JPH0546275Y2 - - Google Patents
Info
- Publication number
- JPH0546275Y2 JPH0546275Y2 JP1167488U JP1167488U JPH0546275Y2 JP H0546275 Y2 JPH0546275 Y2 JP H0546275Y2 JP 1167488 U JP1167488 U JP 1167488U JP 1167488 U JP1167488 U JP 1167488U JP H0546275 Y2 JPH0546275 Y2 JP H0546275Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- terminal
- notch
- side terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000000565 sealant Substances 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1167488U JPH0546275Y2 (enrdf_load_stackoverflow) | 1988-01-29 | 1988-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1167488U JPH0546275Y2 (enrdf_load_stackoverflow) | 1988-01-29 | 1988-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01116451U JPH01116451U (enrdf_load_stackoverflow) | 1989-08-07 |
| JPH0546275Y2 true JPH0546275Y2 (enrdf_load_stackoverflow) | 1993-12-03 |
Family
ID=31220437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1167488U Expired - Lifetime JPH0546275Y2 (enrdf_load_stackoverflow) | 1988-01-29 | 1988-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0546275Y2 (enrdf_load_stackoverflow) |
-
1988
- 1988-01-29 JP JP1167488U patent/JPH0546275Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01116451U (enrdf_load_stackoverflow) | 1989-08-07 |
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