JPH054838B2 - - Google Patents
Info
- Publication number
- JPH054838B2 JPH054838B2 JP28198287A JP28198287A JPH054838B2 JP H054838 B2 JPH054838 B2 JP H054838B2 JP 28198287 A JP28198287 A JP 28198287A JP 28198287 A JP28198287 A JP 28198287A JP H054838 B2 JPH054838 B2 JP H054838B2
- Authority
- JP
- Japan
- Prior art keywords
- resist layer
- substrate material
- etching resist
- pattern
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims description 10
- 239000000057 synthetic resin Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- 239000012943 hotmelt Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28198287A JPH01124284A (ja) | 1987-11-10 | 1987-11-10 | プリント基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28198287A JPH01124284A (ja) | 1987-11-10 | 1987-11-10 | プリント基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01124284A JPH01124284A (ja) | 1989-05-17 |
| JPH054838B2 true JPH054838B2 (enrdf_load_stackoverflow) | 1993-01-20 |
Family
ID=17646595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28198287A Granted JPH01124284A (ja) | 1987-11-10 | 1987-11-10 | プリント基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01124284A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4292245B2 (ja) | 2001-02-05 | 2009-07-08 | 三星モバイルディスプレイ株式會社 | 発光体、発光素子、及び発光表示装置 |
| JP2003218658A (ja) * | 2002-01-17 | 2003-07-31 | Nec Corp | 弾性表面波素子及び半導体装置の製造方法 |
-
1987
- 1987-11-10 JP JP28198287A patent/JPH01124284A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01124284A (ja) | 1989-05-17 |
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