JPH0546982B2 - - Google Patents

Info

Publication number
JPH0546982B2
JPH0546982B2 JP61219373A JP21937386A JPH0546982B2 JP H0546982 B2 JPH0546982 B2 JP H0546982B2 JP 61219373 A JP61219373 A JP 61219373A JP 21937386 A JP21937386 A JP 21937386A JP H0546982 B2 JPH0546982 B2 JP H0546982B2
Authority
JP
Japan
Prior art keywords
wafer
storage
wafers
carrier
carriers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61219373A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6376449A (ja
Inventor
Tsutomu Takahashi
Takemasa Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61219373A priority Critical patent/JPS6376449A/ja
Publication of JPS6376449A publication Critical patent/JPS6376449A/ja
Publication of JPH0546982B2 publication Critical patent/JPH0546982B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP61219373A 1986-09-19 1986-09-19 ウエハキヤリヤ治具 Granted JPS6376449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61219373A JPS6376449A (ja) 1986-09-19 1986-09-19 ウエハキヤリヤ治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61219373A JPS6376449A (ja) 1986-09-19 1986-09-19 ウエハキヤリヤ治具

Publications (2)

Publication Number Publication Date
JPS6376449A JPS6376449A (ja) 1988-04-06
JPH0546982B2 true JPH0546982B2 (enExample) 1993-07-15

Family

ID=16734398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61219373A Granted JPS6376449A (ja) 1986-09-19 1986-09-19 ウエハキヤリヤ治具

Country Status (1)

Country Link
JP (1) JPS6376449A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213532672U (zh) * 2021-03-19 2021-06-25 台湾积体电路制造股份有限公司 定位治具

Also Published As

Publication number Publication date
JPS6376449A (ja) 1988-04-06

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