JPH0539824Y2 - - Google Patents
Info
- Publication number
- JPH0539824Y2 JPH0539824Y2 JP5815889U JP5815889U JPH0539824Y2 JP H0539824 Y2 JPH0539824 Y2 JP H0539824Y2 JP 5815889 U JP5815889 U JP 5815889U JP 5815889 U JP5815889 U JP 5815889U JP H0539824 Y2 JPH0539824 Y2 JP H0539824Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- claws
- claw
- outward
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 210000000078 claw Anatomy 0.000 claims description 21
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethanethiol Chemical compound CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 235000019645 odor Nutrition 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、自動はんだ付け装置、リフロー炉、
接着剤硬化炉等に設置してプリント基板を搬送す
る装置に関する。[Detailed description of the invention] [Industrial application field] The invention is applicable to automatic soldering equipment, reflow ovens,
This invention relates to a device installed in an adhesive curing furnace or the like to transport printed circuit boards.
一般に、プリント基板をはんだ付けしたり、熱
処理する自動はんだ付け装置、リフロー炉、接着
剤硬化炉等の装置（以下、プリント基板処理装置
という）にはプリント基板を保持して走行させる
搬送装置が設置されている。
Generally, equipment such as automatic soldering equipment, reflow ovens, adhesive curing ovens, etc. that solder or heat-treat printed circuit boards (hereinafter referred to as printed circuit board processing equipment) is equipped with a transport device that holds and moves the printed circuit board. has been done.
該搬送装置としては、枠組みされたキヤリアで
プリント基板を保持するキヤリア方式と、一対の
無端チエーンに設置された多数の爪間でプリント
基板を保持するキヤリアレス方式とがある。キヤ
リア方式とはプリント基板の保持を作業者が行う
ため手間のかかるものであるが、キヤリアレス方
式は走行している爪間にプリント基板を挟むだけ
であるため前後工程への受け渡しが自動化できる
という長所がある。従つて、近時プリント基板処
理装置にはキヤリアレス方式が多く採用されてい
る。 There are two types of transfer devices: a carrier type in which the printed circuit board is held by a framed carrier, and a carrierless type in which the printed circuit board is held between a large number of claws installed on a pair of endless chains. The carrier method requires the operator to hold the printed circuit board, which is time-consuming, but the carrier-less method has the advantage of automating the transfer between the previous and previous processes because the printed circuit board is simply held between moving claws. There is. Therefore, in recent years, many printed circuit board processing apparatuses employ the carrierless method.
ところで近時プリント基板はエポキシ樹脂のよ
うに熱可塑性の材料を用い、しかも厚さも薄くな
つてきていることから、プリント基板処理装置内
をキヤリアレス方式の爪で搬送しているとプリン
ト基板が軟化し、その中央部が下方に曲がるとい
う所謂『反り』が起きてしまうことがあつた。プ
リント基板が反ると爪から落下し、はんだ槽やヒ
ーターの上に乗つてプリント基板を焦がしてしま
う。プリント基板が焦げるとプリント基板上に搭
載した高価な電子部品までも焦がしてしまつて損
害が大きくなるばかりでなく、プリント基板の焦
げた悪臭が作業場内に充満し、作業者に不快感を
起こさせてしまう。また、プリント基板が落下し
ないまでも反つた状態で出てくると、その後のプ
リント基板の組込み作業において、プリント基板
が所定の位置に納まらないという不都合が生じて
しまうものであつた。
By the way, these days, printed circuit boards are made of thermoplastic materials such as epoxy resin, and their thickness is becoming thinner, so printed circuit boards become soft when they are transported through carrier-less claws through printed circuit board processing equipment. , so-called "warpage" in which the center part bends downward sometimes occurs. When a printed circuit board warps, it falls from the nail, lands on the solder bath or heater, and burns the printed circuit board. If a printed circuit board burns, it not only burns the expensive electronic components mounted on the printed circuit board, causing greater damage, but also fills the workplace with the stench of burnt printed circuit boards, causing discomfort to workers. It ends up. Further, even if the printed circuit board does not fall, if it comes out in a warped state, there is an inconvenience that the printed circuit board cannot be placed in a predetermined position during the subsequent installation work of the printed circuit board.
本考案は如何に反りやすいプリント基板でも反
りを起こすことなく搬送できるという搬送装置を
提供することにある。 The object of the present invention is to provide a transport device that can transport printed circuit boards, no matter how easily they warp, without causing any warp.
本考案者は、プリント基板が反りを起こす時、
プリント基板の中央部が下方に曲がり、爪に乗つ
た両端が中央方向に移動することから、爪に乗つ
た部分が中央方向に移動するのを防げば反りが起
きないことに着目して本考案を完成させた。
The inventor believes that when a printed circuit board warps,
The central part of the printed circuit board bends downward and both ends resting on the claws move toward the center.This invention was developed based on the idea that if the parts resting on the claws were prevented from moving toward the center, warping would not occur. completed.
本考案は、爪にはプリント基板と係合できる係
合部が設置されているとともに、該係合部に係合
したプリント基板が、外方に引つ張られる機構と
なつていることを特徴とするプリント基板の搬送
装置である。 The present invention is characterized in that the claw is provided with an engaging part that can engage with a printed circuit board, and the printed circuit board that is engaged with the engaging part is pulled outward. This is a transport device for printed circuit boards.
第１，２図は本考案の実施例である。爪１は上
部が図示しないプリント基板処理装置内を回動す
る一対の無端チエーン２，２に固定されており、
下部がプリント基板を保持する保持部３となつて
いる。保持部３には係合部４が設置されている。
第１，２図に示す係合部は少し外方に傾斜したピ
ンが埋め込まれたものである。爪１の略中央には
バネローラ５が取付けられている。バネローラは
圧力をかけたものが当接された場合に少し引つ込
んで摺動を容易にする作用を有している。爪は矢
印Ａ方向へ走行するが、爪の走行途中にはバネロ
ーラ５に当接するカム部材６，６が設置されてい
る。
1 and 2 are examples of the present invention. The upper part of the claw 1 is fixed to a pair of endless chains 2, 2 that rotate inside a printed circuit board processing apparatus (not shown).
The lower part serves as a holding part 3 that holds a printed circuit board. An engaging portion 4 is installed in the holding portion 3 .
The engaging portion shown in FIGS. 1 and 2 has a slightly outwardly inclined pin embedded therein. A spring roller 5 is attached approximately to the center of the claw 1. The spring roller has the function of retracting a little when it comes into contact with something applying pressure, making it easier to slide. The pawl travels in the direction of arrow A, and cam members 6, 6 that come into contact with the spring roller 5 are installed in the middle of the travel of the pawl.
次に第１，２図に示した実施例におけるプリン
ト基板の搬送状態について説明する。 Next, the conveyance state of the printed circuit board in the embodiment shown in FIGS. 1 and 2 will be explained.
先ず両側の爪の間隔をプリント基板Ｐの両側に
穿設した穴７，７と両側の爪の保持部３，３とが
一致するように調整をする。そして図示しないプ
リント基板処理装置の外でプリント基板Ｐの穴
７，７を保持部に挿入してプリント基板を保持す
る。次いで爪に保持されたプリント基板を矢印Ａ
方向に走行させてプリント基板処理装置内に入れ
る。プリント基板処理装置内にはバネローラに当
接してバネローラを少し押す位置にカム部材６，
６が設置されており、該カム部材にバネローラ５
が当接するとバネローラは矢印Ｂ方向に押され
る。すると爪も矢印Ｂ方向、即ち外方へ押される
ため、係合部３で係合したプリント基板Ｐは両外
方へ引つ張られることになる。 First, the spacing between the claws on both sides is adjusted so that the holes 7, 7 formed on both sides of the printed circuit board P are aligned with the holding parts 3, 3 of the claws on both sides. Then, the holes 7, 7 of the printed circuit board P are inserted into the holding portion outside the printed circuit board processing apparatus (not shown) to hold the printed circuit board. Next, move the printed circuit board held by the claw to arrow A.
Then run it in the direction of the printed circuit board processing equipment. Inside the printed circuit board processing equipment, there is a cam member 6 located at a position that contacts the spring roller and slightly pushes the spring roller.
6 is installed, and a spring roller 5 is installed on the cam member.
When they come into contact, the spring roller is pushed in the direction of arrow B. Then, since the claws are also pushed in the direction of arrow B, that is, outward, the printed circuit board P engaged by the engaging portion 3 is pulled outward.
第３〜５図は本考案の他の実施例である。 3 to 5 show other embodiments of the present invention.
爪の下部の保持部３には溝８が刻設されてお
り、該溝内には係合部４が摺動自在に設置されて
いる。また溝内には保持部４を外方に引つ張るバ
ネ９が設置されている。 A groove 8 is cut in the holding part 3 at the lower part of the claw, and the engaging part 4 is slidably installed in the groove. Further, a spring 9 is installed in the groove to pull the holding portion 4 outward.
第３〜５図の実施例におけるプリント基板の搬
送状態について説明する。 The conveyance state of the printed circuit board in the embodiment shown in FIGS. 3 to 5 will be explained.
先ず、両方の爪の保持部が内方に引つ張られた
状態で、プリント基板Ｐの穴７，７が挿入できる
ように両側の爪の間隔を調整する。そして両側の
爪の保持部４，４にプリント基板Ｐの穴７，７を
挿入する。この状態では既にプリント基板は両側
の爪のバネ引つ張られた状態となつている。 First, with the holding parts of both claws pulled inward, the spacing between the claws on both sides is adjusted so that the holes 7, 7 of the printed circuit board P can be inserted. Then, the holes 7, 7 of the printed circuit board P are inserted into the holding parts 4, 4 of the claws on both sides. In this state, the printed circuit board is already in a state where the springs of the claws on both sides are stretched.
なお、本考案の実施例では爪の保持部に設置し
た係合部としてピン状のものを示したが、プリン
ト基板を強固に保持するものであればピンに限ら
ずフツク、或いはプリント基板を挟むクリツプ等
如何なる構造のものでも採用できることはいうま
でもない。 In addition, in the embodiment of the present invention, a pin-shaped thing is shown as the engaging part installed in the holding part of the claw, but the hook is not limited to the pin, as long as it firmly holds the printed circuit board, or a hook that pinches the printed circuit board can be used. Needless to say, any structure such as a clip can be used.
本考案の搬送装置はプリント基板を外方に引つ
張ることができるため、プリント基板が加熱され
ても反りが決して起こらず、従つてプリント基板
をはんだ槽やヒーター上に落下させて熱損傷させ
たり、焦がして不快臭を発生させる等という不慮
の事故の発生を皆無とするものである。
Since the conveying device of the present invention can pull the printed circuit board outward, it will never warp even if the printed circuit board is heated, and therefore will not be damaged by heat by dropping the printed circuit board onto a solder bath or heater. This eliminates the occurrence of unforeseen accidents such as burning, burning, and producing unpleasant odors.
第１図は本考案の第１実施例の斜視図、第２図
は同正面断面図、第３図は他の実施例の要部斜視
図、第４図は第３図−線断面図、第５図は同
実施例の正面断面図である。
１……爪、２……無端チエーン、３……保持
部、４……係合部、５……バネローラ、６……カ
ム部材、７……プリント基板の穴、８……溝、９
……バネ、Ｐ……プリント基板。
Fig. 1 is a perspective view of the first embodiment of the present invention, Fig. 2 is a front sectional view thereof, Fig. 3 is a perspective view of main parts of another embodiment, Fig. 4 is a sectional view taken along the line of Fig. 3, FIG. 5 is a front sectional view of the same embodiment. DESCRIPTION OF SYMBOLS 1... Claw, 2... Endless chain, 3... Holding part, 4... Engaging part, 5... Spring roller, 6... Cam member, 7... Hole in printed circuit board, 8... Groove, 9
...Spring, P...Printed circuit board.
Claims (1)
置されているとともに、該係合部に係合したプ
リント基板が、外方に引つ張られる機構となつ
ていることを特徴とするプリント基板の搬送装
置。 (2) 前記プリント基板を外方に引つ張る機構は、
爪の走行途中に設置されたカム部材であること
を特徴とする実用新案登録請求の範囲第(1)項記
載のプリント基板の搬送装置。 (3) 前記プリント基板を外方に引つ張る機構は、
バネ付勢された係合部であることを特徴とする
実用新案登録請求の範囲第(1)項記載のプリント
基板の搬送装置。[Claims for Utility Model Registration] (1) The claw is provided with an engaging portion capable of engaging with a printed circuit board, and a mechanism in which the printed circuit board engaged with the engaging portion is pulled outward. A printed circuit board conveyance device characterized by: (2) The mechanism for pulling the printed circuit board outward is
The printed circuit board conveyance device according to claim (1), which is a utility model registration, characterized in that the device is a cam member installed in the middle of the travel of the claw. (3) The mechanism for pulling the printed circuit board outward is
The printed circuit board conveying device according to claim (1), which is characterized in that the engaging portion is spring-biased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5815889U JPH0539824Y2 (en) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5815889U JPH0539824Y2 (en) | 1989-05-22 | 1989-05-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02148775U JPH02148775U (en) | 1990-12-18 |
| JPH0539824Y2 true JPH0539824Y2 (en) | 1993-10-08 |
Family
ID=31583514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5815889U Expired - Lifetime JPH0539824Y2 (en) | 1989-05-22 | 1989-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0539824Y2 (en) |
-
1989
- 1989-05-22 JP JP5815889U patent/JPH0539824Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02148775U (en) | 1990-12-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01133668A (en) | Device for holding printed board in carrierless soldering device | |
| JPH0794067B2 (en) | Method and device for holding and conveying printed circuit board | |
| JPH0539824Y2 (en) | ||
| ATE28044T1 (en) | DESOLDERING DEVICE. | |
| JPH0563394A (en) | Board conveyance apparatus | |
| JPH0749151B2 (en) | Soldering reflow oven | |
| CA2174076C (en) | Continuous flow dip tinning system | |
| JPS6113161Y2 (en) | ||
| JPH0730567Y2 (en) | Printed circuit board transport chain | |
| JPH0393543A (en) | Substrate supporting device for screen printing device | |
| JPH0568938U (en) | Substrate transfer device | |
| JP2540575Y2 (en) | Transfer equipment for automatic soldering equipment | |
| JPS6218074Y2 (en) | ||
| KR920002931Y1 (en) | Printed circuit board transfer tongs for auto soldering divice | |
| JPS6027187A (en) | Device for holding printed board in carrierless soldering equipment | |
| ATE118151T1 (en) | DEVICE FOR FASTENING COMPONENTS IN MULTI-POLE CIRCUIT BOARDS. | |
| JPS5814625Y2 (en) | Through-hole mask during solder dipping | |
| JPH04171791A (en) | Heating device | |
| JPH062289Y2 (en) | Warpage correction device for printed circuit boards | |
| JPH0530848Y2 (en) | ||
| JPH06188554A (en) | Lifting mechanism for printed board | |
| JP2580886Y2 (en) | Automatic soldering equipment | |
| JPS63268290A (en) | Warpage prevention | |
| JP3581777B2 (en) | Reflow equipment | |
| JPH01110415A (en) | Substrate transfer device |