JPH0545921U - Airtight terminal - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] To provide a hermetic terminal capable of performing highly reliable soldering which can be visually confirmed when soldering an hermetic package to a circuit board. [Structure] A frame-shaped seal ring 4 is provided on a base 1 made of an insulating material to form an airtight space 2, and a lead terminal is sealed from the back surface of the insulating material to project or expose the tip of the lead terminal in the airtight space. In addition, in the airtight terminal in which the outer end, which is the other end of the lead terminal, is extended outward along the back surface of the base and sealed to the base, the ridge line that constitutes the outer edge of the base to be sealed by the outer part is A notch 12 is provided in at least a part of the outer end portion 32.
Is sealed along the notch 12. [Effect] Since a large void is formed in the lower portion of the tip of the outer portion, and the solder is embedded in this void when soldering, the state of soldering can be visually confirmed.

Description

[Detailed description of the device]

[0001]

[Technical field of invention]

 The present invention relates to an airtight terminal, and more particularly, to an airtight terminal which has improved reliability of soldering when surface mounting an airtight package in which a semiconductor device, a circuit component, etc. are hermetically sealed, on a circuit board.

[0002]

[Prior art]

 As for the airtight terminal, for example, as shown in FIG. 3, a hook-shaped lead terminal 3 is made to penetrate from a back surface 11 of the base 1 into an airtight space 2 formed of a box-shaped base 1 made of glass. The outer part 31 is extended along the back surface 11 in the outer direction of the airtight terminal and sealed. A sealing ring 4 is provided on the upper end surface of the box-shaped base 1. In using such an airtight terminal, a circuit component (not shown) or the like is installed in the airtight space 2, electrically connected to the lead terminal 3, and covered with a lid 5 for crimping. Etc. are sealed airtight to form an airtight package.

[0003]

[Problems solved by the device]

 When connecting an airtight package in which circuit components and the like are airtightly sealed in the airtight terminal having such a structure to the circuit board 6, the outer portion 31 of the lead terminal 3 that extends the surface of the back surface 11 of the base 1 and The boards 6 are fixed to each other with solder 7.

In this case, since the thickness C of the solder layer 7 is generally as thin as several tens of μm or less, there is a drawback that it is not possible to visually confirm whether or not the solder is well soldered, and the reliability is low. There was a problem.

[0005]

[The purpose of the device]

 The present invention has been made in view of the above problems, and provides a hermetic terminal capable of performing highly reliable soldering which can be visually confirmed when soldering the above-mentioned hermetic package to a circuit board. The purpose is to

[0006]

[Means for solving problems]

 In order to solve the above-mentioned problems, the airtight terminal according to the present invention is provided with a frame-shaped seal ring on a base made of an insulating material to form an airtight space, and a lead terminal is sealed from the back surface of the insulating material. In the airtight terminal in which the tip of the lead terminal is projected or exposed in the airtight space, and the other end portion of the lead terminal is extended outward along the back surface of the base and sealed to the base, the outer portion A notch is provided in at least a part of a ridge line forming an outer edge of the base to be sealed, and the tip of the outer portion is sealed along the notch.

[0007]

【Example】

 According to the airtight terminal according to the present invention, as shown in FIGS. 1 and 2, a hook-shaped lead terminal 3 is provided in an airtight space 2 formed by a glass-made box-shaped base 1 and a seal ring 4. The outer surface 31 of the lead terminal 3 extends along the rear surface 11 in the outward direction of the airtight terminal and is sealed. A seal ring 4 is provided on the upper end surface of the box-shaped base 1.

In the structure as described above, the airtight terminal according to the present invention is provided with the notch 12 by cutting out the ridgeline of the base 1 forming the outer edge of the back surface 11. Then, the tip portion 32 of the outer portion 31 is sealed along with the notch 12 forming the inclined surface. Therefore, the void 8 is formed on the lower surface of the tip portion 32.

In the present embodiment, the notch 12 is formed on the entire ridgeline of the side to which the lead terminal 3 is sealed, but it may be formed only on the portion where the tip 32 of the lead terminal 3 is sealed. Good.

[0010]

[Action]

 In using such an airtight terminal, circuit parts and the like are sealed in the airtight space 2 and electrically connected to the lead terminals 3, and then the seal ring 4 is covered with a lid to hermetically seal. Then, the circuit board 6 is bonded with solder 7. At this time, since the void 8 is formed in the lower portion of the tip portion 32 of the outer portion 31 of the lead terminal 3, the battery 7 has not only the lower portion of the outer portion 31 but also the void 8 in the lower portion of the tip portion 32. Will be filled (see Figure 2). Since the notch 12 is an inclined surface, the void 8 becomes significantly thicker than the thickness C of the conventional solder layer 7, and therefore the solder 7 can be seen from the side direction of the airtight terminal.

[0011]

[Effect of the device]

 As described above, according to the airtight terminal of the present invention, at least a part of the ridge line that constitutes the outer edge of the base to be sealed at the outer portion of the lead terminal is provided with a notch, and the tip of the outer portion is formed as described above. Since it was sealed along with the notch, a large void would be formed in the lower part of the tip. When soldering, the voids are filled with solder, so that the soldering state can be visually confirmed. Therefore, there is an advantage that reliability of soldering is improved. Further, since the tip portion is sealed with the notch that is an inclined surface, the lead terminal sealing distance becomes long, and this also has the advantage of improving reliability.

[Brief description of drawings]

FIG. 1 is a partial perspective view of an airtight terminal according to the present invention.

FIG. 2 is a sectional view of a main part of the airtight terminal.

FIG. 3 is a sectional view of a conventional airtight terminal.

FIG. 4 is a sectional view of a main part of a conventional airtight terminal.

[Explanation of symbols]

 1 Base 11 Back 12 Cutout 2 Airtight Space 3 Lead Terminal 31 Outer Part 32 Tip 4 Seal Ring 6 Circuit Board 7 Solder 8 Void

Claims (1)

[Scope of utility model registration request] 1. A frame-shaped seal ring is provided on a base made of an insulating material to form an airtight space, and a lead terminal is sealed from the back surface of the insulating material to project or expose the tip of the lead terminal in the airtight space. In the airtight terminal in which the outer portion, which is the other end portion of the lead terminal, is further extended outward along the back surface of the base and sealed to the base,
A hermetic terminal, characterized in that at least a part of a ridge line forming an outer edge of a base to be sealed of the outer portion is provided with a notch, and a tip portion of the outer portion is sealed along the notch.