JPH0547637B2 - - Google Patents

Info

Publication number
JPH0547637B2
JPH0547637B2 JP59136041A JP13604184A JPH0547637B2 JP H0547637 B2 JPH0547637 B2 JP H0547637B2 JP 59136041 A JP59136041 A JP 59136041A JP 13604184 A JP13604184 A JP 13604184A JP H0547637 B2 JPH0547637 B2 JP H0547637B2
Authority
JP
Japan
Prior art keywords
solution
copper
electroless plating
palladium
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59136041A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6115982A (ja
Inventor
Isao Matsuzaki
Kenji Tonoki
Takehiko Ishibashi
Haruki Yokono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP59136041A priority Critical patent/JPS6115982A/ja
Priority to DE8585304381T priority patent/DE3574270D1/de
Priority to EP85304381A priority patent/EP0167326B1/en
Priority to KR1019850004562A priority patent/KR890004785B1/ko
Priority to US06/750,779 priority patent/US4734299A/en
Publication of JPS6115982A publication Critical patent/JPS6115982A/ja
Publication of JPH0547637B2 publication Critical patent/JPH0547637B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP59136041A 1984-06-29 1984-06-29 無電解めつき法 Granted JPS6115982A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP59136041A JPS6115982A (ja) 1984-06-29 1984-06-29 無電解めつき法
DE8585304381T DE3574270D1 (en) 1984-06-29 1985-06-19 Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
EP85304381A EP0167326B1 (en) 1984-06-29 1985-06-19 Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
KR1019850004562A KR890004785B1 (ko) 1984-06-29 1985-06-26 무전해 도금용 증감(增感)제 및 기질의 증감법
US06/750,779 US4734299A (en) 1984-06-29 1985-07-01 Sensitizing agent for electroless plating and method for sensitizing substrate with the agent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59136041A JPS6115982A (ja) 1984-06-29 1984-06-29 無電解めつき法

Publications (2)

Publication Number Publication Date
JPS6115982A JPS6115982A (ja) 1986-01-24
JPH0547637B2 true JPH0547637B2 (enrdf_load_stackoverflow) 1993-07-19

Family

ID=15165793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59136041A Granted JPS6115982A (ja) 1984-06-29 1984-06-29 無電解めつき法

Country Status (2)

Country Link
JP (1) JPS6115982A (enrdf_load_stackoverflow)
KR (1) KR890004785B1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6017631B2 (ja) * 1978-10-05 1985-05-04 石川島播磨重工業株式会社 箱型鋼製柱内部の補剛プレ−トの溶接方法

Also Published As

Publication number Publication date
KR890004785B1 (ko) 1989-11-27
JPS6115982A (ja) 1986-01-24
KR860000409A (ko) 1986-01-28

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