JPH0540985Y2 - - Google Patents
Info
- Publication number
- JPH0540985Y2 JPH0540985Y2 JP1989069155U JP6915589U JPH0540985Y2 JP H0540985 Y2 JPH0540985 Y2 JP H0540985Y2 JP 1989069155 U JP1989069155 U JP 1989069155U JP 6915589 U JP6915589 U JP 6915589U JP H0540985 Y2 JPH0540985 Y2 JP H0540985Y2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- molten resin
- mold
- hole
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 66
- 239000011347 resin Substances 0.000 claims description 66
- 238000000465 moulding Methods 0.000 claims description 22
- 229920003002 synthetic resin Polymers 0.000 description 9
- 239000000057 synthetic resin Substances 0.000 description 9
- 239000007787 solid Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 240000007643 Phytolacca americana Species 0.000 description 1
- 235000009074 Phytolacca americana Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989069155U JPH0540985Y2 (ko) | 1989-06-13 | 1989-06-13 | |
US07/858,421 US5338182A (en) | 1989-06-13 | 1992-03-24 | Pressure molding apparatus for molten resin |
US08/462,538 US5545023A (en) | 1989-06-13 | 1995-06-05 | Pressure molding apparatus for molten resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989069155U JPH0540985Y2 (ko) | 1989-06-13 | 1989-06-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH038516U JPH038516U (ko) | 1991-01-28 |
JPH0540985Y2 true JPH0540985Y2 (ko) | 1993-10-18 |
Family
ID=31604212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989069155U Expired - Lifetime JPH0540985Y2 (ko) | 1989-06-13 | 1989-06-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0540985Y2 (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6255419B2 (ko) * | 1981-12-23 | 1987-11-19 | Kyowa Electronic Instruments |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6255419U (ko) * | 1985-09-27 | 1987-04-06 |
-
1989
- 1989-06-13 JP JP1989069155U patent/JPH0540985Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6255419B2 (ko) * | 1981-12-23 | 1987-11-19 | Kyowa Electronic Instruments |
Also Published As
Publication number | Publication date |
---|---|
JPH038516U (ko) | 1991-01-28 |
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