JPS5963751A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a device which can be easily mounted on a substrate by having linear external leads led out from a sealed outer shell and external leads with tips bent rectangularly before the most tip of the linear form. CONSTITUTION:The leads 9-11 led out of the sealed outer shell 1 have the linear parts 14-16, and the leads 12 and 13 have the parts 17 and 18 bent rectangularly. The leads 9-11 are inserted into through holes of the substrate 5, and thus mounted on the substrate 5 with the bent parts of the leads 12 and 13 as stoppers. This constitution does not lose stopper function even when the lead width is reduced; therefore the number of leads which can be led out of a package of a specific size increases, and accordingly an IC device of a substantially high integration degree can be loaded. This constitution can be applied to any one of a dual line type and single-in-line type packages, and remarkable miniaturization can be realized by the reduction of lead center intervals.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a semiconductor that achieves high integration of system circuits and miniaturization of packages that can accommodate high-density packaging, and that can be easily mounted on high-density wiring boards. Regarding equipment.

Conventional configurations and their problems In video equipment, audio equipment, and the like, efforts are being made not only to improve the six functions of the equipment, but also to make the equipment itself smaller and lighter. In order to address the latter, efforts are being made to make system circuits smaller and lighter.In particular, efforts are being made to increase the integration of circuits and to miniaturize the packages of semiconductor integrated circuits that make this possible. Power is being poured into it. In particular, as the degree of integration of semiconductor integrated circuits increases, the number of external leads usually increases, making it inevitable to increase the size of the package. This contradicts the above efforts.

In addition, when attaching a semiconductor device to a printed circuit board when manufacturing a system circuit, there are two methods: inserting the external leads into lead insertion holes formed on the printed circuit board and fixing them by soldering, or directly attaching the external leads to the wiring layer of the printed circuit board. One of the methods of soldering is used.

However, in the former method, it is necessary to form the same number of glued insertion holes as the external leads of the semiconductor device on the printed circuit board, and the restrictions on the spacing between these insertion holes also impose restrictions on the spacing between the leads of the semiconductor device. Where can I get it?
It was not possible to achieve a lead spacing that would allow for miniaturization of the package. On the other hand, in the latter method,
Since it is not necessary to form lead insertion holes in the printed circuit board, the lead spacing of the semiconductor device mounted on this board can be narrowed, allowing for smaller packages and higher integration and higher density packaging of system circuits. What can be achieved? However, in this method, only the wiring layer formation side of the printed circuit board is used, and therefore, when mounting the semiconductor device, it is necessary to fix it. In particular, when mounting is performed automatically, it is necessary to provide a fixing means and use this to fix the semiconductor device.

FIG. 1 is a diagram showing a state in which external leads of a semiconductor integrated circuit having a known dual in-line package structure are inserted into lead insertion holes formed in a printed circuit board. As shown in the figure, the external leads 2, 3, and 4 led out from the sealing shell 1 have narrow tip portions, and these portions are connected to the external lead insertion holes 6 and 4 of the printed circuit board 5, respectively.
7 and 8, and the connecting portion A between this tip and the wide lead portion serves as a stopper portion for regulating the insertion depth. If this stopper part A is eliminated,
The pitch of the external leads can be reduced by narrowing the width of the external leads over their entire length, making the package more compact. This is where it touches, solder 3
During +J, the melted solder spreads between the contact surfaces due to capillary action, which may cause a short circuit accident. In order to suppress such inconveniences, it is important to have an external lead shape that has the above-mentioned stopper part.Therefore, there is a limit to reducing the pitch of the external leads, and this causes problems with the package. This was the main factor hindering miniaturization.

OBJECTS OF THE INVENTION It is an object of the present invention to provide a semiconductor device having a structure that eliminates the problems described above and allows high integration and high-density packaging of system circuits.

Composition of the Invention In the semiconductor device of the present invention, a plurality of external leads led out from a sealed outer shell have at least a straight portion inserted into an external lead insertion hole formed in a printed circuit board at the tip thereof. a first external lead held in the body; and a distal end portion that is bent in a direction substantially perpendicular to the leading direction of the straight portion at a position that does not reach the distal end of the straight portion of the first external lead. The semiconductor device is fixed by inserting the first external lead into the external lead insertion hole of the printed circuit board;
The bent tip portion of the second external lead regulates the insertion depth of the first external lead into the external lead insertion hole of the printed circuit board.

DESCRIPTION OF EMBODIMENTS FIG. 2 is a perspective view showing the configuration of a dual in-line semiconductor integrated circuit according to an embodiment of the present invention, in which a predetermined number of external leads are led out from both sides of a sealed outer shell. . In the figure, external leads 9, 10,
11, 12 and 13 are clearly indicated. By the way, the external lead 9-11 has straight portions 14, 15 and 16 bent approximately at right angles to the direction in which the external lead is led,
On the other hand, the external leads 12 and 13 have portions 17 and 18 that are bent (17u) in a direction perpendicular to the straight portions of the external leads 9-11. The widths of these external leads are the same over their entire length.

The printed circuit board to which the semiconductor device of the present invention having such external leads can be attached is 5. External lead 9~
In this structure, a first wiring layer is formed on the back surface side corresponding to 11, and a second wiring layer is also formed on the front surface side corresponding to external leads 12 and 13.

3 is a diagram showing a state in which the Puar in-line type semiconductor integrated circuit shown in FIG. 2 is attached to a printed circuit board having the above structure, and is shown cut along the line There is. In the figure, 19, 20 are wiring layers formed on the back side of the printed circuit board 5, 21, . Reference numeral 22 denotes a wiring layer formed on the front side, and 23, 24, 25 and 26 denote solder for fixing external leads to the wiring layer. As shown in the figure, among the external leads led out from the sealing outer shell 1 of the semiconductor device,
An external lead 1°100 having straight portions 15 and 150 passes through the external lead insertion hole of the printed circuit board 6 and connects to the wiring layer 19.
and 20 to solder 23. , 24, while
The external leads having bent portions 18 and 180 come into contact with wiring layers 21 and 22 formed on the front surface of the printed circuit board 5, and are fixed with solders 25 and 26.

According to the structure of this type of installation, the external leads that pass through the external lead insertion holes of the printed circuit board 5 perform a fixing function during mounting, and the external leads with bent portions perform a stopper function during mounting. This is where it will be demonstrated.

FIG. 4 is a perspective view showing a single in-line type semiconductor integrated circuit according to another embodiment of the present invention, in which external leads 27.2B, 29.30 and 31 are led out straight, while external lead 32 .33.degree. 34 and 35 are provided with bent portions 36.degree. 37.38 and 39 at their tips, which are bent approximately at right angles to the leading direction. This single in-line type semiconductor integrated circuit also exhibits the same function as the dual in-line type semiconductor integrated circuit shown in FIG. 82 when mounted on a printed circuit board.

By the way, the center line spacing (external lead pitch) of external leads of a dual-in-life type semiconductor integrated circuit is set at 2.54M according to the MIL standard. In the dual in-line semiconductor integrated circuit of the present invention shown in 2nd→, it is not necessary to provide a stopper function by varying the width of each external lead, and the width of the external lead is extended over its entire length to the outside of the syblint board. Since it may have a width that allows insertion into the lead insertion hole, the center line spacing between external leads 9 and 10, 10 and 11 is set to 2.54M, and external leads 12 and 13 are arranged between them. I was able to do that.

When such an external lead arrangement is adopted, the center line spacing of the external leads is substantially 1.27 mm, which is one half of that of the conventional one. Therefore, the package can be significantly downsized.

Effects of the Invention In the semiconductor device of the present invention, as described above, even if the width of the external lead wire is narrower than that of the conventional one, the stopper function for regulating the insertion depth of the external lead when mounted on a printed circuit board is not lost. Therefore, it is possible to make the package smaller by reducing the lead-out pitch of the external leads. In addition, since there is still a structural part where the external leads are inserted into the external lead insertion holes of the printed circuit board, there is no need to provide any special means to secure the semiconductor device during mounting, and automatic mounting to the printed circuit board is possible. Become. moreover,
According to the present invention, the number of external leads that can be led out from a package of a specific size is increased, so when the size of the package is specified, the semiconductor integrated circuit elements that can be enclosed in the package are of high quality. It may be integrated,
It is possible to realize a semiconductor integrated circuit with substantially the same degree of integration.

This leads to higher integration and higher density packaging of system circuits, and has the effect of reducing the size and weight of equipment including this system circuit.

Note that in the semiconductor devices of the present invention shown in the examples above, the shapes of the external leads are different from each other;
The arrangement of the external leads is not limited to that of this embodiment.

In other words, if the external leads that function to regulate the insertion depth of the external leads during mounting and the external leads that function as temporary fixing to the printed circuit board coexist, the intended purpose will be achieved. can do.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the external lead shape of a known dual in-line semiconductor integrated circuit and the state in which the external lead is inserted into the external lead insertion hole of a printed circuit board. FIG. 3 is a perspective view showing such a dual in-line semiconductor integrated circuit, FIG. 3 is a view showing the dual in-line semiconductor integrated circuit shown in FIG. 2 mounted on a printed circuit board, and FIG. FIG. 1 is a perspective view showing a single in-line semiconductor integrated circuit according to an embodiment of the present invention. 1...Sealing outer shell, 2-4, 9-13.27-3
5.100... External lead, 5... Printed circuit board, 6-8... External lead insertion hole, 1
4-16°150... Straight portion, 17, 18.
36~39°180...Bending part, 19~
22...Wiring layer, 23-26...Solder. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] (1) A plurality of external leads led out from the sealing outer shell are
A first external lead having at least a straight part at its tip to be inserted into the external lead insertion hole of the mounting board, and a first external lead having a straight part inserted into the external lead insertion hole of the mounting board at a position that does not reach the leading edge of the straight part of the first external lead. 1. A semiconductor device comprising a second external lead having a tip portion bent in a direction substantially perpendicular to a direction in which the shaped portion is led out. (2) The semiconductor device according to claim 1, wherein the width of the external lead is constant over its entire length. (3) The semiconductor device according to claim 1, wherein the semiconductor device has a dual in-line package structure in which the external leads are led out from two opposing sides of the sealing shell. (4) The semiconductor device according to claim 1, wherein the semiconductor device has a single in-line package structure in which the external leads are aligned and led out from one surface of the sealing shell. (6) The arrangement of the first external lead and the second external lead is
2. The semiconductor device according to claim 1, wherein the semiconductor device is arranged alternately.