JPH0542158B2 - - Google Patents
Info
- Publication number
- JPH0542158B2 JPH0542158B2 JP2936286A JP2936286A JPH0542158B2 JP H0542158 B2 JPH0542158 B2 JP H0542158B2 JP 2936286 A JP2936286 A JP 2936286A JP 2936286 A JP2936286 A JP 2936286A JP H0542158 B2 JPH0542158 B2 JP H0542158B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- layer
- multilayer
- printed wiring
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 14
- 230000002209 hydrophobic effect Effects 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 230000003197 catalytic effect Effects 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 47
- 239000004020 conductor Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2936286A JPS62186595A (ja) | 1986-02-12 | 1986-02-12 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2936286A JPS62186595A (ja) | 1986-02-12 | 1986-02-12 | 多層印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62186595A JPS62186595A (ja) | 1987-08-14 |
| JPH0542158B2 true JPH0542158B2 (fr) | 1993-06-25 |
Family
ID=12274067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2936286A Granted JPS62186595A (ja) | 1986-02-12 | 1986-02-12 | 多層印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62186595A (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691320B2 (ja) * | 1988-03-08 | 1994-11-14 | シャープ株式会社 | 硬質基板とフレキシブル基板とのスルホールめっき接合方法 |
| JPH0516718U (ja) * | 1991-08-13 | 1993-03-02 | 株式会社椿本チエイン | コンベヤの駆動構造 |
| JPH0537722U (ja) * | 1991-08-13 | 1993-05-21 | 株式会社椿本チエイン | コンベヤの搬送物支持弾性リングの取付構造及び該構造を具えたコンベヤの駆動構造 |
| TWI389205B (zh) * | 2005-03-04 | 2013-03-11 | Sanmina Sci Corp | 使用抗鍍層分隔介層結構 |
-
1986
- 1986-02-12 JP JP2936286A patent/JPS62186595A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62186595A (ja) | 1987-08-14 |
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