JPH0541548Y2 - - Google Patents

Info

Publication number
JPH0541548Y2
JPH0541548Y2 JP1987149247U JP14924787U JPH0541548Y2 JP H0541548 Y2 JPH0541548 Y2 JP H0541548Y2 JP 1987149247 U JP1987149247 U JP 1987149247U JP 14924787 U JP14924787 U JP 14924787U JP H0541548 Y2 JPH0541548 Y2 JP H0541548Y2
Authority
JP
Japan
Prior art keywords
specimen
outside air
hole
unsealing
blocking cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987149247U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6457640U (US08063081-20111122-C00044.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987149247U priority Critical patent/JPH0541548Y2/ja
Priority to US07/199,708 priority patent/US4826556A/en
Publication of JPS6457640U publication Critical patent/JPS6457640U/ja
Application granted granted Critical
Publication of JPH0541548Y2 publication Critical patent/JPH0541548Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1987149247U 1987-10-01 1987-10-01 Expired - Lifetime JPH0541548Y2 (US08063081-20111122-C00044.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1987149247U JPH0541548Y2 (US08063081-20111122-C00044.png) 1987-10-01 1987-10-01
US07/199,708 US4826556A (en) 1987-10-01 1988-05-27 Plastic mold decapsuling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987149247U JPH0541548Y2 (US08063081-20111122-C00044.png) 1987-10-01 1987-10-01

Publications (2)

Publication Number Publication Date
JPS6457640U JPS6457640U (US08063081-20111122-C00044.png) 1989-04-10
JPH0541548Y2 true JPH0541548Y2 (US08063081-20111122-C00044.png) 1993-10-20

Family

ID=15471092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987149247U Expired - Lifetime JPH0541548Y2 (US08063081-20111122-C00044.png) 1987-10-01 1987-10-01

Country Status (2)

Country Link
US (1) US4826556A (US08063081-20111122-C00044.png)
JP (1) JPH0541548Y2 (US08063081-20111122-C00044.png)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227000A (en) * 1990-04-09 1993-07-13 Nippon Scientific Co., Ltd. Plasma etching apparatus with accurate temperature and voltage level control on device under test
JP2504607B2 (ja) * 1990-06-14 1996-06-05 株式会社東芝 半導体製造装置及び製造方法
US5252179A (en) * 1992-09-28 1993-10-12 International Business Machines Corporation Apparatus and method for selectively etching a plastic encapsulating material
US5443675A (en) * 1993-09-15 1995-08-22 Wensink; Ben L. Plastic mold package device decapsulator with flat, separate etch head and etch plate
US5932061A (en) * 1996-10-29 1999-08-03 Sun Microsystems, Inc. Board Level Decapsulator
US6197209B1 (en) 1995-10-27 2001-03-06 Lg. Philips Lcd Co., Ltd. Method of fabricating a substrate
US6043100A (en) * 1996-04-19 2000-03-28 Weaver; Kevin Chip on tape die reframe process
US5766496A (en) * 1996-05-31 1998-06-16 Nisene Technology Group, Inc. Decapsulator and method for decapsulating plastic encapsulated device
US5783098A (en) * 1996-05-31 1998-07-21 Nisene Technology Group Decapsulator and method for decapsulating plastic encapsulated device
US6630052B1 (en) 1996-06-26 2003-10-07 Lg. Philips Lcd Co., Ltd. Apparatus for etching glass substrate
KR0180850B1 (ko) 1996-06-26 1999-03-20 구자홍 유리기판 에칭장치
US5792305A (en) * 1996-07-12 1998-08-11 Nisene Technology Group Fixture for decapsulating plastic encapsulated electronic device packages
KR100265556B1 (ko) 1997-03-21 2000-11-01 구본준 식각장치
JPH1177512A (ja) * 1997-09-09 1999-03-23 Oki Electric Ind Co Ltd 表面実装パッケージのリード端子自動研磨方法及びその自動研磨装置
US6327011B2 (en) * 1997-10-20 2001-12-04 Lg Electronics, Inc. Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
KR20000067106A (ko) * 1999-04-23 2000-11-15 구본준 유리기판 에칭장치
JP3340675B2 (ja) * 1998-05-26 2002-11-05 日本サイエンティフィック株式会社 プラスチックモールド開封装置
US6054012A (en) * 1998-06-29 2000-04-25 Intersil Corporation Decapsulating method and apparatus for integrated circuit packages
KR100272513B1 (ko) * 1998-09-08 2001-01-15 구본준 유리기판의 식각장치
KR100308157B1 (ko) 1998-10-22 2001-11-15 구본준, 론 위라하디락사 액정표시소자용 유리기판
US6409878B1 (en) * 2000-04-18 2002-06-25 Advanced Micro Devices, Inc. Automatic decapsulation system utilizing an acid resistant, high heat endurance and flexible sheet coupled to a rubber gasket and a method of use
US6368886B1 (en) 2000-09-15 2002-04-09 The Charles Stark Draper Laboratory, Inc. Method of recovering encapsulated die
US6395129B1 (en) * 2000-11-27 2002-05-28 Advanced Micro Devices, Inc. Process to decapsulate a FBGA package
US6517666B2 (en) * 2001-03-27 2003-02-11 Advanced Micro Devices, Inc. Automatic decapsulation system utilizing an integrated spacer/protection plate
WO2002089192A1 (en) * 2001-04-27 2002-11-07 Koninklijke Philips Electronics N.V. Method of wet etching an inorganic antireflection layer
US6709888B2 (en) * 2002-07-26 2004-03-23 Motorola, Inc. Method of decapsulating a packaged copper-technology integrated circuit
US7981698B2 (en) * 2007-03-09 2011-07-19 The Charles Stark Draper Laboratory, Inc. Removal of integrated circuits from packages
JP6278677B2 (ja) * 2013-12-03 2018-02-14 日本サイエンティフィック株式会社 プラスチックモールドされた半導体集積回路パッケージの開封装置及びプラスチックモールドされた半導体集積回路パッケージの開封方法
US10510568B2 (en) * 2015-10-20 2019-12-17 Rkd Engineering Corporation Corrosion inhibitor injection apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4344809A (en) * 1980-09-29 1982-08-17 Wensink Ben L Jet etch apparatus for decapsulation of molded devices
JPS5878633U (ja) * 1981-11-25 1983-05-27 日本電気株式会社 樹脂溶解装置
US4359360A (en) * 1981-12-10 1982-11-16 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for selectively jet etching a plastic encapsulating an article

Also Published As

Publication number Publication date
US4826556A (en) 1989-05-02
JPS6457640U (US08063081-20111122-C00044.png) 1989-04-10

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