JPH0552061B2 - - Google Patents
Info
- Publication number
- JPH0552061B2 JPH0552061B2 JP63004261A JP426188A JPH0552061B2 JP H0552061 B2 JPH0552061 B2 JP H0552061B2 JP 63004261 A JP63004261 A JP 63004261A JP 426188 A JP426188 A JP 426188A JP H0552061 B2 JPH0552061 B2 JP H0552061B2
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- wire bonding
- lens barrel
- bonding apparatus
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011521 glass Substances 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 11
- 238000005286 illumination Methods 0.000 description 8
- 238000007664 blowing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000003570 air Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明はワイヤボンデイング装置にかかり、特
に被ボンデイング体の位置検出を行うITVカメ
ラ光学系を有するワイヤボンデイング装置に関す
るものである。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a wire bonding apparatus, and more particularly to a wire bonding apparatus having an ITV camera optical system for detecting the position of a bonded object. .
（従来の技術）
第３図は従来のワイヤボンデイング装置の概略
構成を示した正面図である。被ボンデイング体で
あるペレツト１がリードフレーム２にダイボンデ
イングされ、フレーム搬送ガイド３上をボンデイ
ング位置まで搬送される。リードフレーム２はフ
レーム押え４により固定されると共にヒータ５に
対して押さえ付けられている。このヒータ５はリ
ードフレーム２をペレツト１とともに加熱する。(Prior Art) FIG. 3 is a front view showing a schematic configuration of a conventional wire bonding apparatus. A pellet 1, which is a body to be bonded, is die-bonded to a lead frame 2, and is conveyed on a frame conveyance guide 3 to a bonding position. The lead frame 2 is fixed by a frame presser 4 and is pressed against the heater 5. This heater 5 heats the lead frame 2 together with the pellet 1.
ITVカメラ６はペレツト１の上方に設けられ、
ペレツト１ITVカメラ６の中間位置に設けられ
た照明電球７より出た光はハーフミラー８により
ペレツト１方向に曲げられてペレツトを照射し、
ペレツト１から反射した光はハーフミラー８を通
過して対物レンズ９によりITVカメラ６内の撮
像素子１０上にペレツトの像を結ぶ。ワイヤボン
デイング装置の制御装置はこのITVカメラ６か
らの影像信号を処理し、ペレツト１あるいはフレ
ーム２上の正確なボンデイング位置を求め、所定
のボンデイング動作を行なう。 The ITV camera 6 is installed above the pellet 1,
The light emitted from the illumination bulb 7 installed in the middle of the pellet 1 ITV camera 6 is bent by the half mirror 8 in the direction of the pellet 1 and illuminates the pellet.
The light reflected from the pellet 1 passes through a half mirror 8 and forms an image of the pellet on an image sensor 10 in an ITV camera 6 by an objective lens 9. The control device of the wire bonding apparatus processes the image signal from the ITV camera 6, determines an accurate bonding position on the pellet 1 or frame 2, and performs a predetermined bonding operation.
この時、ヒーター５によるヒーター加熱の影響
によつて空気のゆらぎ１１が生じ、かげろうのよ
うな像のゆれが発生するが、この空気のゆらぎ１
１は一種の歪レンズとなり撮像素子１０上に正し
い影像が結ばれることを妨げ、正しい位置へのボ
ンデイングができなくなる原因となる。このとき
の像の歪の程度は対物レンズ９とペレツト１との
間の距離が長い程、さらにヒーター加熱温度が高
いほど大きくなる傾向をもつている。 At this time, air fluctuations 11 occur due to the influence of heater heating by the heater 5, and image fluctuations like haze occur.
1 becomes a kind of distorted lens, which prevents a correct image from being formed on the image pickup device 10, and makes it impossible to bond to the correct position. The degree of image distortion at this time tends to increase as the distance between the objective lens 9 and the pellet 1 increases and as the heater heating temperature increases.
このため従来の装置ではエアー供給装置１２を
ペレツト近傍に配置し、側面からエアまたは窒素
を例えば５／min程度の流量で吹き付け、この
空気のゆらぎ１１による影響を小さくするように
している。 For this reason, in the conventional apparatus, an air supply device 12 is placed near the pellets, and air or nitrogen is blown from the side at a flow rate of, for example, about 5/min, in order to reduce the influence of this air fluctuation 11.
ところで、近時における半導体装置は、LSIに
代表されるようにますます高集積化され、ペレツ
ト上のボンデイングパツドの大きさやピツチ、イ
ンナーリードの巾やピツチ等も縮小化の傾向が著
しく、それに伴つてワイヤボンデイング装置にも
高密度で高精度のものが要求されている。 Incidentally, recent semiconductor devices, as typified by LSI, have become more and more highly integrated, and the size and pitch of bonding pads on pellets, the width and pitch of inner leads, etc. have also tended to decrease significantly. Accordingly, wire bonding equipment is also required to have high density and high precision.
そして、このような高密度のワイヤボンデイン
グとして100μｍパツドピツチ以下のワイヤボン
デイングを例にとると、ボンデイング位置を高精
度に認識するためにはITVカメラの光学倍率を
高くすることが一般的である。しかし光学倍率を
高くすればするほど前述したような空気のゆらぎ
による影響を強く受け、前述したエアー吹き付け
による防止策では十分ではなく高密度ボンデイン
グには適用できない。すなわち高密度ボンデイン
グにおいては従来のエアー吹き付けによる防止策
では空気のゆらぎによる影響が無視できなくな
り、ボンデイング精度が低下してしまうという問
題があつた。 Taking wire bonding with a pad pitch of 100 μm or less as an example of such high-density wire bonding, it is common to increase the optical magnification of the ITV camera in order to recognize the bonding position with high precision. However, the higher the optical magnification is, the more it is affected by the above-mentioned air fluctuations, and the above-mentioned prevention measures by air blowing are insufficient and cannot be applied to high-density bonding. That is, in high-density bonding, the conventional preventive measure using air blowing has a problem in that the influence of air fluctuations cannot be ignored, resulting in a decrease in bonding accuracy.
また、上述した空気のゆらぎによる画像のゆれ
を防止するため、光学照明系カメラをペレツト１
に近づけることが考えられるが、第３図において
１点鎖線で示されているように光学系とペレツト
１との間にはボンデンイングヘツド１３が存在し
ているため、作業性を低下させないためには光学
系をあまりペレツトに近づけることはできない。
また、ヒータ５が存在しているため光学系を近づ
けることにより熱変形を招くおそれもある。 In addition, in order to prevent the image from shaking due to the air fluctuations mentioned above, the optical illumination camera was
However, since there is a bonding head 13 between the optical system and the pellet 1 as shown by the dashed line in Fig. 3, in order not to reduce the workability, The optical system cannot be brought very close to the pellet.
Further, since the heater 5 is present, there is a risk that thermal deformation will occur when the optical system is brought close to the optical system.
（発明が解決しようとする課題）
このように従来のボデイング装置では、加熱に
よる空気のゆらぎの影響を強く受け画像歪を発生
させ、高精度なボンデイング品質が得られないと
いう問題点があつた。(Problems to be Solved by the Invention) As described above, the conventional bodying apparatus has a problem in that it is strongly affected by air fluctuations due to heating and causes image distortion, making it impossible to obtain highly accurate bonding quality.
本発明は上述した問題点を解消するためになさ
れたもので、空気のゆらぎの影響による画像歪を
低減せしめ高精度なボンデイング品質を得ること
のできるワイヤボンデイング装置を提供すること
を目的とする。 The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a wire bonding device that can reduce image distortion due to the influence of air fluctuations and obtain highly accurate bonding quality.
（課題を解決するための手段）
本発明は、被ボンデイング体を固着支持するス
テージと、このステージの下方に設けられた加熱
用ヒータと、前記被ボンデイング体にワイヤボン
デイングを行うボンデイング手段と、前記被ボン
デイング体の上方に設けられた撮像手段とを備
え、前記撮像手段により前記被ボンデイング体の
位置情報を得、この位置情報に基づいて所定のボ
ンデイング動作を行うワイヤボンデイング装置に
おいて、前記撮像手段の鏡筒に連結され、少なく
とも先端部に光学的透明体が配設され、前記鏡筒
中の対物レンズと前記被ボンデイング体との距離
の中央点よりも被ボンデイング体側に前記光学的
透明体が位置するような長さを有する延長鏡筒を
さらに備えたことを特徴とするものである。
(Means for Solving the Problems) The present invention provides a stage for firmly supporting an object to be bonded, a heater provided below the stage, a bonding means for performing wire bonding on the object to be bonded, and a bonding means for wire bonding the object to be bonded. and an imaging means provided above the object to be bonded, wherein the imaging means obtains positional information of the object to be bonded and performs a predetermined bonding operation based on this positional information. Connected to a lens barrel, an optically transparent body is disposed at least at the tip, and the optically transparent body is located closer to the body to be bonded than the center point of the distance between the objective lens in the lens barrel and the body to be bonded. The present invention is characterized in that it further includes an extended lens barrel having such a length.
（作用）
本発明の装置では、撮像手段の鏡筒に連結され
る延長鏡筒は、鏡筒中の対物レンズと被ボンデイ
ング体との距離の半分以上をゆらぎの発生空間か
ら遮蔽する。これにより、撮像手段で観察される
像の歪を低減させることができる。(Function) In the apparatus of the present invention, the extension lens barrel connected to the lens barrel of the imaging means shields more than half of the distance between the objective lens in the lens barrel and the object to be bonded from the space in which fluctuation occurs. Thereby, distortion of the image observed by the imaging means can be reduced.
（実施例）
以下本発明の実施例を図面を参照して詳細に説
明する。(Example) Examples of the present invention will be described in detail below with reference to the drawings.
第１図は本発明の一実施例にかかるボンデイン
グ装置を示す概略構成図である。なお本実施例で
は第３図に示したのと同様の落射照明装置を用い
ており、第３図と同じ部分には同じ参照番号を付
して説明を省略する。 FIG. 1 is a schematic diagram showing a bonding apparatus according to an embodiment of the present invention. In this embodiment, an epi-illumination device similar to that shown in FIG. 3 is used, and the same parts as in FIG. 3 are given the same reference numerals, and the explanation thereof will be omitted.
ここでは対物レンズ９とハーフミラー８の下方
に鏡筒２１を延長し、その先端に熱遮へい性を有
する透明ガラス２０を配設した構造を採用してい
る。この透明ガラス２０は被ボンデイング体であ
るペレツト１と対物レンズ９との間の光学空間
を、透明ガラス２０と被ボンデイング体１との間
の空間Ａ（以下単に被ボンデイング体周辺空間と
いう）と対物レンズ９と透明ガラス２０との間の
空間Ｂ（以下遮へい空間という）とに分割する。 Here, a structure is adopted in which a lens barrel 21 is extended below the objective lens 9 and the half mirror 8, and a transparent glass 20 having heat shielding properties is disposed at the tip thereof. This transparent glass 20 separates the optical space between the pellet 1, which is the object to be bonded, and the objective lens 9 from the space A between the transparent glass 20 and the object to be bonded 1 (hereinafter simply referred to as the space around the object to be bonded) and the objective lens. It is divided into a space B (hereinafter referred to as a shielding space) between the lens 9 and the transparent glass 20.
これにより像のゆれ１１の発生を被ボンデイン
グ体周辺空間Ａのみに制限し、遮へい空間Ｂでの
像のゆれの発生を防止している。すなわち本発明
では像のゆれ発生領域を被ボンデイング体直上の
ごく狭い空間に限定させることにより、像のゆれ
１１の影響を小さくするようにしている。 This limits the occurrence of image wobbling 11 only to the space A around the object to be bonded, and prevents the occurrence of image wobbling in the shielded space B. That is, in the present invention, the influence of the image shake 11 is reduced by limiting the area where the image shake occurs to a very narrow space directly above the object to be bonded.
発明者らの実験によれば、２つの空間Ａ，Ｂが
被ボンデンイング体１の上方にその長さ空近Ｂ＞
空間Ａとなるように鏡筒２１をセツトすれば、空
気のゆらぎ１１による画像歪を従来の半分程度に
低減することができた。 According to the inventors' experiments, two spaces A and B are located above the bonded body 1 with a length B>
By setting the lens barrel 21 so as to form the space A, image distortion due to air fluctuations 11 could be reduced to about half that of the conventional image.
ここで鏡筒２１の長さを長くすればするほど空
気のゆらぎ防止効果が上がることが予想できる
が、実際には落射照明だけではなく外部に光源を
用意し、被ボンデイング体１からの乱反射光を合
わせて利用することも多いため、必要な光量を確
保しかつヒーター押え４およびボンデイングヘツ
ドの運動を妨げないようにしなければならないた
め、鏡筒２１の長さは自ずと制限される。 Here, it can be expected that the longer the length of the lens barrel 21, the better the air fluctuation prevention effect will be, but in reality, an external light source is prepared in addition to epi-illumination, and the diffusely reflected light from the bonding object 1 is Since the lens barrel 21 is often used in conjunction with the lens barrel 21, the length of the lens barrel 21 is naturally limited because it is necessary to ensure the necessary amount of light and not impede the movement of the heater presser 4 and the bonding head.
第２図は本発明の他の実施例を示したもので、
リング照明を用いた場合の実施例である。この場
合にはリング状の照明装置３０からの光が被ボン
デイング体１に十分に当たるよう鏡筒２１は被ボ
ンデイング体１に近づくほど先の細い構造となつ
ている。そして前述した落射照明の場合と同様に
その先端に透明ガラス２０が埋め込まれこれによ
り被ボンデイング体１の上方空間が２つに分割さ
れている。 FIG. 2 shows another embodiment of the present invention,
This is an example in which ring lighting is used. In this case, the lens barrel 21 has a tapered structure as it approaches the object 1 to be bonded so that the light from the ring-shaped illumination device 30 can sufficiently hit the object 1 to be bonded. As in the case of epi-illumination described above, a transparent glass 20 is embedded in the tip of the epi-illumination, thereby dividing the space above the bonding object 1 into two.
本実施例においても必要な光量を得るために外
部に別光源を併用することができる。 In this embodiment as well, another light source can be used externally in order to obtain the necessary amount of light.
なお前述した実施例においては、光学空間を分
割するために鏡筒２１を用いその先端に透明ガラ
ス２０を埋め込んだが、これに限ることなく他の
構成を採用することができる。例えば被ボンデイ
ング体１と対物レンズ９との間に光学的透明体で
あるガラスブロツクを挿入するようにしてもよ
い。また、鏡筒２１の先端部に赤外線フイルタを
取り付けてカメラで得られる光の色収差を減少さ
せるようにしてもよい。 In the embodiment described above, the lens barrel 21 was used to divide the optical space, and the transparent glass 20 was embedded in the tip of the lens barrel 21, but the present invention is not limited to this, and other configurations may be adopted. For example, an optically transparent glass block may be inserted between the object to be bonded 1 and the objective lens 9. Furthermore, an infrared filter may be attached to the tip of the lens barrel 21 to reduce chromatic aberration of light obtained by the camera.
また従来の装置で用いられているようなエアー
吹き付け機構を併用することによりさらに空気の
ゆらぎ防止効果を向上させることができる。 Further, by using an air blowing mechanism such as that used in conventional devices, the effect of preventing air fluctuation can be further improved.
以上説明したように、本発明によれば、鏡筒中
の対物レンズと被ボンデイング体との距離の中央
点よりも被ボンデイング体側に先端の光学的透明
体が位置するような長さを有する延長鏡筒を撮像
手段の鏡筒に連結するようにしているので、ゆら
ぎの発生空間が減少して像の歪を防止でき、高精
度のワイヤボンデイングが可能となる。
As explained above, according to the present invention, the extension mirror has a length such that the optical transparent body at the tip is located closer to the object to be bonded than the center point of the distance between the objective lens in the lens barrel and the object to be bonded. Since the tube is connected to the lens barrel of the imaging means, the space in which fluctuations occur is reduced, image distortion can be prevented, and highly accurate wire bonding becomes possible.
第１図および第２図は本発明の一実施例を示す
ワイヤボンデイング装置の概略構成図、第３図は
従来のワイヤボンデイング装置を示す構成図であ
る。
１……被ボンデイング体（ペレツト）、５……
ヒータ、６……ITVカメラ、９……対物レンズ、
１０……撮像素子、１１……空気のゆらぎ、２０
……透明ガラス、２１……延長鏡筒、３０……リ
ング照明装置、Ａ……被ボンデイング体周辺空
間、Ｂ……遮へい空間。
1 and 2 are schematic diagrams of a wire bonding apparatus according to an embodiment of the present invention, and FIG. 3 is a diagram of a conventional wire bonding apparatus. 1... Body to be bonded (pellet), 5...
Heater, 6...ITV camera, 9...Objective lens,
10...Image sensor, 11...Air fluctuation, 20
. . . Transparent glass, 21 . . . Extension lens barrel, 30 . . . Ring illumination device, A .
Claims (1)
と、このステージの下方に設けられた加熱用ヒー
タと、前記被ボンデイング体にワイヤボンデイン
グを行うボンデイング手段と、前記被ボンデイン
グ体の上方に設けられた撮像手段とを備え、前記
撮像手段により前記被ボンデイング体の位置情報
を得、この位置情報に基づいて所定のボンデイン
グ動作を行うワイヤボンデイング装置において、 前記撮像手段の鏡筒に連結され、少なくとも先
端部に光学的透明体が配設され、前記鏡筒中の対
物レンズと前記被ボンデイング体との距離の中央
点よりも被ボンデイング体側に前記光学的透明体
が位置するような長さを有する延長鏡筒をさらに
備えたことを特徴とするワイヤボンデイング装
置。 ２ 前記延長鏡筒は、先端部にガラス板を取り付
ける構造を有していることを特徴とする特許請求
の範囲第１項記載のワイヤボンデイング装置。 ３ 前記延長鏡筒は、先端に先端部に行くにした
がつて減少する径を有することを特徴とする特許
請求の範囲第１項記載のワイヤボンデイング装
置。 ４ 前記延長鏡筒は、全体が透明材料のブロツク
をなすことを特徴とする特許請求の範囲第１項記
載のワイヤボンデイング装置。[Scope of Claims] 1. A stage for firmly supporting an object to be bonded, a heater provided below the stage, bonding means for performing wire bonding on the object to be bonded, and a stage above the object to be bonded. a wire bonding apparatus comprising: an imaging means provided therein; the wire bonding apparatus obtains positional information of the object to be bonded by the imaging means and performs a predetermined bonding operation based on the positional information; An optically transparent body is disposed at least at the tip, and has a length such that the optically transparent body is located closer to the body to be bonded than the center point of the distance between the objective lens in the lens barrel and the body to be bonded. A wire bonding device further comprising an extension lens barrel. 2. The wire bonding apparatus according to claim 1, wherein the extension lens barrel has a structure in which a glass plate is attached to a tip end thereof. 3. The wire bonding apparatus according to claim 1, wherein the extension barrel has a diameter that decreases toward the tip. 4. The wire bonding apparatus according to claim 1, wherein the extension barrel is entirely a block made of a transparent material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63004261A JPH01181539A (en) | 1988-01-12 | 1988-01-12 | Wire bonding equipment |
| KR1019890000269A KR910007507B1 (en) | 1987-01-12 | 1989-01-12 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63004261A JPH01181539A (en) | 1988-01-12 | 1988-01-12 | Wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01181539A JPH01181539A (en) | 1989-07-19 |
| JPH0552061B2 true JPH0552061B2 (en) | 1993-08-04 |
Family
ID=11579599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63004261A Granted JPH01181539A (en) | 1987-01-12 | 1988-01-12 | Wire bonding equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH01181539A (en) |
| KR (1) | KR910007507B1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7045803B2 (en) * | 2003-07-11 | 2006-05-16 | Asm Assembly Automation Ltd. | Missing die detection |
| JP6604932B2 (en) * | 2016-11-29 | 2019-11-13 | 三菱電機株式会社 | Semiconductor manufacturing equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59136940A (en) * | 1983-01-27 | 1984-08-06 | Fujitsu Ltd | Recognizing device with image pickup optical system |
-
1988
- 1988-01-12 JP JP63004261A patent/JPH01181539A/en active Granted
-
1989
- 1989-01-12 KR KR1019890000269A patent/KR910007507B1/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59136940A (en) * | 1983-01-27 | 1984-08-06 | Fujitsu Ltd | Recognizing device with image pickup optical system |
Also Published As
| Publication number | Publication date |
|---|---|
| KR890012372A (en) | 1989-08-26 |
| KR910007507B1 (en) | 1991-09-26 |
| JPH01181539A (en) | 1989-07-19 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |