JPH0552061B2 - - Google Patents

Info

Publication number
JPH0552061B2
JPH0552061B2 JP63004261A JP426188A JPH0552061B2 JP H0552061 B2 JPH0552061 B2 JP H0552061B2 JP 63004261 A JP63004261 A JP 63004261A JP 426188 A JP426188 A JP 426188A JP H0552061 B2 JPH0552061 B2 JP H0552061B2
Authority
JP
Japan
Prior art keywords
bonded
wire bonding
lens barrel
bonding apparatus
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63004261A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01181539A (ja
Inventor
Mitsusada Shibasaka
Hiroaki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP63004261A priority Critical patent/JPH01181539A/ja
Priority to KR1019890000269A priority patent/KR910007507B1/ko
Publication of JPH01181539A publication Critical patent/JPH01181539A/ja
Publication of JPH0552061B2 publication Critical patent/JPH0552061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP63004261A 1987-01-12 1988-01-12 ワイヤボンディング装置 Granted JPH01181539A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP63004261A JPH01181539A (ja) 1988-01-12 1988-01-12 ワイヤボンディング装置
KR1019890000269A KR910007507B1 (ko) 1987-01-12 1989-01-12 와이어본딩장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63004261A JPH01181539A (ja) 1988-01-12 1988-01-12 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPH01181539A JPH01181539A (ja) 1989-07-19
JPH0552061B2 true JPH0552061B2 (enExample) 1993-08-04

Family

ID=11579599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63004261A Granted JPH01181539A (ja) 1987-01-12 1988-01-12 ワイヤボンディング装置

Country Status (2)

Country Link
JP (1) JPH01181539A (enExample)
KR (1) KR910007507B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045803B2 (en) * 2003-07-11 2006-05-16 Asm Assembly Automation Ltd. Missing die detection
JP6604932B2 (ja) * 2016-11-29 2019-11-13 三菱電機株式会社 半導体製造装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59136940A (ja) * 1983-01-27 1984-08-06 Fujitsu Ltd 撮像光学系を有する認識装置

Also Published As

Publication number Publication date
JPH01181539A (ja) 1989-07-19
KR910007507B1 (ko) 1991-09-26
KR890012372A (ko) 1989-08-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees