JPH054507U - Dual in-line package - Google Patents

Abstract

(57) [Abstract] [Purpose] Absorbs the stress caused by the difference in the coefficient of thermal expansion between the package part that protects the semiconductor integrated circuit and the substrate,
Get leads to protect the soldered part. [Structure] From the tip to the base has the same thin width as the tip,
The lead 2 having the tsukuba 3 is attached to the package portion 1 that protects the semiconductor integrated circuit, and the stress generated due to the difference in thermal expansion coefficient between the package portion 1 and the substrate is absorbed. Further, the collar 3 provided on the lead 2 makes a predetermined distance between the package portion 1 and the substrate, and the lead 2 has further flexibility by the distance.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a lead structure of a dual inline package.

[0002]

[Prior Art]

 FIG. 2 is a diagram showing a conventional dual in-line package (hereinafter simply referred to as a package). In the figure, 1 is a package portion for protecting a semiconductor integrated circuit, and 2 is a lead.

The conventional package is configured as described above, and for example, when soldering the package, even the thin portion of the tip of the lead 2 is inserted into the through hole of the substrate and soldered.

[0004]

[Problems to be solved by the device]

 In the above package, the lead 2 supports the package portion 1 protecting the package, and stress is applied to the soldering portion of the lead 2 due to the difference in thermal expansion coefficient between the package portion 1 and the board. Since the lead 2 is thick, the lead 2 cannot absorb the stress, which causes a problem such as cracks in the solder at the soldering portion of the lead 2.

The present invention has been made to solve such a problem, and has a structure for absorbing stress generated due to a difference in thermal expansion coefficient between a package portion protecting a semiconductor integrated circuit and a substrate. Intended to provide leads.

[0006]

[Means for Solving the Problems]

 The package according to the present invention has a thin lead and is flexible and has a through board so that the stress generated due to the difference in thermal expansion coefficient between the package part protecting the semiconductor integrated circuit and the substrate can be absorbed. The lead is provided with a collar so that when the lead is inserted into the hole, the package stops at an appropriate height from the substrate.

[0007]

[Action]

 This device has the same thin width from the tip of the lead to the base as the tip, and because it is flexible, it can absorb the stress generated due to the difference in thermal expansion coefficient between the package part that protects the semiconductor integrated circuit and the substrate. .

Further, the collar provided on the lead makes an appropriate distance between the package and the substrate, and the lead becomes more flexible by the distance. As a result, the lead can further absorb the stress generated due to the difference in thermal expansion coefficient between the package portion protecting the semiconductor integrated circuit and the substrate.

[0009]

【Example】

 Example 1. FIG. 1 is a diagram showing an embodiment of the present invention, and 1 is exactly the same as the above-mentioned conventional one. 2 is a lead having the same thin width as the tip from the tip to the base. 3 is a brim provided on the lead.

In the package having the lead structure as described above, the stress generated due to the difference in the thermal expansion coefficient between the package portion 1 protecting the semiconductor integrated circuit and the substrate is applied to the lead 2 having the same thin width from the tip to the root. , Can be absorbed.

Further, the collar 3 provided on the lead 2 makes an appropriate distance between the package and the substrate, and the lead becomes more flexible by the distance.

[0012]

[Effect of the device]

 Since the present invention is configured as described above, it has the following effects.

The thermal expansion of the package portion and the substrate protecting the semiconductor integrated circuit can be achieved by thinning the lead of the package from the tip to the base in the same thickness as the tip and providing a collar in the middle of the lead. The stress generated by the difference in the coefficient can be absorbed and the soldered part can be protected.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a conventional dual in-line package.

[Explanation of symbols]

 1 package part 2 lead 3 brim

Claims (1)

Claims for utility model registration 1. A dual in-line package having the same narrow width from the root of the lead to the tip and having a collar.