JPH043408Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of the Invention] The present invention relates to an airtight terminal used to hermetically encapsulate circuit components.

[Background of the idea]

Conventionally, an airtight terminal, for example, an airtight terminal with an integral lead wire sealed thereto, has a lead insertion hole 3 formed in a side wall 2 erected on the periphery of a base 1 having a rectangular plate shape, etc., as shown in FIGS. 1 and 2. A lead 4 is inserted into the lead insertion hole 3 and sealed with an insulating material 5. Such an airtight terminal is constructed by electrically connecting the tip of the lead 4 protruding into the airtight space formed by the side wall 2 to the circuit component 7 by bonding or the like, and then covering the terminal with a cover 8 and crimping it to the side wall 2. This allows the circuit component 7 to be hermetically sealed.

To connect such an airtight package in which circuit components are hermetically sealed to the circuit board 6, use the leads 4.
This was done by bending the outer part of the board into a crank shape and bonding the tip part to the circuit board 6 with solder or the like. In this case, the airtight package containing the circuit component 7 is spaced apart from the circuit board 6.
That is, the connection must be made so that the base 1 of the hermetic terminal does not come into contact with the circuit board 6. This is because the base 1 itself serves as an electrically conductive path.

However, when using circuit components sealed with airtight terminals as described above in electrical equipment,
As mentioned above, the airtight package is placed upright apart from the circuit board 6, and the leads protrude in the left and right directions, resulting in the airtight package occupying a significantly larger volume than the circuit component itself. was.

The occupation of such a volume is extremely disadvantageous in miniaturizing electrical equipment and the like, and in the case of electrical equipment having a complicated structure using a large number of circuit parts.

In addition, since the leads 4 are bent into a crank shape after being sealed in the lead insertion hole 3 of the side wall 2, there is a risk that the insulating material 5, such as glass, may be cracked during this bending.

Furthermore, the conventional hermetic terminal has the disadvantage that the length of the lead 4 sealed with the insulating material 5 is limited to the thickness of the side wall 2, as shown in FIG. In order to improve the wear strength,
It was necessary to increase the thickness of the side wall 2.

[Summary of the idea]

This invention was made in view of the above points,
To provide an airtight terminal capable of constructing an airtight package that requires a smaller occupied volume than that occupied by a conventional airtight package that hermetically encapsulates circuit components, and without increasing the wall thickness of the side wall. The object of the present invention is to provide an airtight terminal with improved lead sealing strength.

Therefore, the airtight terminal according to the present invention has a side wall with a lead insertion hole erected on the periphery of the base, a lead is inserted into the lead insertion hole, and the airtight terminal is sealed with an insulating material. The side wall near the hole is thinner than the upper part of the side wall from the base to at least the lower end of the lead insertion hole, and the lead has a lead inner part and a lead outer part extending parallel to each other, and the lead inner part. and a lead connecting portion for connecting the lead outer portion, the inner lead portion protrudes into the side wall, the outer lead portion extends outward from the side wall, and at least one surface of the lead connecting portion is connected to the side wall portion. It is characterized in that it is sealed and sealed to the lead wire insertion hole so that at least one surface is exposed to the outside.

[Specific explanation of the idea]

An embodiment of the present invention will be described based on the drawings.

FIG. 3 is a perspective view of an embodiment of the present invention, and FIG. 4 is a sectional view of this embodiment. As is clear from FIGS. 3 and 4, the peripheral edge of the rectangular plate-shaped base 1 A side wall 2 is erected on the side wall 2 to constitute an airtight terminal body. A lead insertion hole 3 is formed in the side wall 2, and a lead 4 is sealed to the lead insertion hole 3 with an insulating material 5.

In this embodiment, as is clear from FIGS. 3 and 4, the lead 4 sealed to the side wall 2 has a lead inner part 40 and a lead outer part 41 that are parallel to each other. A lead connecting portion 42 is provided to connect the portion 40 and the lead outer portion 41. This lead connecting portion 42 is vertically connected to the outer portion 51 and the inner portion 50, respectively, and is formed in a so-called crank shape in cross section.

The lead inner part 40 is inserted through the lead insertion hole 3 formed in the side wall 2, and its tip protrudes into the airtight terminal.The lead connecting part 42, which is vertically connected to the lead inner part 40, has one side airtight. The lead outer portion 41 is sealed with an insulating material 5 so as to be exposed on the side surface of the terminal and to extend outward. In this case, the lead connecting portion 42 may be made to protrude slightly beyond the back surface of the base 1 as shown by the broken line in FIG. 4, or the lead outer portion 52 may be extended on the same level as the back surface of the base 1. You may also do so. When the lead outer portion 52 extends on the same level as the back surface of the base 1, the base 1 comes into contact with the circuit board 6, so it is necessary to apply an insulating material to the back surface of the base 1. Insulation treatment is required.

As mentioned above, since the base 1 or the side wall 2 becomes an electrically conductive path, the lead 4 is connected to the side wall 2 of the hermetic terminal.
and must not touch base 1. Therefore, at least the side wall from the lower end of the lead insertion hole 3 of the side wall 2 to the base 1, that is, the lower side wall 20, is designed so that the lead does not come into contact with the connecting portion 42 of the lead 4 when the lead 4 is sealed. Insertion hole 3
The wall thickness is smaller than that of the upper side wall 21 of the upper part.

In the airtight terminal according to the present invention, in the embodiment shown by A in FIG. is made thin, and a structure is adopted in which this thin portion is entirely covered with an insulating material 5. Further, in the embodiment shown by B in FIG. 3, the lower side wall 20 is provided only in the vicinity of the lead insertion hole 3, and the portion where the lead insertion hole 3 is not formed becomes the side wall 2 of normal thickness. ing.

In the airtight terminal as described above, the circuit component is electrically connected to the lead inner part 40 protruding into the airtight terminal by bonding or the like, and then the cover 8 is covered and bonded in the same manner as in the past to make the circuit component airtight. It is to be enclosed. However, when using this airtight terminal to connect an airtight package in which circuit components are hermetically sealed to the circuit board 6, after encapsulating the circuit components, the lead outer portion 41 is cut as shown by the arrow in FIG. Connection can be made by bonding the exposed surface of the connecting portion 42 and the underlying circuit board 6 using solder or the like. Therefore, there is an advantage that the lead 4 does not protrude to the side of the airtight package as in the conventional case, and the volume occupied by the airtight package is significantly reduced. Further, even if the lead connecting portion 42 is made to protrude slightly from the back surface of the base 1, it will not be as high as the foot as in the conventional case, and the volume occupied in the vertical direction is also reduced.

In addition, since the portion of the lead 4 that is sealed by the insulating material 5 is not only the thick portion of the upper side wall 21 but also the portion of the lead connection portion 42, the sealing strength is significantly higher than that of conventional airtight terminals. Rise.

FIG. 5 is a sectional view of a second embodiment of the airtight terminal according to the present invention. As is clear from FIG. 5, in this embodiment, the upper side wall 21 is Notch 22
is formed. In this embodiment, as compared to the embodiments shown in FIGS. 3 and 4, the insulating material 5 is also provided in this notch 22.
The sealing strength of the leads 4 is further improved.

Even in the airtight package in which the circuit components are enclosed by the airtight terminal in this embodiment, when connecting to the circuit airtight terminal 6, the lead outer portion 41 is cut as shown by the arrow in FIG.

As mentioned above, when encapsulating circuit components using the airtight terminals shown in FIGS. 3 to 5, the circuit components are connected to the lead inner part 40 and then covered with the cover 8 and crimped. However, during this crimping, an undesirable pressure load is applied to the insulating material 5, which may cause cracks in the insulating material 5. In order to prevent the occurrence of such cracks, it is preferable to provide a notch 23 near the upper end of the upper side wall 21 as shown by the two-dot chain line in FIG.
This cut 23 may be on the outside or inside of the side wall 2 of the hermetic terminal, and the cut 23 may be on the outside or inside of the side wall 2 of the airtight terminal.
The shape of 3 is also not limited. for example,
It may also be a wedge-shaped cut 23 as shown in FIG.

Further, an adhesive flange 24 may be formed at the upper end of the upper side wall 21 and protrudes outward. In this case, since the crimping with the cover 8 is performed at the adhesive flange 24, no pressure load is applied to the insulating material 5 during crimping, and there is no possibility that the insulating material 5 will crack.

Furthermore, the shape of the lead 4 is not limited, and may be a flat plate shaped like a crank as shown in FIGS. 3 to 5.
However, it is also possible to use specially shaped leads such as those shown in Figures 6a-d. That is, in FIG. 6a, the lead connecting portion 42 is curved, and when cutting at the arrowed portion, this curved portion becomes a pool of solder, which functions to improve the adhesive strength with the circuit board. The same applies to FIG. 6b, in which the area of the lead connection portion 42 is increased to improve solder adhesion to the circuit board.
The lead 4 shown in FIG. 6c, like the lead shown in FIG. 6a, has a box-shaped lead connecting portion 42 to form a solder pool to improve adhesive strength.

FIG. 6d shows a lead in which a notch is formed in the cut portion of the lead to make it easier to cut.

[Effect of idea]

As explained above, according to the airtight terminal according to the present invention, the lead is made into a crank shape and the lead connection part of the lead is exposed on the side wall of the airtight terminal, so that the sealing strength of the lead is improved. However, there is an additional advantage that an airtight package can be constructed that occupies a small volume. Furthermore, since there is no need to bend the leads after manufacturing the airtight package, there is also the advantage that cracks in the insulating material, which may occur when bending the leads, are no longer generated.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional airtight terminal, FIG. 2 is a cross-sectional view of the airtight terminal, FIG. 3 is a perspective view of an embodiment of the airtight terminal according to the present invention, and FIG. 4 is a seal of the embodiment. FIG. 5 is a sectional view of a sealed portion of another embodiment of the airtight terminal according to the present invention, and FIG. 6 is a perspective view showing an example of a lead used in the present invention. 1... Base, 2... Side wall, 20... Lower side wall, 21... Upper side wall, 3... Lead insertion hole, 4
...Lead, 40...Lead inner part, 41...
...Lead outer part, 42...Lead connection part, 5
……Insulating material.

Claims (1)

[Scope of utility model registration request] In an airtight terminal in which a side wall with a lead insertion hole is provided on the periphery of the base, a lead is inserted into the lead insertion hole, and the lead is sealed with an insulating material, at least the side wall near the lead insertion hole is at least wider than the base. The wall thickness of the lead insertion hole is thinner than the upper part up to the lower end of the lead insertion hole, and the lead has a lead inner part and a lead outer part that extend parallel to each other, and a lead connecting part that connects the lead inner part and the lead outer part. the lead inner part protrudes into the side wall, the lead outer part extends outward from the side wall, at least one surface of the lead connection part is sealed to the side wall part, and at least one surface is exposed to the outside. An airtight terminal characterized by being sealed in a lead wire insertion hole so as to be exposed.