JPH0543482Y2 - - Google Patents
Info
- Publication number
- JPH0543482Y2 JPH0543482Y2 JP1988000883U JP88388U JPH0543482Y2 JP H0543482 Y2 JPH0543482 Y2 JP H0543482Y2 JP 1988000883 U JP1988000883 U JP 1988000883U JP 88388 U JP88388 U JP 88388U JP H0543482 Y2 JPH0543482 Y2 JP H0543482Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- cooling structure
- cooling pipe
- heat
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/07351—
-
- H10W72/30—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000883U JPH0543482Y2 (cg-RX-API-DMAC10.html) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000883U JPH0543482Y2 (cg-RX-API-DMAC10.html) | 1988-01-08 | 1988-01-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01107148U JPH01107148U (cg-RX-API-DMAC10.html) | 1989-07-19 |
| JPH0543482Y2 true JPH0543482Y2 (cg-RX-API-DMAC10.html) | 1993-11-02 |
Family
ID=31200286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988000883U Expired - Lifetime JPH0543482Y2 (cg-RX-API-DMAC10.html) | 1988-01-08 | 1988-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543482Y2 (cg-RX-API-DMAC10.html) |
-
1988
- 1988-01-08 JP JP1988000883U patent/JPH0543482Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01107148U (cg-RX-API-DMAC10.html) | 1989-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5307236A (en) | Heatsink for contact with multiple electronic components mounted on a circuit board | |
| JPH0325022B2 (cg-RX-API-DMAC10.html) | ||
| US20020012231A1 (en) | Low thermal resistance interface for attachment of thermal materials to a processor die | |
| JPH0951187A (ja) | 熱の発散装置及び熱の発散方法 | |
| JPH09213848A (ja) | 電子部品のヒートシンク | |
| JPH08227952A (ja) | パワーモジュール | |
| JPH0543482Y2 (cg-RX-API-DMAC10.html) | ||
| JPH1041445A (ja) | 電子部品放熱装置 | |
| US6385046B1 (en) | Heat sink assembly having inner and outer heatsinks | |
| JPH11312770A (ja) | 薄型icの放熱フィン | |
| JP2001068887A (ja) | プリント基板の冷却構造 | |
| JP3853896B2 (ja) | 発熱部品装置 | |
| JPS6228768Y2 (cg-RX-API-DMAC10.html) | ||
| KR101281043B1 (ko) | 히트 싱크 | |
| JPS6214700Y2 (cg-RX-API-DMAC10.html) | ||
| JP3158655B2 (ja) | 電子機器の放熱装置 | |
| JPS59155158A (ja) | 半導体装置の冷却構造 | |
| JPS6127189Y2 (cg-RX-API-DMAC10.html) | ||
| JPH06181395A (ja) | 放熱形プリント配線板 | |
| JPH0577990U (ja) | 発熱性混成集積回路装置 | |
| JP4078400B2 (ja) | 電子デバイスの放熱システム | |
| JPH02143594A (ja) | 集積回路の冷却構造 | |
| JPH054577U (ja) | 集積回路放熱実装構造 | |
| JP2569813B2 (ja) | 表面実装型半導体部品の冷却構造 | |
| JPH05315484A (ja) | 半導体用放熱装置 |