JPH0554718B2 - - Google Patents
Info
- Publication number
- JPH0554718B2 JPH0554718B2 JP60134542A JP13454285A JPH0554718B2 JP H0554718 B2 JPH0554718 B2 JP H0554718B2 JP 60134542 A JP60134542 A JP 60134542A JP 13454285 A JP13454285 A JP 13454285A JP H0554718 B2 JPH0554718 B2 JP H0554718B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- cuo
- particle size
- atmosphere
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
- 
        - C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
 
- 
        - H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
 
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP60134542A JPS61292393A (ja) | 1985-06-20 | 1985-06-20 | セラミック多層配線基板用酸化第二銅混練物 | 
| KR1019860004701A KR900008781B1 (ko) | 1985-06-17 | 1986-06-13 | 후막도체조성물 | 
| US06/875,083 US4695403A (en) | 1985-06-17 | 1986-06-17 | Thick film conductor composition | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP60134542A JPS61292393A (ja) | 1985-06-20 | 1985-06-20 | セラミック多層配線基板用酸化第二銅混練物 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS61292393A JPS61292393A (ja) | 1986-12-23 | 
| JPH0554718B2 true JPH0554718B2 (OSRAM) | 1993-08-13 | 
Family
ID=15130750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP60134542A Granted JPS61292393A (ja) | 1985-06-17 | 1985-06-20 | セラミック多層配線基板用酸化第二銅混練物 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPS61292393A (OSRAM) | 
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS6355807A (ja) * | 1986-08-27 | 1988-03-10 | 古河電気工業株式会社 | 導電性ペ−スト | 
| JPH0753625B2 (ja) * | 1987-10-12 | 1995-06-07 | 日本特殊陶業株式会社 | セラミック用メタライズ組成物 | 
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS6052096A (ja) * | 1983-08-31 | 1985-03-23 | 松下電工株式会社 | セラミックス回路基板の製法 | 
| JPS6126293A (ja) * | 1984-07-17 | 1986-02-05 | 松下電器産業株式会社 | セラミック多層配線基板の製造方法 | 
- 
        1985
        - 1985-06-20 JP JP60134542A patent/JPS61292393A/ja active Granted
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPS61292393A (ja) | 1986-12-23 | 
Similar Documents
| Publication | Publication Date | Title | 
|---|---|---|
| JPH0157054B2 (OSRAM) | ||
| KR900008781B1 (ko) | 후막도체조성물 | |
| JPH0554718B2 (OSRAM) | ||
| JPH0341997B2 (OSRAM) | ||
| JPH06224556A (ja) | 低温焼成多層基板 | |
| JPS63257107A (ja) | メタライズ組成物 | |
| JPS61289691A (ja) | メタライズ組成物 | |
| JPH0680897B2 (ja) | セラミツク銅多層配線基板の製造方法 | |
| JPH11186727A (ja) | 配線基板およびその製造方法 | |
| JPH0588557B2 (OSRAM) | ||
| JP3222296B2 (ja) | 導電性インキ | |
| JPH0632379B2 (ja) | セラミツク配線基板の製造方法 | |
| JPH0537160A (ja) | 多層セラミツク回路基板 | |
| JPS61292394A (ja) | セラミツク配線基板用メタライズ組成物 | |
| JPH0320914B2 (OSRAM) | ||
| JPS63257108A (ja) | メタライズ組成物 | |
| JP2002231049A (ja) | 導電性ペースト | |
| JPH0321107B2 (OSRAM) | ||
| JPS6126292A (ja) | セラミック多層配線基板の製造方法 | |
| JPS63257109A (ja) | メタライズ組成物 | |
| JPS63291304A (ja) | メタライズ組成物 | |
| JPS5915481B2 (ja) | グレ−ズ抵抗器の製造方法 | |
| JPS62232191A (ja) | セラミツク多層配線基板の製造方法 | |
| JPS62198198A (ja) | セラミツク多層配線基板の製造方法 | |
| JPH0680898B2 (ja) | セラミツク銅多層基板の製造方法 | 
Legal Events
| Date | Code | Title | Description | 
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |