JPH06188554A - Lifting mechanism for printed board - Google Patents

Lifting mechanism for printed board

Info

Publication number
JPH06188554A
JPH06188554A JP33774192A JP33774192A JPH06188554A JP H06188554 A JPH06188554 A JP H06188554A JP 33774192 A JP33774192 A JP 33774192A JP 33774192 A JP33774192 A JP 33774192A JP H06188554 A JPH06188554 A JP H06188554A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
lifting
metal
metal fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33774192A
Other languages
Japanese (ja)
Inventor
Hiroto Watanabe
宏人 渡辺
Seiji Ichikawa
清司 市川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP33774192A priority Critical patent/JPH06188554A/en
Publication of JPH06188554A publication Critical patent/JPH06188554A/en
Pending legal-status Critical Current

Links

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  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent downward warping of printed board by hunging a hunging member for a lifting metal after the tying part of the lifting metal is engaged with the engaging part of the printed board when the printed board is subjects to soldering. CONSTITUTION:When a lifting metal 2 lifting the central part of a printed board reaches the top end of a rail 3 that is fixed at a specified height, an engaging part 2d of the metal 2 is inserted into a groove part 3a of the rail 3. The metal 2 is a slided along the part 3a of the rail 3 accompanied with the conveyor movement in a state where it keeps lifting the board 11. At this moment, since the force applying on the metal 2 does not direct to the direction to remove the metal 2 from an engaging hole 11a of the board 11, the board 11 can be securely prevented thanks to the metal 2 from being warped downwardly in a vertical direction thereof due to the heat.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、プリント基板をディ
ップはんだ付け等する際に用いるプリント基板吊り上げ
機構に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board lifting mechanism used for dip soldering a printed board.

【0002】[0002]

【従来の技術】例えば、プリント基板のディップはんだ
付けは、コンベヤで搬送しながら、部品を搭載した基板
にフラックスを塗布して90℃程度に予熱し、その基板
の下面を240℃程度に溶融したはんだに3秒程度浸漬
した後、冷却するようにして行われる。その間、プリン
ト基板は、一方の面から加熱されて膨張するので加熱面
が凸になるように変形し、短時間であるが180℃程度
の温度に達する瞬間がある。
2. Description of the Related Art For example, in dip soldering a printed circuit board, flux is applied to a substrate on which components are mounted and preheated to about 90 ° C. while being conveyed by a conveyor, and the lower surface of the substrate is melted to about 240 ° C. After immersing the solder in the solder for about 3 seconds, it is cooled. During that time, the printed board is heated from one surface and expands, so that the heated surface is deformed so as to be convex, and there is a moment when it reaches a temperature of about 180 ° C. for a short time.

【0003】上記プリント基板の材質は、主にフェノー
ル樹脂、エポキシ樹脂などを主成分としており、そのガ
ラス転移温度は130℃程度以下であって、上記のよう
に加熱されると急激に軟化し、プリント基板は重力の影
響も重なって急激に下側に反るようになる。
The material of the printed circuit board is mainly composed of phenol resin, epoxy resin, etc., and its glass transition temperature is about 130 ° C. or lower, and when it is heated as described above, it suddenly softens, The printed circuit board is also warped downward due to the influence of gravity.

【0004】この場合、プリント基板に搭載されている
部品の寸法が大きいと、プリント基板が下側に反ること
によって相互に隙間ができ、はんだ接続が破壊された
り、また、反ったまま冷却されてしまうと、プリント基
板を装置に取り付けるときにプリント基板に無理な力が
かかってプリント基板を破壊してしまう虞れがある。
In this case, when the size of the component mounted on the printed circuit board is large, the printed circuit board warps downwards to form a mutual gap, which destroys the solder connection or cools while warped. If this happens, there is a risk that the printed circuit board will be subjected to an unreasonable force when it is attached to the device, and the printed circuit board will be destroyed.

【0005】[0005]

【発明が解決しようとする課題】上記プリント基板のは
んだ接続等の破壊を避けるために、従来は、プリント基
板の幅のほぼ中心部の下側に、レール状の下受け機構を
設けたり、プリント基板の上に配置された棹から垂らし
た鉤で、プリント基板を吊り上げるなどしてプリント基
板を平面状に保つなどしていた。しかし、下受けする機
構は複雑で、作業の邪魔になり、上吊り機構は、いちい
ち手で付けなければならず、作業性に欠けていた。
In order to avoid damage such as solder connection of the printed circuit board, conventionally, a rail-shaped lower receiving mechanism is provided below the substantially central portion of the width of the printed circuit board, or the printed circuit board is printed. The hooks hung from the rod placed on the board kept the printed board flat by lifting the printed board. However, the mechanism for receiving the lower part is complicated and hinders the work, and the upper hanging mechanism has to be attached by hand one by one, and the workability is poor.

【0006】そこで、この発明は、はんだ付け時のプリ
ント基板の下反りを確実に防止することができるプリン
ト基板吊り上げ機構を提供するものである。
Therefore, the present invention provides a printed board lifting mechanism capable of reliably preventing the warp of the printed board during soldering.

【0007】[0007]

【課題を解決するための手段】コンベヤで搬送されるプ
リント基板をはんだ付けする際に吊り上げて保持するプ
リント基板吊り上げ機構において、上記プリント基板に
形成された係合部に係止部を介して係脱される吊り上げ
金具と、この吊り上げ金具を懸吊する懸吊部材とを備え
ている。
In a printed circuit board hoisting mechanism for hoisting and holding a printed circuit board conveyed by a conveyor when soldering it, an engaging portion formed on the printed circuit board is engaged via a locking portion. The lifting metal fitting to be removed and the suspension member for suspending the lifting metal fitting are provided.

【0008】[0008]

【作用】プリント基板をはんだ付けする際に、プリント
基板の係合部に吊り上げ金具の係止部を係止した後、こ
の吊り上げ金具を懸吊部材に懸吊する。これにより、プ
リント基板の下反りは確実に防止され、プリント基板は
平面状に維持された状態ではんだ付けされる。
When the printed circuit board is soldered, after the locking part of the lifting metal fitting is locked to the engaging part of the printed circuit board, the lifting metal fitting is suspended on the suspension member. As a result, the warp of the printed circuit board is surely prevented, and the printed circuit board is soldered while being kept flat.

【0009】[0009]

【実施例】以下、この発明の一実施例を図面と共に詳述
する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

【0010】図1,2において、1はプリント基板吊り
上げ機構である。このプリント基板吊り上げ機構1は、
コンベヤ10で搬送されるプリント基板11に形成され
た係合孔(係合部)11aに、前後一対の脚部(係止
部)2b,2cを介して係脱される吊り上げ金具2と、
この吊り上げ金具2をその上側に形成された係合部2d
を介して懸吊するレール(懸吊部材)3と、プリント基
板11の搬送方向の前,後縁を支える一対の補強部材
4,4とで構成されている。
In FIGS. 1 and 2, reference numeral 1 is a printed circuit board lifting mechanism. This printed circuit board lifting mechanism 1
A lifting metal fitting 2 which is engaged and disengaged with an engagement hole (engagement portion) 11a formed in a printed circuit board 11 conveyed by a conveyor 10 via a pair of front and rear leg portions (locking portions) 2b and 2c,
This lifting metal fitting 2 has an engaging portion 2d formed on the upper side thereof.
A rail (suspension member) 3 that is suspended via a pair of reinforcing members 4 and 4 that supports the front and rear edges of the printed circuit board 11 in the transport direction.

【0011】上記吊り上げ金具2は略U字状に折り曲げ
形成された吊り上げ金具本体2aを有している。この本
体2aの前側底面に略L字形で鉤形の前側の脚部2bを
一体折り曲げ形成してあると共に、その前側上面にT字
形の係合部2dを一体突出形成してある。また、上記吊
り上げ金具2の本体2aの後側は一枚の板状になってお
り、この後下部側に切欠き2eを介して後側の脚部2c
を一体形成してある。この切欠き2eにより上記前後一
対の脚部2b,2cは、その間隔が弾性的に可変自在に
なっている。
The lifting metal fitting 2 has a lifting metal fitting body 2a bent and formed in a substantially U shape. A substantially L-shaped, hook-shaped front leg portion 2b is integrally formed on the front bottom surface of the main body 2a by bending, and a T-shaped engaging portion 2d is integrally formed on the front upper surface thereof. The rear side of the main body 2a of the lifting metal fitting 2 has a single plate-like shape, and the rear leg portion 2c is formed at the rear lower side through a notch 2e.
Are integrally formed. Due to the notch 2e, the distance between the pair of front and rear leg portions 2b and 2c is elastically variable.

【0012】上記レール3は、断面T字形の溝部3aを
有している。このレール3の溝部3aに上記吊り上げ金
具2の係合部2dが挿入されて摺動自在に懸吊されるよ
うになっている。このレール3は図示しない支持機構を
介して図示しないコンベヤ本体に固定されており、チェ
ーンコンベヤ等から成る一対のコンベヤ10,10間上
をプリント基板11の搬送方向に沿って平行に配置され
ている。また、上記一対の補強部材4,4は金属板状に
形成してあり、プリント基板11の前,後縁を挾持する
コ字状の挾持片部4aと、この挾持片部4aの上縁より
上方に垂直に一体突出形成された起立片部4bとをそれ
ぞれ有している。
The rail 3 has a groove 3a having a T-shaped cross section. The engaging portion 2d of the lifting metal fitting 2 is inserted into the groove portion 3a of the rail 3 so as to be slidably suspended. The rail 3 is fixed to a conveyor main body (not shown) via a support mechanism (not shown), and is arranged in parallel between a pair of conveyors 10, 10 composed of a chain conveyor or the like along the transfer direction of the printed circuit board 11. . The pair of reinforcing members 4 and 4 are formed in the shape of a metal plate, and have a U-shaped holding piece 4a for holding the front and rear edges of the printed circuit board 11 and an upper edge of the holding piece 4a. The upright piece portions 4b are integrally formed so as to vertically project upward.

【0013】上記プリント基板11は上記一対のコンベ
ヤ10,10の図示しない各爪部等によって上下を含め
た位置がずれないように固定されて、例えば、フラック
ス塗布工程→予熱工程→ディップはんだ付け工程→冷却
工程と搬送されるようになっている。このプリント基板
11の中央には矩形の係合孔11aを形成してある。こ
の係合孔11aの幅は上記吊り上げ金具2の一対の脚部
2b,2cより僅かに広く形成してあると共に、該吊り
上げ金具2の本体2aの幅より狭くなるように形成して
ある。また、この係合孔11aの長さは吊り上げ金具2
の前側の脚部2bの胴部の外面と後側の脚部2cの外面
との間隔より僅かに狭く形成してあると共に、該係合孔
11aの深さは前側の脚部2bの胴部の長さ(先端の鉤
部を除いた長さ)相当に形成してある。尚、プリント基
板11上にはディップはんだ付けする図示しない部品を
搭載してあり、プリント基板11の下面側に突出した部
品のリード部分をはんだ付けする。
The printed circuit board 11 is fixed by the not-shown claws of the pair of conveyors 10 and 10 so as not to be displaced in the upper and lower positions. For example, the flux applying step → preheating step → dip soldering step. → It is designed to be transported with the cooling process. A rectangular engaging hole 11a is formed in the center of the printed board 11. The width of the engaging hole 11a is formed to be slightly wider than the pair of legs 2b and 2c of the lifting metal fitting 2 and is narrower than the width of the main body 2a of the lifting metal fitting 2. Further, the length of the engaging hole 11a is determined by the lifting metal fitting 2
Is formed slightly narrower than the distance between the outer surface of the body of the front leg 2b and the outer surface of the rear leg 2c, and the depth of the engaging hole 11a is the body of the front leg 2b. Is formed to have a length (excluding the hook portion at the tip). A component (not shown) to be dip-soldered is mounted on the printed circuit board 11, and the lead portion of the component projecting to the lower surface side of the printed circuit board 11 is soldered.

【0014】以上実施例のプリント基板吊り上げ機構1
を用いてプリント基板11を冷却工程まで搬送する場合
には、まず、図2に示すように、吊り上げ金具2の下部
前側の鉤形の脚部2bを、図中矢印で示す搬送方向側に
してプリント基板11の係合孔11aに挿入する。次
に、吊り上げ金具2の下部後側の脚部2cをプリント基
板11の係合孔11aに押し入れると、吊り上げ金具2
の脚部2bと脚部2cとは弾性的に反発し合って、前側
の脚部2bは係合孔11aの周縁部に押し付けられ、そ
の先端の鉤部はプリント基板11の下面側に安定状態で
引っ掛けられる。これにより、吊り上げ金具2の上部前
側の係合部2d等に、下部後側の脚部2cが上方に持ち
上げられる搬送方向と反対の方向の力が加わらない限
り、吊り上げ金具2はプリント基板11の係合孔11a
から外れることがない。
The printed circuit board lifting mechanism 1 of the above embodiment
When the printed circuit board 11 is conveyed to the cooling step by using, as shown in FIG. 2, first, the hook-shaped leg portion 2b on the lower front side of the lifting metal fitting 2 is set to the conveying direction side indicated by the arrow in the figure. The printed board 11 is inserted into the engaging hole 11a. Next, when the leg portion 2c on the lower rear side of the lifting metal fitting 2 is pushed into the engagement hole 11a of the printed circuit board 11, the lifting metal fitting 2
The leg portions 2b and 2c elastically repel each other, the front leg portion 2b is pressed against the peripheral edge portion of the engagement hole 11a, and the hook portion at the tip thereof is stable on the lower surface side of the printed circuit board 11. Can be hooked at. As a result, unless a force is applied to the engaging portion 2d on the upper front side of the lifting metal fitting 2 in the direction opposite to the conveying direction in which the lower rear leg portion 2c is lifted upward, the lifting metal fitting 2 is attached to the printed circuit board 11. Engagement hole 11a
It does not come off.

【0015】このような状態で搬送されるプリント基板
11の中央部を持ち上げた吊り上げ金具2が、所定高さ
位置に固定されたレール3の先端位置に来ると、吊り上
げ金具2の係合部2dはレール3の溝部3aに挿入さ
れ、一対のコンベヤ10,10による移動により吊り上
げ金具2はプリント基板11を吊り上げた状態で、例え
ば、フラックス塗布工程→予熱工程→ディップはんだ付
け工程→冷却工程とレール3の溝部3aに沿って摺動さ
れる。このとき、吊り上げ金具2にかかる力は、吊り上
げ金具2をプリント基板11の係合孔11aから外す方
向ではないので、この吊り上げ金具2によりプリント基
板11が熱によりその縦方向(長手方向)の下側に反ろ
うとするのを確実に防ぐことができる。これにより、プ
リント基板11は下反りすることなく平面状態を維持し
てコンベヤ10により搬送される。また、上記プリント
基板11の横方向の下反りは一対の補強部材4,4によ
り確実に防止される。
When the lifting metal fitting 2 which lifts the central portion of the printed circuit board 11 conveyed in such a state comes to the tip position of the rail 3 fixed at a predetermined height position, the engaging portion 2d of the lifting metal fitting 2 is formed. Is inserted in the groove portion 3a of the rail 3 and the lifting metal fitting 2 lifts the printed circuit board 11 by the movement of the pair of conveyors 10 and 10, for example, a flux applying step → a preheating step → a dip soldering step → a cooling step and a rail. 3 is slid along the groove 3a. At this time, the force applied to the lifting metal fitting 2 is not in the direction to disengage the lifting metal fitting 2 from the engaging hole 11a of the printed circuit board 11, so that the printed metal board 11 is heated by the lifting metal fitting 2 downward in the vertical direction (longitudinal direction) thereof. It is possible to reliably prevent the side from warping. As a result, the printed circuit board 11 is conveyed by the conveyor 10 while maintaining its flat state without warping. Further, the warp in the lateral direction of the printed circuit board 11 is reliably prevented by the pair of reinforcing members 4 and 4.

【0016】上記吊り上げ金具2は、ほかの部品と一緒
に、プリント基板11に部品実装機で付けることができ
るので、手間がかからず、また、吊り上げ金具2に搬送
方向と反対方向に力を加えるだけで自然落下するので、
吊り上げ金具2をプリント基板11から簡単に外すこと
ができる。これにより、吊り上げ金具2の取り付け作業
は部品実装機で自動化することができ、取り外しも簡単
にできる。また、プリント基板11で部品を配置しては
いけない部分は、吊り上げ金具2の部分だけであり、そ
の係合孔11aの位置も自由度があるので、プリント基
板11の設計上の制約はほとんど無く、プリント基板1
1を平面状態に確実に維持しながら搬送できる多大なメ
リットがあり、はんだ付け精度をより一層向上させるこ
とができる。
Since the lifting metal fitting 2 can be attached to the printed circuit board 11 together with other components by a component mounter, it does not take much time and a force is applied to the lifting metal fitting 2 in the direction opposite to the carrying direction. Just add it and it will fall naturally,
The lifting metal fitting 2 can be easily removed from the printed circuit board 11. As a result, the work of attaching the lifting metal fitting 2 can be automated by the component mounter, and can be easily removed. Further, the parts on the printed circuit board 11 where the components should not be arranged are only the parts of the lifting metal fitting 2 and the positions of the engaging holes 11a thereof are also free, so that there are almost no restrictions on the design of the printed circuit board 11. , Printed circuit board 1
There is a great merit that the 1 can be transported while being surely maintained in a flat state, and the soldering accuracy can be further improved.

【0017】尚、前記実施例によれば、プリント基板の
略中央を1つの吊り上げ金具により吊り上げるようにし
たが、長手方向に更に長いプリント基板等において2つ
以上の吊り上げ金具によりプリント基板を吊り上げるよ
うにしてプリント基板の下反りを防止してもよい。ま
た、吊り上げ金具の脚部の形状は鉤形等に限られるもの
ではなく、吊り上げ金具の係合部の形状もT字形等に限
られるものではない。さらに、プリント基板に形成され
る係合部は矩形の1つの係合孔に限られず、一対の係合
孔にしたり、段差を有した円形の係合穴等の形状にして
もよい。
In addition, according to the above-mentioned embodiment, the substantially central portion of the printed circuit board is hung up by one hoisting metal fitting, but in the printed circuit board which is longer in the longitudinal direction, the printed circuit board is hoisted by two or more hoisting metal fittings. The warp of the printed circuit board may be prevented. Further, the shape of the leg portion of the lifting metal fitting is not limited to the hook shape or the like, and the shape of the engaging portion of the lifting metal fitting is not limited to the T shape or the like. Further, the engaging portion formed on the printed circuit board is not limited to one rectangular engaging hole, but may be a pair of engaging holes or a circular engaging hole having a step or the like.

【0018】[0018]

【発明の効果】以上のように、この発明によれば、コン
ベヤで搬送されるプリント基板をはんだ付けする際に吊
り上げて保持するプリント基板吊り上げ機構において、
上記プリント基板に形成された係合部に係止部を介して
係脱される吊り上げ金具と、この吊り上げ金具を懸吊す
る懸吊部材とを備えたので、はんだ付け時に発生し易い
プリント基板の下反りを確実に防止することができ、は
んだ付け精度をより一段と向上させることができる。
As described above, according to the present invention, in the printed circuit board hoisting mechanism for hoisting and holding the printed circuit board conveyed by the conveyor during soldering,
Since the lifting metal fitting that is engaged with and disengaged from the engaging portion formed on the printed circuit board via the locking portion and the suspending member that suspends the lifting metal fitting are provided, The warp can be surely prevented, and the soldering accuracy can be further improved.

【0019】また、上記吊り上げ金具の搬送方向の前,
後側に一対の係止部を設け、この前側の係止部を略L字
形の鉤形に形成したので、吊り上げ金具をプリント基板
に簡単に係脱することができ、プリント基板に対する吊
り上げ金具の取り付けを自動化することができる。
In addition, in front of the carrying direction of the lifting metal fitting,
Since a pair of locking parts are provided on the rear side and the front locking parts are formed in a substantially L-shaped hook shape, the lifting metal fitting can be easily attached to and detached from the printed circuit board, and Installation can be automated.

【0020】さらに、上記プリント基板の搬送方向の
前,後縁を支える一対の補強部材を備えたので、プリン
ト基板の前,後縁の下反りも確実に防止することができ
る。
Further, since the pair of reinforcing members for supporting the front and rear edges of the printed circuit board in the conveying direction are provided, the warp of the front and rear edges of the printed circuit board can be surely prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施例を示すプリント基板吊り上
げ機構の斜視図。
FIG. 1 is a perspective view of a printed board lifting mechanism showing an embodiment of the present invention.

【図2】上記プリント基板吊り上げ機構の要部の拡大斜
視図。
FIG. 2 is an enlarged perspective view of a main part of the printed circuit board lifting mechanism.

【符号の説明】[Explanation of symbols]

1…プリント基板吊り上げ機構 2…吊り上げ金具 2b,2c…一対の脚部(一対の係止部) 3…レール(懸吊部材) 4,4…一対の補強部材 10…コンベヤ 11…プリント基板 11a…係合孔(係合部) DESCRIPTION OF SYMBOLS 1 ... Printed-circuit board lifting mechanism 2 ... Lifting metal fittings 2b, 2c ... A pair of leg parts (a pair of locking parts) 3 ... Rails (suspending members) 4, 4 ... A pair of reinforcing members 10 ... Conveyor 11 ... Printed circuit board 11a ... Engagement hole (engagement part)

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 コンベヤで搬送されるプリント基板をは
んだ付けする際に吊り上げて保持するプリント基板吊り
上げ機構において、上記プリント基板に形成された係合
部に係止部を介して係脱される吊り上げ金具と、この吊
り上げ金具を懸吊する懸吊部材とを備えたことを特徴と
するプリント基板吊り上げ機構。
1. A printed circuit board hoisting mechanism for hoisting and holding a printed circuit board conveyed by a conveyor during soldering, wherein hoisting is disengaged from an engaging portion formed on the printed circuit board via a locking portion. A printed circuit board lifting mechanism comprising a metal fitting and a suspension member for suspending the lifting metal fitting.
【請求項2】 請求項1記載のプリント基板吊り上げ機
構において、上記吊り上げ金具の搬送方向の前,後側に
一対の係止部を設け、この前側の係止部を略L字形の鉤
形に形成したことを特徴とするプリント基板吊り上げ機
構。
2. The printed circuit board lifting mechanism according to claim 1, wherein a pair of locking portions are provided on the front and rear sides of the lifting metal member in the conveying direction, and the locking portions on the front side have a substantially L-shaped hook shape. A printed circuit board lifting mechanism characterized by being formed.
【請求項3】 請求項1記載のプリント基板吊り上げ機
構において、上記プリント基板の搬送方向の前,後縁を
支える一対の補強部材を備えたことを特徴とするプリン
ト基板吊り上げ機構。
3. The printed circuit board hoisting mechanism according to claim 1, further comprising a pair of reinforcing members for supporting front and rear edges of the printed circuit board in the conveying direction.
JP33774192A 1992-12-18 1992-12-18 Lifting mechanism for printed board Pending JPH06188554A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33774192A JPH06188554A (en) 1992-12-18 1992-12-18 Lifting mechanism for printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33774192A JPH06188554A (en) 1992-12-18 1992-12-18 Lifting mechanism for printed board

Publications (1)

Publication Number Publication Date
JPH06188554A true JPH06188554A (en) 1994-07-08

Family

ID=18311526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33774192A Pending JPH06188554A (en) 1992-12-18 1992-12-18 Lifting mechanism for printed board

Country Status (1)

Country Link
JP (1) JPH06188554A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10338634B2 (en) 2016-01-29 2019-07-02 Toshiba Memory Corporation Semiconductor storage device having a support member for a memory controller

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10338634B2 (en) 2016-01-29 2019-07-02 Toshiba Memory Corporation Semiconductor storage device having a support member for a memory controller

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