JPS6027187A - Device for holding printed board in carrierless soldering equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION In order to avoid contact with electronic components disposed at the edge of the printed circuit board, the present invention performs soldering by pressing a pressing tool formed with a nine-cut arrow portion onto the printed circuit board. Carrier-less soldering, which can be removed after soldering is completed, relates to a holding device for a printed circuit board in a device.0 Figure 1 shows an embodiment in which polyum, an electronic component, is placed on the edge of a printed circuit board. It is a side sectional view showing an example. In this figure, 1 is a printed circuit board, 2 is the printed circuit board 1
Porium, 3, 4 disposed on the edge portion 1a in the conveying direction of
are the resistance element and the mounting terminal of the polyurethane 2, which are inserted into the printed circuit board 1, respectively. 5 is the above polyum 20
It is the axis of rotation.

When the polyurethane 2 is disposed on the edge portion 1a of the printed circuit board 1 in the transport direction in this manner, as shown in FIG.
0 body, the resistance terminal 3I mounting terminal 4 comes into contact with the holding claw 6, making it impossible to engage the printed circuit board 1, and furthermore, there are disadvantages such as the rotating shaft 5 coming into contact with the holding plate 7 of the holding claw 6. there were.

For this reason, soldering was sometimes performed by simply placing the printed circuit board 1 on the holding claws 6 without holding it between the holding claws 6. However, flux treatment.

In the preheating process, the printed circuit board 1 is
However, in the soldering process, especially when soldering is performed in a jet type soldering bath, the printed circuit board 1 may be pushed up by the force of the jetting solder melt, or it may be heated by the solder melt. causing warping,
There was a drawback that it could come off.

Furthermore, as shown in FIG. 3, it has been considered to engage the edge portion 1b of the printed circuit board 1 in the direction perpendicular to the conveyance direction with the holding claw 6, but the edge portion 1a in the conveyance direction is not engaged. Otherwise, there was a drawback that the printed circuit board 10 would warp more due to the heat generated by the solder melt.

Therefore, even if an attempt is made to prevent the printed circuit board 10 from warping by placing the printed circuit board 1 on the warpage prevention tool 8, the polyurethane 2 is disposed at the center of the edge portion 1a of the printed circuit board 1. In some cases, the warp prevention tool 8 cannot be held in the center, and is shifted to the holding claw 6 side, so that the printed circuit board 1 is busy warping and the warp prevention tool 8 cannot be effective. there were.

This invention was made in order to eliminate the above-mentioned drawbacks, and a notch is provided on the edge of the printed circuit board placed on the holding claw in the conveying direction to prevent the pressing tool from coming into contact with the polyurethane. The present invention provides a printed circuit board holding device that uses a pressing tool formed with a section, and can automatically move the pressing tool up and down to engage and disengage the printed circuit board placed on the holding claw.

This invention will be explained below.

FIG. 4 is a plan view showing an embodiment of the present invention, FIG. 5 is an enlarged sectional view taken along the line X-X in FIG. 4, and FIG.
), (C) are a plan view, a side view, and an enlarged sectional view taken along the Y-X line showing a holding device for a printed circuit board, FIG. 7 is a side view showing a device for preventing warpage of a printed circuit board, and FIG. It is an explanatory view showing operation of a holding device. In these figures, 11 indicates the entire carrierless soldering device. 12 is the carrier-less soldering device 110 base;
Reference numeral 13 denotes a pair of endless conveyance chenos, and 14 denotes holding claws attached to each of the aforementioned conveyance chenos 13, on which both end edges 1a of the Brisito group &1 are placed in the conveyance direction (the direction indicated by the arrow).
Reference numeral 5 denotes a ceno guide of the conveying ceno 13, and 16 denotes a pair of pressing tools that press and engage both end edges 1a of the printed circuit board 1 placed on each of the holding claws 14 in the conveying direction (arrow direction). As shown in FIG. 6(b), a notch 16a is formed to avoid contact with the polyurethane 2.

1T is a cylinder for moving the pressing tool 16 up and down, and 1B is a rod of the front cylinder 11. The pressing tool 16 is tightened and fixed with a nut 19 so as to be adjustable. 20 is a fixture for the F-cylinder 1T; 21 is a fixture for fixing the fixture 20; and a pressing tool 16I for fixing the air cylinder 11 to the printed circuit board 1. A slider 21a is a U-shaped connector for connecting one slider 21 in parallel with respect to the conveyance direction of the printed circuit board 1, and 22 is a guide for each slider 21. Each slider 21 is slidably fitted with a rod. 23 is a bearing for fixing the rod 22, and 24 is an endless traveling chain that causes the slider 21 to travel a predetermined distance in the direction indicated by the arrow, a portion of which is fixed to the slider 21. The travel of the traveling cheno 24 in the direction of arrow A is transmitted by the same drive source as the transport chino 13 via an electromagnetic clutch, which will be described later, and the return movement of the traveling chino 24 (in the opposite direction to the direction of the arrow) is transmitted by the F cylinder, which will be described later. (Fig. 8). Reference numeral 25 designates a chino guide for the traveling chino 24. Reference numeral 26 denotes a warpage prevention plate that engages both end edges 1b of the printed circuit board 1 in a direction perpendicular to the direction of conveyance (arrow entry direction) to prevent the printed circuit board 1 from warping due to heating by the solder melt. 27 is an air cylinder that moves the anti-warp plate 26 in the vertical direction in order to engage and disengage the anti-warp plate 26 from the printed circuit board 1; 2B is a rod of the air cylinder 27; 29 is a connecting plate;
It is fixed to the rod 28 by 0. 31 is a rod that connects the anti-warpage plate 26 and the connecting plate 29;
2 is adjustable. 33 is a fixture for the air cylinder 27; 34 is an air cylinder that moves the anti-warpage plate 26 in the front and rear direction of the conveyance direction of the printed circuit board 1 via the fixture 33; 35 is a rod of the air cylinder 34; It is fixed to the fixture 33 by 36. 3T is a rod, which is slidably attached to the fitting 33 of the air cylinder 21, as shown in FIG. 38
041 is a handle of the screw rod 40, and 42 is a guide provided integrally with the mounting base 38; 041 is a handle of the screw rod 40; In order to allow the mounting base 38 to slide smoothly by the rotation of the screw rod 40, the gasket 43, which is formed into a long plate, holds the anti-warpage plate 26 in a direction perpendicular to the conveyance direction of the printed circuit board 1. A plurality of moving sliders (in the embodiment, three sliders are each formed in an L shape); 44.
45 is an elongated connecting plate that connects the sliders 43 together; 46 is a bearing that rotatably supports the threaded rod 40; and is attached to the connecting plate 44. 41 is a gasket for smoothly sliding the connecting plate 45; 48 is a guide provided integrally with the connecting plate 45; a screw hole is formed therein, and a screw rod 49 is screwed therein; 5o is the screw rod 4
A bearing rotatably supports the slider 9, and is attached to the slider 21. 51 is a handle of the screw rod 49; 52
53 is a sprocket of each traveling chino 24, and 53 is a connecting shaft connecting one end side of each sprocket 52.

Further, in FIG. 8, 61 is a solder tank of the jet type. 62 is a photoelectric tube that detects that the printed circuit board 1 has been conveyed to the front of the solder bath 61; 63 is a photoelectric tube that detects the holding claw 14 or the gap between the holding claws; 64 is an electric 6fa clutch;
A motor (not shown) that serves as a drive source for running 3.
By engaging and disengaging with the traveling cheno 24, you can
Free status BVc is now available. 65 is an air cylinder for returning the pressing tool 16 to its original position; 66
is a rod of the air cylinder 65, which is connected to the slider 21 (FIG. 5) via a connecting plate 61.

Next, the operation will be explained.

First, a preparatory operation before soldering in the solder bath 61 will be described.

First, the number of holding claws 14 corresponding to the distance 11iL shown in FIG. 8 is set on a preset counter attached to a distribution board (not shown). That is, F cylinder 11
operates to lower the suppressing tool 16, press the printed circuit board 1 to engage the holding claws 14, perform soldering in the solder bath 61, and after completing the soldering, until the pressing tool 16 is raised. A numerical value obtained by dividing the traveling distance III L by the pitch p of the holding claws 14 and adding a number from 1 to 2 with a margin is set in the recent counter.

Next, turn the handle 41 to move each anti-warpage plate 26 to a position where it can be engaged with the printed circuit board 11C by the operation of each F-cylinder 27, 34 at both end edges 1b in the direction perpendicular to the conveying direction of the printed circuit board 1 (printed circuit board After setting K (a distance slightly away from 1), turn the handle 51 to set each anti-warp plate 26 to the center with respect to the direction perpendicular to the running direction of the printed circuit board 10, and complete the soldering preparation operation. do.

Next, the operation of engaging and disengaging the pressing tool 16 from the printed circuit board 1 will be explained.

The printed circuit board 1 is placed on the holding claws 14 and transferred to the conveyor chino 1.
3, it is transported in the direction of arrow A.

Next, the front edge 1b of the printed circuit board 1 that has been transported is detected by the phototube 62 shown in FIG. 8, and at the same time, a timer (not shown) is activated. The time that this timer is operating is when the printed circuit board 1 is in front of the solder bath 61,
It is set to the time when the vehicle is running. Next, when the timer expires, each air cylinder 17, 2
7.34 starts working at the same time. When the F cylinder 17 starts operating, the pressing tool 16 is lowered, and the printed circuit board 1 is pressed and fixed to the holding claws 14. In addition, each F cylinder 27. , 34, the warpage prevention plate 26 is activated by the start of operation.
The printed circuit board 1 is moved by lowering, horizontally moving, and rising.
0 on both end edges 1b.

The details of the operation of the anti-warp plate 26 will be described later based on FIG. 9.

Also, at the same time as the time amplifier of the timer, the electromagnetic clutch 64 is operated to drive the connecting shaft 53 to drive the travel check 724.
Since it runs at the same speed as the conveyance cheno 13, the pressing tool 16 is pressed, and the warp prevention plate 26 holds the printed circuit board 1 at the gl.
In this state, the pressing tool 16 and the warp stopper &26 run at the same speed and are soldered in the solder bath 61. Thereafter, when the printed circuit board 1 finishes traveling the distance 1IL1, a limit switch (not shown) is turned on by a count amplifier of a counter preset on the layout board, and the pressing tool 16 is raised by the F cylinder 1T. At the same time, the electromagnetic clutch 64 is actuated to release the coupling shaft 53 and make the travel check 724 free. Next, the air cylinder 65 is operated to move the pressing tool 16 in the direction opposite to the direction of arrow A to return it to its original position.

Next, the operation of the anti-warp plate 26 will be explained with reference to FIGS. 7 and 9.

FIGS. 9<a> to 9(e) are explanatory diagrams showing the operation of the anti-warpage plate 26. FIG.

Initially, the anti-warpage plate 26 was placed above the printed circuit board 1 as shown in FIG. When the limit switch (not shown) is turned on when the printed circuit board IK pressing tool 16 is engaged as shown in FIG. The stop plate 26 is lowered below the level of the printed circuit board 10 to the position shown in FIG. It moves horizontally, and as shown in FIG. 9(C), the
Position it with a slight gap. Next, the air cylinder 21 is actuated by turning on the limit switch without an opening, and the warp prevention plate 26 is raised, as shown in FIG. 9(d).
As shown, it is secured to the bottom surface of the printed circuit board 1.

In this manner, the printed circuit board 1 is conveyed and soldered in the solder bath 61 with the four sides of the printed circuit board 1 being pressed by the pressing tool 1s4 and the warpage prevention plate 26.

Next, 1 soldering is completed, and the printed circuit board 1 has a distance of 11i.
At the point when the pressing tool 16 is raised, the warping prevention plate 26 is moved horizontally at the same level by the air cylinder 34, and as shown in FIG. 9(e), the printed board &1 is also released. do. Next, IJ (not shown)
The mitsuto switch is turned on, and the warp prevention plate 26 is raised by the operation of the air cylinder 27, and the initial σ shown in FIG. 9(a) is
return to the on position.

As explained above, the present invention forms a notch in order to avoid contact with electronic components disposed at the edge of a printed circuit board, and also presses the printed circuit board placed on the holding claw from above. A pressing tool is used to fix the holding claw to the holding claw, and this pressing tool is fixed to the printed circuit board before soldering.Since the soldering is completed, the pressing tool is moved up and down to enable the printed circuit board to be attached and detached. On the other hand, a slider fixed integrally with the drive source to move the printed circuit board in the same direction as the running direction of the printed circuit board while suppressing the printed circuit board with a suppressor, and a drive source that moves this slider only when necessary. After soldering is completed, carrier-less soldering forms a holding device for the printed circuit board in the equipment, and a drive source that releases the pressure on the pressing tool and returns the pressing tool to its original position. Even if electronic components such as a volume are placed on the edge, the printed circuit board can be pressed and held stably by the suppressor formed to avoid the electronic components, so the jetting force of the jet wave of the solder melt can be used to hold the printed circuit board stably. This prevents the printed circuit board from being pushed upwards and coming off the holding claws, and prevents the printed circuit board from warping due to heating of melted solder, etc. Furthermore, the pressing tool automatically presses against the printed circuit board and releases it. This has the advantage of reducing labor costs due to labor saving.

[Brief explanation of the drawing]

Fig. 1 is a side cross-sectional view showing an example of an embodiment in which polyum, which is an electronic component, is arranged on the edge of a printed circuit board, and Fig.
An explanatory diagram showing that it is impossible for the printed circuit board shown in the figure to engage with the double-shaped holding claw. Figure 3 shows the case where the short edge of the printed circuit board shown in Figure 1 is engaged. 4 is a plan view showing an embodiment of the present invention, FIG. 5 is a sectional view taken along the line X-X in FIG. 4, and FIGS. 6(a) and (b).
, (C) are a plan view and a side view showing a printed circuit board holding device. An enlarged sectional view taken along the Y-Y line, Figure 7 is a side view showing the printed circuit board warpage prevention device, Figure 8 is an explanatory diagram showing the operation of the printed circuit board holding device, and Figures 9 (aJ to (e) are It is an explanatory diagram showing the operation of a warpage prevention plate for a printed circuit board. In the figure, 1 is a printed circuit board, 2 is a polyurethane, 11 is a device for carrier-less soldering, 12 is a base, 13 is a conveyance cinch, and 14 is a holding claw. , 16 is a pressing tool, 16a is a notch, 17
, 27, 34.65 are air cylinders, 20.33 are fixtures, 21.43 are sliders, 21a are connectors, 22.3
7 is a rod, 24 is a traveling chino, 26 is a warpage prevention plate, 3
8 is a mounting base, 40, . 49 is a screw rod, 42.47 is a packing, 44.degree. 45 is a connecting plate, 53 is a connecting shaft, 61 is a solder bath, 62.63 is a phototube, and 64 is an electromagnetic clutch. Se1 ``1 1to5

Claims (1)

[Claims] Carrier-less soldering, in which the printed circuit board is soldered by placing it on the holding claws of a conveying chino, requires a cutout in the edge of the printed circuit board to avoid contact with the electronic components arranged on the edge of the printed circuit board. a pressing tool for pressing the printed circuit board from above and fixing it to the holding claw; and a pressing tool for fixing the pressing tool to the printed circuit board and then soldering, and for removing the pressing tool after soldering is completed. a driving source for moving the pressing tool up and down to enable engagement and detachment of the printed circuit board; and a drive source for pressing the pressing tool against the printed circuit board and then moving it in the same direction as the conveyance direction of the printed circuit board. a slider that slides integrally with a power supply; a drive source that causes the slider to travel only when necessary; and a drive source that releases the pressure of the pressing tool and returns the slider to its original position after soldering is completed. A holding device for a printed circuit board in a carrierless soldering device, which is characterized by comprising: