JPS62289366A - Warp preventive jig for plate to be soldered - Google Patents

Abstract

PURPOSE:To improve the flatness of a plate to be soldered, by suspending elastically the plate to be soldered, from the upper part so as to abut on three pieces or more of receiving parts, through a suspending axis which has fixed the lower end to a hole of the plate to be soldered. CONSTITUTION:On the upper face of a printed board P, a jig body 32 is placed through a receiving part 33. A suspending shaft 37 is depressed against a spring 42, and a hook 40 of its lower end is inserted into a hole of the board P. In this way, the hook 40 is engaged to the lower face of the board P, and also, by utilizing the restoring force of the spring, the center part of the board P is drawn up to the lower face level of the receiving part 33 by the hook 40. According to a device of this constitution, a deflection of the board P is straightened, and a good flat surface can be obtained.

Description

[Detailed Description of the Invention] 3. Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) The present invention provides a method for solving the problem that solderable boards such as wiring boards may sometimes warp due to soldering. This relates to a jig that prevents warpage.

(Prior Art) Conventionally, as shown in Japanese Utility Model Application Publication No. 54-75961, there is a printed wiring board in which warp prevention fittings are fitted to both ends that are not held by the carrier hair.

However, it is difficult to print layouts using such warpage prevention metal fittings.
When the printed wiring board is large, the central part of the board tends to bend a little, and warping cannot be effectively prevented.

On the other hand, as shown in Japanese Utility Model Application Publication No. 54-92365, a pin is inserted from the bottom of a hole drilled in a printed wiring board, and the quality of the pin is adjusted on the top of the printed wiring board. It also has a warpage prevention layer that holds it in place. Also, in 1987
As shown in Publication No. 22269, it is a comb-shaped anti-warpage bar that can be attached to a printed wiring board, and the tip of the convex mounting leg as a one-node tooth is inserted into a hole in the printed wiring board. However, there are some types of boards that can be attached to the back of the board by caulking them.

(Problems to be Solved by the Invention) It is expected that both the warp prevention door and the warp prevention bar can prevent the central portion of the printed wiring board from warping even if the board is large. On the other hand, it is not easy to take F or J in either case.

For example, in order to adjust the length of the bottle or to fix the spelling, the warpage prevention door is provided with Pr3 holds on both sides of the board, and a bar C2 is placed between the P[3 holds. A tack must be provided to secure the

In addition, the warp prevention bar must be caulked by 4 g of each of the convex mounting leg portions inserted into the holes of the wiring board.

As described above, neither of them is easy to attach to a printed wiring board or to a printed wiring board running on a soldering line.

SUMMARY OF THE INVENTION An object of the present invention is to provide a warpage prevention jig that can prevent warping of the central part of a board to be soldered and can be extremely easily attached to the top surface of the board to be soldered.

[Structure of the invention]

(Means for solving the problem) The present invention is an improved warpage prevention jig that is attached to the top surface of the soldering board P to prevent warping of the solder + J board P. Three or more receiving parts 33 are provided on the lower surface of the jig main body 32 to be in contact with the temporary soldering material P, and a lifting shaft 37 is provided in the center of the jig main body 32 so as to be vertically movable and rotatable. FL21 and the T end of this lifting shaft 37 is inserted into the hole Ha of the J-plate P and suspended.
A hook 40 is integrally provided which is engaged with the lower surface of the root P to be soldered by changing the direction 4 by turning 7, and further elastically biases the lifting shaft 3γ upward to the lifting shaft 37. A spring 42 is attached.

(Function) The present invention attaches the jig main body 32 to the upper surface of the temporary P to be soldered via the receiving part 33, and the lifting shaft 37.
is pushed down against the spring 42, and the hook 40 below it is inserted into the hole 1-18 of the plate P to be soldered. Rotate the hook 40 to the lower side of the solder f=J plate P, and then
Release the push-down blade 7, and use the hook 10 to pull up the center part of the limb soldering board P using the force of the spring 42, and this wave (yonda f') will cause the bending of the board P, especially the center part 1. ^
Correct the problem.

(Embodiment) Hereinafter, the present invention will be explained in detail with reference to an embodiment shown in the drawings.

As shown in FIG. 1, four plate holding claws 13 are provided on the middle frame 12 on both the left and right sides of the board IT transport torge 11, and the claws 13 on both sides cover lυ (=J l) plates. Printing board 1 to wiring board P are sandwiched between them. The claw 13 on the right side is rotatably attached by a hinge 14 with a spring.
! It has a rotation 1 and a negative part 15. By pressing the operating portion 15 in the /f direction, the lower claw 13 is moved from the pudding 1 to the gland distribution star plate P to the 1
1 theory, 7. t IHp is removed from between the claws 13 on both sides.

The holder 11 is provided with rolling wheels 1G on both sides, and is movably placed on rails 17 provided on both sides. Also, from the right side of this holder 11, the conveying force transmission plate 18
is integrally protruded, and a slide bearing 19 is mounted on this plate 18.
h; has been established (). On the other hand, a conveyance bin 21 is arranged along the right side rail 17, and a conveyance bin 22 protruding from the conveyance bin 21 is slidably attached to the bearing 19.
are combined.

A warpage prevention shell 31 is mounted on the upper surface of the pudding 1 to wiring J:4 board P to prevent warping of the pudding 1 to wiring V board.

This anti-warp jig 31 has a five-piece wooden receiving part 33.52 (Fig. 2) which is in contact with the print 1-wiring board P on the lower surface of the jig main body 32 made of an acrylic resin plate. , In addition, furanone (=1
A hollow screw 34 is fitted, and this hollow screw 34 is attached to the ring 3.
KTr f-J I of oak 1-30 screwed together through 5
J to J: is fixed to the jig body 32, and a suspension i1*37 is fitted inside this hollow screw 34 so as to be vertically movable and rotatable, and furthermore, the lower part of this suspension 37 A wire 39 made by Jikun, which is inserted into the vJ 55 (FIG. 3) of the threaded part, is clamped and fixed by the gN of a plurality of small pins 38 screwed into the threaded part. The lower end of this wire 39 is bent at a right angle, and a hook 40 is integrally provided. Further, an operating portion 41 is integrally molded at the upper end of the lifting member 37, and a compression coil spring 42 is attached to the lifting shaft 37 between this operating portion 41 and the 7 flange portion of the hollow screw 34. The spring 42 causes the lifting shaft 31 to
is elastically biased upward.

Furthermore, as shown in FIG. 2, a replacement hole 51 for the hollow screw 34 is bored in the jig main body 32, and this hole
The hole 1-1 in which the hook 40 is bored in the printed wiring board P by replacing the lifting shaft 37 etc. using the hole 1-1
So that it will be inserted into a. Further, the receiving portion 52 is
It is provided near the hook 40 to prevent reverse warping (upward warping) of the printed B21 board P due to the tensile force of the hook 40. This receiving portion 52 and the other four receiving portions 33 are all formed to have the same length. Furthermore, two of the four receiving portions 33 have convex portions 53 at the lower ends for positioning.
is provided. Further, as shown in FIG.
He is completely taken aback by this.

Then, on the top surface of the printed wiring board P, +iQ mark I part 33.
2. When av, c, align the two convex portions 53 with the positioning holes Hb of the pudding 1 to 3 f, l tentative P and C1.
This warpage prevention jig 31 and the substrate P are positioned and covered. Then, the hook 40 is opposed to the hole 1a of the printed wiring board P, so when the lifting shaft 37 is pushed down against the spring 42, the hook 40 at the lower end is moved to the hole 1a of the printed wiring board P.
−1.1 is inserted. Furthermore, the lifting shaft 37 is
degree, rotate the hook 40 to the 1 side of the print 1 to wiring board P, then release the pressing blade of the lifting shaft 37, and print as shown in FIG. The hook 40 is engaged with the lower surface of the wiring board P, and the hook 40 is used to connect the printed wiring λ to the board P using the restoring force of the spring 42.
The central part of the printed wiring board P is pulled up to the level of the lower surface of the receiving part 52, and the deflection of the printed wiring board P, especially in the central part, is corrected, and the rest of the board P is made flat.

Incidentally, the hook 40 may be integrally molded at the end of the hanging @37. Further, if an upper limit stopper is provided to lock one stomach of the lifting shaft 31 at a predetermined level, the central receiving portion 52 may not necessarily be provided. Furthermore, the warpage prevention jig of the present invention can be used not only for printed wiring boards held by a holder, but also for pudding mill printed circuit boards that are directly held between the claws of a pair of endless chains (with a Holgle scoop) and transported. It can also be used for

〔Effect of the invention〕

According to the present invention, three or more receiving parts are provided on the lower surface of the plate-shaped jig main body, and three or more receiving parts are provided in contact with the plate to be soldered, and a lifting shaft is provided in the center of the jig main body for vertical movement. It is installed freely and rotatably, and the lower end of this lifting shaft is engaged with the workpiece (the temporary soldering object that is inserted into the hole of the soldering plate and changed direction by rotation of the lifting shaft). A hook is integrally installed () to hold the hanging tatami mat upward, and a spring is attached to the hanging shaft, so that the hanging shaft can be pushed against the spring. Lower it, insert the hook at the upper end into the hole in the plate, rotate the lifting shaft in the 8th direction, and rotate the hook to the bottom of the plate to be soldered. Next, by simply releasing the push-down blade of the lifting shaft, this warp prevention jig can be mounted on the top surface of the board to be soldered. It is possible to mount this warpage prevention jig on a printed wiring board.One knock, which is biased upward by +1N marking, corrects the warpage in the center of the board to be soldered. Because I do,
It is possible to keep the rest of the soldered board flat.

[Brief explanation of drawings]

Fig. 1 is a partially cutaway front view showing an embodiment in which the warpage prevention jig of the present invention is mounted on a transport vehicle lug, and Fig. 2 is a view of the jig from below. It is a sectional view of the No. 3121 u-th sleeper in the installed state. P... The cover is attached with lν [U temporary pudding 1-wiring board, 31... Warp prevention odor, 32... Jig body, 33...
Receiving part, 37... Lifting shaft, 40... Hook, 42... Spring.

Claims (1)

[Claims] (1) In a warpage prevention jig that is attached to the top surface of a board to be soldered to prevent warping of the board to be soldered, three or more receivers that are in contact with the board to be soldered are provided on the bottom surface of the plate-shaped jig main body. A lifting shaft is provided in the center of the jig main body so that it can move up and down and freely rotate, and the lower end of this lifting shaft is inserted into a hole in the board to be soldered and the direction is adjusted by rotation of the lifting shaft. By changing the structure, a hook that is engaged with the bottom surface of the board to be soldered is integrally provided.
A jig for preventing warpage of a board to be soldered, characterized in that the lifting shaft is equipped with a spring that elastically biases the lifting shaft upward.