hollow 3 a and the upper surface of the carrier 3. Then, the notch 4a of the elastic body 4 and the substrate 1
For the connection between the side surface and the upper surface of the substrate 1 (or the substrate 1 and the back pad 2), an adhesive that is easy to peel off after polishing is used. For example, it is tacky at room temperature, has small adhesive distortion,
A heat-shrinkable adhesive that shrinks at a high temperature and easily peels off is used. On the other hand, the connection between the notch 4b of the elastic member 4 and the side surface and the upper surface of the carrier 3 is performed through the elastic member 4 even if the carrier 3 has an adhesive strain, so that the substrate 1 does not have a deformation effect. It is possible to use a rubber-based adhesive or an epoxy-based adhesive which easily causes an adhesive distortion but has a strong adhesive force. The carrier 3 and the elastic body 4 are used repeatedly for polishing the substrate 1.

In the substrate polishing apparatus shown in FIG. 1, a rectangular substrate 1 in which a back pad 2 is superimposed in a hollow 3a of a carrier 3 is accommodated, and elastic bodies 4 are provided on opposite sides of the substrate 1 and the carrier 3. Are bonded by the respective adhesives described above, and the substrate 1 and the carrier 3 are connected. The carrier 3 is inserted into a cylindrical rotating ring 6 placed on a polishing pad 10 attached to a lapping machine 11 that is rotated and driven by a rotating means (not shown). It is supported by the two arranged rollers 7, 7, and rotates around a contact point with the rollers 7, 7. Then, the carrier 3 rotates by friction with the inner surface of the rotating rotary ring 6, and the substrate 1 also rotates integrally with the carrier 3. Further, a pressing weight 5 is placed on the back surface of the substrate 1 via the back surface pad 2 to press the substrate 1. The pressing weight 5 is placed so as not to contact the four elastic bodies 4, and even if the pressing weight 5 moves together with the substrate 1 during the polishing of the substrate 1, extra force is applied to the elastic body 4. The elastic member 4 is prevented from being deformed. Polishing pad 10 stuck on lapping machine 11
Is a porous member having pores of several μm to several hundred μm. For example, a hard elastic member such as polyurethane is used.

Next, the rectangular substrate holding jig in this embodiment will be described more specifically.
A glass substrate 1 having a thickness of 0 mm and a thickness of 1.1 mm
The baking carrier 3 having a thickness of 10 mm and a thickness of 10 mm is inserted into a rectangular hollow hole 3a. The elastic body 4 bonded to each side of the glass substrate 1 has a width of 10 mm and a length of 200 m.
A rectangular parallelepiped hard neoprene rubber having a thickness of 4 mm and a thickness of 4 mm is used. The elastic body 4 is interposed between each side of the glass substrate 1 and each side of the rectangular hollow 3a facing each side. Then, the notch 4 on the glass substrate 1 side
a is a glass substrate 1 via a sheet-like thermoplastic adhesive.
The notch 4b on the carrier 3 side is bonded and fixed to the carrier 3 via a synthetic rubber adhesive.

In the substrate polishing apparatus constructed as described above, the rotating ring 6 tends to move due to friction with the polishing pad 10 accompanying rotation of the lapping machine 11 by a rotating means (not shown). 7, 7 and starts to rotate around the contact point with the rollers 7, 7 at that point. As the rotating ring 6 rotates, the carrier 3 in the rotating ring 6 also moves, and since the outer periphery of the carrier 3 is circular, the carrier 3 makes point contact with the inner surface of the rotating ring 6, and the carrier 3 rotates around the fulcrum. Since the rotating ring 6 and the carrier 3 are rotated between circles, the movement of the contact point is smaller than in the case of the circle and the rectangle, and the rotation is smooth. Since the substrate 1 housed in the carrier 3 is connected to the carrier 3 via the connecting elastic body 4, the substrate 1 rotates integrally with the carrier 3. Moreover, even if the carrier 3 is vibrated, the vibration is not transmitted to the substrate 1 because the substrate 1 is interposed through the elastic body 4, so that the polishing uniformity is not adversely affected.

As described above, since the rectangular substrate 1 is stably and accurately held by the carrier 3 and the connecting elastic member 4, even if the substrate is a rectangular substrate having a large area, the rectangular substrate 1 must be stably held. And good polishing can always be performed.

In this embodiment, the elastic body 4 is bonded and fixed to each side of the glass substrate 1 and does not hold the four corners of the glass substrate 1, so that an extra portion is added to the corners of the glass substrate. It is possible to prevent the corners from being damaged without applying excessive force.

The arrangement of the elastic body 4 for connecting the rectangular substrate 1 to the carrier 3 is not limited to the above-mentioned embodiment, but can be arranged at various positions. For example, when there is little risk of damage to the corners of the glass substrate, as shown in FIG.
It is also possible to provide the connecting elastic body 4A at each corner. In this case, a notch 4a corresponding to the corner of the glass substrate 1 and a notch 4b corresponding to the corner of the hollow 3a of the carrier 3 are formed on the lower surface of the elastic body 4A. The notches 4a and 4b are bonded and fixed to the substrate 1 and the carrier 3 via the same adhesive as in the above-described embodiment. With such an arrangement of the elastic members, the same operation and effect as those of the above-described embodiment can be obtained.

During polishing of the substrate, it is preferable to supply an abrasive (polishing slurry) between the polishing pad 10 and the substrate 1 to be polished, and the material of the abrasive is manganese oxide, silicon oxide, Fine particles, such as cerium oxide, aluminum oxide, zeolite oxide, chromium oxide, iron oxide, silicon carbide, boron carbide, carbon, and ammonium, having a relatively uniform diameter in the range of several millimeters to submicrons are hydroxylated. A polishing solution dispersed in a solution such as a sodium aqueous solution, a potassium hydroxide aqueous solution, an ammonia aqueous solution, an isocyanuric acid solution, Br-CH ₃ OH, an isopropyl alcohol aqueous solution, and a hydrochloric acid aqueous solution is used. The combination can be selected according to the purpose. For example, in the polishing of Si surface, silicon oxide, cerium oxide, ammonium salt, the fine particles such as manganese dioxide and a polishing agent dispersed in said solution suitable in the polishing of the SiO ₂ surface, fine particles of silicon oxide water Abrasives dispersed in an aqueous potassium oxide solution are preferred, and abrasives in which fine silicon oxide particles are dispersed in an aqueous ammonia solution containing hydrogen peroxide are preferred for polishing the Al surface.

The object to be polished by the present invention may be a semiconductor wafer such as silicon or gallium arsenide, or a wafer containing at least one material constituting a semiconductor element such as a transistor. Further, as the other object to be polished, an SOI substrate, a substrate for a display, or the like can also be used as the object to be polished.

[0024]

As described above, according to the present invention,
Even if the substrate to be polished has a rectangular shape with a large area, collision between the substrate and the carrier can be eliminated, and the substrate can be stably and accurately held without causing cracks or the like on the side surface of the substrate. In addition, good polishing can be performed even in high-speed and high-pressure polishing.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a substrate polishing apparatus for polishing a rectangular substrate using one embodiment of a rectangular substrate holding jig of the present invention;
(A) is a sectional view, and (b) is a plan view.

FIG. 2 is a schematic plan view of a substrate polishing apparatus for polishing a rectangular substrate using another embodiment of the rectangular substrate holding jig of the present invention.

FIG. 3 is a schematic configuration diagram of a substrate polishing apparatus for polishing a rectangular substrate using a conventional rectangular substrate holding jig, (a) is a cross-sectional view, and (b) is a plan view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 (Rectangular) board 2 Back pad 3 Carrier 3a Opening hole 4, 4A (for connection) Elastic body 4a, 4b Notch 5 Weight for pressurization 6 Rotating ring 7 Roller 10 Polishing pad 11 Lapping machine

Claims (7)

[Claims] 1. A carrier comprising: a disc-shaped carrier provided with a hole capable of accommodating a rectangular substrate; and a plurality of elastic bodies connecting the rectangular substrate accommodated in the hole of the carrier to the carrier. And the rectangular substrate housed in the hole is connected via the plurality of elastic bodies, and the rectangular substrate is polished by holding the rectangular substrate so as not to move with respect to the carrier. A rectangular substrate holding jig. 2. The rectangular substrate holding jig according to claim 1, wherein the connection points by the elastic body are each side of the rectangular substrate. 3. The rectangular substrate holding jig according to claim 1, wherein a connecting portion between the elastic body and the rectangular substrate is bonded and fixed with a heat-shrinkable resin. 4. The rectangular substrate holding jig according to claim 1, wherein a connecting portion between the elastic body and the carrier is adhered and fixed with a rubber-based adhesive. 5. The rectangular substrate holding jig according to claim 1, wherein the rectangular substrate is housed in a hole of a carrier, and the rectangular substrate and the carrier are connected by an elastic body. Polishing the rectangular substrate while relatively rotating the substrate while pressing the rectangular substrate against a polishing pad. 6. A carrier in which rectangular substrates are connected by a plurality of elastic bodies using the rectangular substrate holding jig according to claim 1 is inserted into a rotating ring mounted on a polishing pad. And pressing the rectangular substrate against the polishing pad, rotating the carrier and the rectangular substrate by a rotating ring that rotates with the rotation of the polishing pad, and polishing the rectangular substrate. Polishing method. 7. The polishing of a rectangular substrate according to claim 5, wherein when the rectangular substrate is relatively rotated while being pressed against the polishing pad and polished, an abrasive is supplied onto the polishing pad. Method.