JPH0556032B2 - - Google Patents
Info
- Publication number
- JPH0556032B2 JPH0556032B2 JP12477187A JP12477187A JPH0556032B2 JP H0556032 B2 JPH0556032 B2 JP H0556032B2 JP 12477187 A JP12477187 A JP 12477187A JP 12477187 A JP12477187 A JP 12477187A JP H0556032 B2 JPH0556032 B2 JP H0556032B2
- Authority
- JP
- Japan
- Prior art keywords
- resin powder
- piezoelectric ceramic
- electrode conductor
- resin
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000000843 powder Substances 0.000 claims abstract description 28
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000007610 electrostatic coating method Methods 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000000873 masking effect Effects 0.000 abstract description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000009503 electrostatic coating Methods 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62124771A JPS63288076A (ja) | 1987-05-20 | 1987-05-20 | 圧電セラミック積層体電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62124771A JPS63288076A (ja) | 1987-05-20 | 1987-05-20 | 圧電セラミック積層体電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63288076A JPS63288076A (ja) | 1988-11-25 |
| JPH0556032B2 true JPH0556032B2 (enrdf_load_stackoverflow) | 1993-08-18 |
Family
ID=14893708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62124771A Granted JPS63288076A (ja) | 1987-05-20 | 1987-05-20 | 圧電セラミック積層体電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63288076A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5971286B2 (ja) * | 2014-07-29 | 2016-08-17 | Tdk株式会社 | レンズ駆動装置 |
-
1987
- 1987-05-20 JP JP62124771A patent/JPS63288076A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63288076A (ja) | 1988-11-25 |
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