JPH049874B2 - - Google Patents

Info

Publication number
JPH049874B2
JPH049874B2 JP59136042A JP13604284A JPH049874B2 JP H049874 B2 JPH049874 B2 JP H049874B2 JP 59136042 A JP59136042 A JP 59136042A JP 13604284 A JP13604284 A JP 13604284A JP H049874 B2 JPH049874 B2 JP H049874B2
Authority
JP
Japan
Prior art keywords
solution
copper
electroless plating
catalyst
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59136042A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6115983A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13604284A priority Critical patent/JPS6115983A/ja
Priority to DE8585304381T priority patent/DE3574270D1/de
Priority to EP85304381A priority patent/EP0167326B1/en
Priority to US06/750,779 priority patent/US4734299A/en
Publication of JPS6115983A publication Critical patent/JPS6115983A/ja
Publication of JPH049874B2 publication Critical patent/JPH049874B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
JP13604284A 1984-06-29 1984-06-29 無電解めつき用触媒 Granted JPS6115983A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP13604284A JPS6115983A (ja) 1984-06-29 1984-06-29 無電解めつき用触媒
DE8585304381T DE3574270D1 (en) 1984-06-29 1985-06-19 Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
EP85304381A EP0167326B1 (en) 1984-06-29 1985-06-19 Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
US06/750,779 US4734299A (en) 1984-06-29 1985-07-01 Sensitizing agent for electroless plating and method for sensitizing substrate with the agent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13604284A JPS6115983A (ja) 1984-06-29 1984-06-29 無電解めつき用触媒

Publications (2)

Publication Number Publication Date
JPS6115983A JPS6115983A (ja) 1986-01-24
JPH049874B2 true JPH049874B2 (enrdf_load_stackoverflow) 1992-02-21

Family

ID=15165814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13604284A Granted JPS6115983A (ja) 1984-06-29 1984-06-29 無電解めつき用触媒

Country Status (1)

Country Link
JP (1) JPS6115983A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
JP2012084640A (ja) * 2010-10-08 2012-04-26 Fujifilm Corp 積層体の製造方法
JP6272673B2 (ja) 2013-10-30 2018-01-31 ローム・アンド・ハース電子材料株式会社 無電解めっき用触媒液
JP6926120B2 (ja) * 2016-05-04 2021-08-25 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 基板表面の活性化を含む基板表面に金属または金属合金を析出させるための方法

Also Published As

Publication number Publication date
JPS6115983A (ja) 1986-01-24

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