JPH0357020Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of the Invention] The present invention relates to an airtight terminal used to hermetically encapsulate circuit components.

[Background of the idea]

Conventionally, an airtight terminal, for example, an airtight terminal with an integral lead wire sealed thereto, has a lead insertion hole 3 formed in a side wall 2 erected on the periphery of a base 1 having a rectangular plate shape, etc., as shown in FIGS. 1 and 2. A lead 4 is inserted into the lead insertion hole 3 and sealed with an insulating material 5. Such an airtight terminal is constructed by electrically connecting the tip of the lead 4 protruding into the airtight space formed by the side wall 2 to the circuit component 7 by bonding or the like, and then covering the terminal with a cover 8 and crimping it to the side wall 2. This allows the circuit component 7 to be hermetically sealed.

In order to connect such an airtight package in which circuit components are hermetically sealed to the circuit board 6, use the leads 4.
This was done by bending the outer part of the cable into a crank shape and bonding the tip part to the circuit board 6 with solder or the like. In this case, the hermetic package in which the circuit component 7 is encapsulated must be connected to the circuit board 6 so as to be spaced apart from it, that is, so that the base 1 of the hermetic terminal does not come into contact with the circuit board 6. This is because the base 1 itself serves as an electrically conductive path.

However, when using circuit components sealed with airtight terminals as described above in electrical equipment,
As mentioned above, the airtight package is erected apart from the circuit board 6, and the leads protrude in the left and right directions, resulting in the airtight package occupying a significantly larger volume than the circuit component itself. was.

Such volume occupancy is extremely disadvantageous when it comes to downsizing electrical equipment and the like, and for electrical equipment with complex configurations that use a large number of circuit parts.

In addition, since the leads 4 are bent into a crank shape after being sealed in the lead insertion hole 3 of the side wall 2, there is a risk that the insulating material 5, such as glass, may be cracked during this bending.

Furthermore, the conventional hermetic terminal has the disadvantage that the length of the lead 4 sealed with the insulating material 5 is limited to the thickness of the side wall 2, as shown in FIG. In order to improve the wearing strength,
It was necessary to increase the thickness of the side wall 2.

[Summary of the idea]

This invention was made in view of the above points,
To provide an airtight terminal capable of constructing an airtight package that requires a smaller occupied volume than that occupied by a conventional airtight package that hermetically encapsulates circuit components, and without increasing the wall thickness of the side wall. The object of the present invention is to provide an airtight terminal with improved lead sealing strength.

Therefore, the airtight terminal according to the present invention has a side wall with a lead insertion hole erected on the periphery of the base, a lead is inserted into the lead insertion hole, and the airtight terminal is sealed with an insulating material. The side wall provided with the hole is inclined outwardly, and the lead includes a lead inner part and a lead outer part extending parallel to each other, and a lead connecting part connecting the lead inner part and the lead outer part, an inner lead portion protrudes into the side wall, the outer lead portion extends outward from the side wall, and at least one surface of the lead connection portion is sealed to the side wall portion;
The lead wire insertion hole is sealed so that at least one surface thereof is exposed to the outside.

[Specific explanation of the idea]

An embodiment of the present invention will be described based on the drawings.

FIG. 3 is a perspective view of an embodiment of the present invention, and FIG. 4 is a sectional view of this embodiment. As is clear from FIGS. 3 and 4, the peripheral edge of the rectangular plate-shaped base 1 A side wall 2 is erected to constitute an airtight terminal body, and this side wall 2 is provided with a lead insertion hole 3, into which a lead 4 is sealed with an insulating material 5. ing.

As is clear from Figures 3 and 4,
In the airtight terminal according to the present invention, the side wall 2 is erected at an angle from the base 1, and the side wall 2
The lead 4 to be sealed has a lead inner part 40 and a lead outer part 41 which are parallel to each other, and a lead connecting part 42 is provided to connect the lead inner part 40 and the lead outer part 41. This lead connection portion 42 is connected to the outer portion 51.
and are vertically connected to the inner portion 50, respectively, and are formed in a so-called crank shape in cross section.

The lead inner part 40 is inserted through the lead insertion hole 3 drilled in the side wall 2, and its tip protrudes into the airtight terminal.The lead connecting part 42, which is vertically connected to the lead inner part 40, has one surface insulated. The lead outer portion 41 is further sealed with an insulating material 5 so as to be exposed from the material 5 and extend outward. In other words, not only the lead insertion hole 3 but also
By embedding the insulating material 5 in the lower portion of the side wall 2 formed by the slope of the side wall 2, the lead connecting portion 42 is sealed so as to be embedded in the insulating material 5 with one side exposed.

As shown in FIG. 4, the lead connecting portion 42 may protrude slightly from the back surface of the base, or the lead outer portion 52 may extend on the same level as the back surface of the base 1. In this way, when the lead outer portion 52 extends on the same level as the back surface of the base 1, the base 1 comes into contact with the circuit board 6, so the base 1
Insulation treatment such as applying an insulating material to the back side of the device is required.

In the airtight terminal as described above, the circuit component is electrically connected to the lead inner part 40 protruding into the airtight terminal by bonding or the like, and then the cover 8 is covered and bonded in the same manner as in the past to make the circuit component airtight. It is to be enclosed. However, when using this airtight terminal to connect an airtight package in which circuit components are hermetically sealed to the circuit board 6, after encapsulating the circuit components, the lead outer portion 41 is cut as shown by the arrow in FIG. Connection can be made by bonding the exposed surface of the connecting portion 42 and the underlying circuit board 6 using solder or the like. Therefore, there is an advantage that the lead 4 does not protrude to the side of the airtight package as in the conventional case, and the volume occupied by the airtight package is significantly reduced. Further, even if the lead connecting portion 42 is made to protrude slightly from the back surface of the base 1, it will not be as high as the foot as in the conventional case, and the volume occupied in the vertical direction is also reduced.

Furthermore, since the portion of the lead 4 sealed with the insulating material 5 is not only the thick portion of the upper side wall 21 but also the portion of the lead connection portion 42, the sealing strength is lower than that of a conventional airtight terminal. rises significantly.

FIG. 5 is a cross-sectional view of the sealing portion of the second embodiment of the present invention, and as is clear from this figure, the leads 4 are formed in a Z-shape in this embodiment. In this case, the exposed surface portion 4 of the lead connection portion 42
A gap 420 is formed on the outer side of 2, and when the lead outer part 41 is cut at the part indicated by the arrow, this gap 420 becomes a solder pool for connecting the circuit board, and the connection between the board and the airtight package. The advantage is that the connection strength is improved.

As mentioned above, when encapsulating circuit components using the airtight terminals shown in FIGS. 3 to 5, the circuit components are connected to the lead inner part 40 and then covered with the cover 8 and crimped. However, during this crimping, an undesirable pressure load is applied to the insulating material 5, which may cause cracks in the insulating material 5. In order to prevent the occurrence of such cracks, it is preferable to provide a notch 20 as shown by the two-dot chain line in FIG. 4 near the upper end of the side wall. The shape of this cut 20 is not limited. For example, it may be a wedge-shaped cut 20 as shown in FIG. Further, an adhesive flange 21 may be formed at the upper end of the side wall and protrudes outward. In this case, since the crimping with the cover 8 is performed at the adhesive flange 21, no pressure load is applied to the insulating material 5 during crimping.
There is no possibility of cracks occurring in the insulating material 5.

Furthermore, the shape of the lead 4 is not limited, and may be a flat plate shaped like a crank as shown in FIGS. 3 to 5. However, it is also possible to use specially shaped leads such as those shown in Figures 6a-d. That is, in FIG. 6a, the lead connecting portion 42 is curved, and when cutting at the arrowed portion, this curved portion becomes a pool of solder, which functions to improve the adhesive strength with the circuit board. The same applies to FIG. 6b, in which the area of the lead connection portion 42 is increased to improve solder adhesion to the circuit board. The lead 4 shown in FIG. 6c forms a solder pool with the box-shaped lead connection part 42, similar to the lead shown in FIG. 6a, to improve adhesive strength.

FIG. 6d shows a lead in which a notch is formed in the cut portion of the lead to make it easier to cut.

[Effect of idea]

As explained above, according to the airtight terminal according to the present invention, the leads are made into a crank shape or a Z-shape, the side walls are inclined, and the lead connection portion of the lead is exposed to the insulating material provided at the inclined portion. This has the advantage that the sealing strength of the leads is improved and an airtight package with a smaller occupied volume can be constructed. Furthermore, since there is no need to bend the leads after manufacturing the airtight package, there is also the advantage that cracks in the insulating material, which may occur when bending the leads, are no longer generated.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional airtight terminal, FIG. 2 is a cross-sectional view of the airtight terminal, FIG. 3 is a perspective view of an embodiment of the airtight terminal according to the present invention, and FIG. 4 is a seal of the embodiment. FIG. 5 is a sectional view of a sealed portion of another embodiment of the airtight terminal according to the present invention, and FIG. 6 is a perspective view showing an example of a lead used in the present invention. 1... Base, 2... Side wall, 20... Lower side wall, 21... Upper side wall, 3... Lead insertion hole, 4
...Lead, 40...Lead inner part, 41...
...Lead outer part, 42...Lead connection part, 5
……Insulating material.

Claims (1)

[Scope of utility model registration request] In an airtight terminal in which a side wall provided with a lead insertion hole is erected on the periphery of the base, a lead is inserted into the lead insertion hole and sealed with an insulating material, at least the side wall provided with the lead insertion hole is directed outward. and the lead includes a lead inner part and a lead outer part that extend parallel to each other, and a lead connecting part that connects the lead inner part and the lead outer part, and the lead inner part projects into the side wall; The lead outer portion extends outward from the side wall, and the lead connecting portion is sealed to the lead wire insertion hole such that at least one surface thereof is sealed to the side wall portion and at least one surface is exposed to the outside. An airtight terminal characterized by: