JPS6027189A - Method of holding printed board in carrierless soldering equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention automatically presses a printed circuit board by vertically moving a pressing tool having a notch in order to avoid contact with electronic components disposed at the edge of the printed circuit board. Carrier-less soldering, in which a warp prevention plate can be automatically engaged and detached from the front and rear edges of a printed circuit board in the running direction, is related to a method for holding a printed circuit board in an apparatus.

FIG. 1 is a side sectional view showing an example of an embodiment in which polyurethane, which is an electronic component, is disposed at the edge of a printed circuit board. In this figure, 1 is a printed circuit board, 2 is the printed circuit board 1
3.4 Porium disposed on the edge 1a in the conveying direction of the
are the resistance terminals and mounting terminals of the polyurethane 2, which are inserted into the parallel printed circuit board 1. 5 is the volume 20
It is the axis of rotation.

In this way, when the porium 2 is disposed on the edge portion 1a of the printed circuit board 1 in the conveying direction, as shown in FIG.
body, resistance terminal 3. There were drawbacks such as the mounting terminal 4 coming into contact with the holding claw 6 and making it impossible to engage the printed circuit board 1, and furthermore, the rotating shaft 5 coming into contact with the holding plate 1 of the holding claw 6.

Therefore, it is impossible to solder the printed circuit board 1v by simply placing it on the board without having to hold it in the holding claws 6. However, Franks processing.

In the preheating process, it is sufficient to simply place the printed circuit board 1, but in the soldering process, especially when soldering is performed in a jet-type soldering bath, the printed circuit board 1 is There was a drawback that 1 could be pushed up and crossed, heated by the solder melt, causing a curved shape and coming off.

Furthermore, as shown in FIG. 3, it has been considered to engage the edge portion 1b of the printed circuit board 1 in the direction perpendicular to the conveyance direction with the holding claw 6, but the edge portion 1a in the conveyance direction is not engaged. IL
Ino has the disadvantage that the printed circuit board 10 warps greatly due to the heat generated by the solder melt.

Therefore, even if an attempt is made to prevent the printed circuit board 1 from warping by mounting the printed circuit board 1 on the warpage prevention tool 8, the polyurethane 2 is placed in the center of the edge 1a of the printed circuit board 1. If the warp prevention tool 8 cannot be held in the center, and is shifted to the holding claw 6 side, the warpage prevention tool 8 cannot be effectively used against warping of the printed circuit board 10. was there.

On the other hand, it has been proposed that a long warp prevention plate is provided in the jet solder melt in the same direction as the conveyance direction of the printed circuit board 1 as a device for preventing warpage of the printed circuit board 10. In the case of holding claws that come into contact with electronic components or lead healds, etc., or that are only used to hold one printed circuit board, the force of the solder melt may cause the printed circuit board to warp. There was a drawback that it could not be used because it was closed.

] However, while the printed circuit board 1 is constantly being transported, there are drawbacks such as the difficulty of setting the warp prevention tool in the front direction of the printed circuit board in the transport direction.

This invention overcomes the above-mentioned drawback 'fx8￥ because it disappears, and the purpose of this invention is to avoid the suppressor from coming into contact with the polyurethane disposed at the edge of the printed circuit board placed on the holding claw in the conveyance direction. A holding device for a printed circuit board that can automatically move the holding device up and down to automatically engage and release the printed circuit board after it has been placed is provided. In addition, the present invention provides a method for holding a printed circuit board in which a warpage prevention plate can be held on the printed circuit board even while the printed circuit board is running.

This invention will be explained below.

FIG. 4 is a plan view showing an embodiment of the present invention, FIG. 5 is an enlarged cross-sectional view taken along line X-X in FIG. 4, and FIGS.
b), (e) are a plan view, a side view, and an enlarged sectional view taken along the Y-Y line showing a holding device for a printed circuit board, FIG. 7 is a side view showing a device for preventing warpage of a printed circuit board, and FIG. 8 is a printed circuit board. FIG. 3 is an explanatory diagram showing the operation of the holding device of FIG. In these figures, 11G! Carrierless soldering shows the entire device. 12 is the carrierless soldering device 110
A base 13 is a pair of endless conveyance chees 7. 14 is a holding claw attached to each of the conveyance chees 713, on which both end edges 1a of the printed circuit board 1 in the conveyance direction (direction of arrow A) are placed. . Reference numeral 15 denotes a chain guide of the conveyance check 713, and reference numeral 16 denotes a chain guide 1 for pressing and engaging both end edges 1a in the conveyance direction (direction of arrow A) of the printed circuit board 1 placed on each of the holding claws 14.
With a pair of suppressors, shown in FIG. 6(b), jJ: Sea urchin notch 16
& is formed to avoid contact with polyium 2. 17 is an F cylinder for vertically moving the pressing tool 16; 18 is a rod of the air cylinder 17;
The pressing tool 16 is adjustably tightened and fixed by a nut 19. 2Qli The fitting 21 of the air cylinder 17 fixes the fitting 20, and suppresses A16.
A slider 21a is used to move the air cylinder 17 in synchronization with the travel of the holding claw 14 holding the printed circuit board 1, and 21a is a fold-shaped connector that connects one slider 21 in parallel with respect to the conveyance direction of the printed circuit board 1. , 22 are rods that guide each slider 21', and each slider 21 is slidably fitted therein. 23G'j A bearing 24 for fixing the P-shaped dot 22 is an endless traveling chain that causes the slider 21 to travel a predetermined distance in the direction indicated by the arrow, and a portion of the bearing is fixed to the slider 21. Note that the traveling of the traveling cheno 24 in the direction of arrow A is transmitted by the same drive source as that of the conveying chino 13 via an electromagnetic clutch l, which will be described later.
The return operation (in the opposite direction to the direction of the arrow) is performed by the operation of the F cylinder, which will be described later (No. 8). Reference numeral 25 designates a chino guide for the traveling chino 24. Reference numeral 26 denotes a warpage preventing plate that engages both end edges 1b of the printed circuit board 1 in a direction perpendicular to the conveying direction (input direction of the arrow);
This prevents warping due to heating by the solder melt. 2
7 is an air cylinder that moves the anti-warp plate 2B'Y vertically in order to engage and disengage the anti-warp plate 26 from the printed circuit board 1, 2B is a rod of the F cylinder 2T, and 29 is a connecting plate, which is connected to the rod 2B by a nut 30. It is fixed.

Reference numeral 31 denotes a rod that connects the warpage preventing plate 26 and the connecting plate 29, and is attached to a nut 32 so as to be able to rotate z*i. 33 is a fixture for the F-cylinder 27, and 34 is a warp prevention plate 26'& printed circuit board 1 via the fixture 33.
an F cylinder that moves in the front and back direction of the conveyance direction, 35
is a rod of the air cylinder 34, which is fixed to the fixture 33 with a nut 36. Reference numeral 37 denotes a rod, which is slidably fitted into the fixture 33'll' of the F-cylinder 27, as shown in FIG. 38 is a mounting base for fixing the cylinder 34 and the rod 37; 39 is a guide provided integrally with the mounting base 38, and is screwed into the threaded rod 40.

41 is the handle of the screw rod 40, 42 is the screw rod 4
In order to allow the mounting base 311 to slide smoothly by the rotation of 0, a plurality of gaskets 43 are formed in a long plate body and move the anti-warp plate 26 in a direction perpendicular to the conveyance direction of the printed circuit board 1. (In the embodiment, there are three sliders, each formed in an L shape), and 44.45 is each slider 4.
An elongated connecting plate 46 that connects the screw rods 3 together is a bearing that rotatably supports the screw rod 40, and is attached to the connecting plate 44. Reference numeral 47 denotes a gasket for smoothly sliding the connecting plate 45Y, and 48 denotes a guide provided integrally with the connecting plate 45, in which a screw hole is formed and a screw rod 49 is screwed into the guide. Reference numeral 50 denotes a bearing rotatably supported by the threaded rod 49Yft, which is attached to the slider 21. 51
52 is the handle of the threaded rod 49, 52 is the sprocket of each traveling chain 24, and 53 is each of the sprockets 52.
It is a connecting shaft that connects one end of the.

In addition, in the eighth @, 61 is a solder bath that uses a jet type. 62 is a photoelectric tube that detects when the printed circuit board 1 has been conveyed to the front of the solder bath 61, and 63 is a A photoelectric tube 64 detects the gap between the holding claws 14 or the holding claws 140, and 64 is an electromagnetic clutch.
By engaging and disengaging from a motor (not shown) that serves as a drive source for Y traveling, the traveling cheno 24 is caused to travel or is brought into a free state. Reference numeral 65 denotes an F cylinder for returning the pressing tool 16 to its original position, and 66 a rod of the F cylinder 65, which is connected to the slider 21 (FIG. 5) via a connecting plate 67.

Next, the operation will be explained.

First, the preparation operation before the soldering process 5 in the solder bath 61 will be described.

First, attach the holding claw 1 corresponding to the distance shown in Fig. 8 to the preset counter attached to the power distribution board (not shown).
Sent the number 4. That is, the F cylinder 1T operates to lower the suppressor 16, and the printed circuit board 1y+1
- Press to engage the holding claw 14, perform soldering on the solder phase 61, and after completing soldering (-), press 1
6. The distance traveled until the vehicle rises to 6 degrees, divided by the pinch p of the retaining claw 14, and the margin t added to the number Y of 1 to 2 is set in the preset counter.

Next, the handle 41 is used to hold each anti-warpage plate 26 at a position where it can be held with respect to the flint board 1 (C) by the operation of each air cylinder 27, 34 at both end edges 1b in a direction perpendicular to the conveying direction of the printed circuit board 1. (a little distance from the printed circuit board 1), turn the huff 1-rule 51 to
The stop plate 26' is set so as to be located at the center with respect to the direction perpendicular to the running direction of the printed circuit board 10, and the soldering preparation operation is completed.

Next, the operation of engaging and disengaging the pressing tool 16 from the printed circuit board 1 will be explained.

The printed circuit board 1 is placed on the holding claws 14 and transferred to the conveyor chino 1.
After 30 runs, it is transported in the direction indicated by the arrow.

Next, the front edge 1b of the printed circuit board 1 that has been transported is detected by the phototube 62 shown in FIG. 8, and at the same time, a timer (not shown) is activated. The time that this timer is operating is when the printed circuit board 1 is at a distance L before the solder bath 61!
The running time is set. Next, when the timer times up, each air cylinder 17, 27
．． 34 start operating at the same time. When the air cylinder 17 starts operating, the suppressor 16 is lowered, and the printed circuit board 1 is lowered.
is pressed to fix it to the holding claw 14. In addition, when the air cylinders 27 and 34 start operating, the anti-warp plate 26Y is lowered, horizontally moved, and raised to place the printed circuit board 10 on both end edges 1b.

The details of the operation of the anti-warp plate 26 will be described later based on FIG. 9.

Further, at the same time as the timer expires, the electromagnetic clutch 64 is actuated to drive the connecting shaft 531 to drive the traveling chino 2.
4 is run at the same speed as the conveyance cheno 13, the suppressor 16 is pressed, and with the warpage prevention plate 26 or the printed circuit board 1 mounted, the suppression tool 16 and the warpage prevention plate 26 run at the same speed, and the solder is removed. Soldering is carried out in tank 61. Thereafter, when the printed circuit board 1 finishes traveling a certain distance, a limit switch (not shown) is turned on by the count-up of a counter set in advance on the switchboard, and the pressure A16 is increased by the air cylinder 1T. At the same time, the electromagnetic clutch 64 is actuated to release the engagement with the connecting shaft 53, thereby setting the travel cheno 24 in a free state. Next, the F cylinder 65 is operated to move the pressing tool 16 in the direction opposite to the direction of arrow A and return it to its original position.

Next, the operation of the anti-warp plate 26 will be explained with reference to FIGS. 7 and 9.

FIGS. 9(a) to 9(e) are explanatory diagrams showing the operation of the warp prevention plate 26.

Initially, the anti-warpage plate 26 is placed above the printed circuit board 1 as shown in FIG. It is set in the moved position.

Next, as shown in FIG.
6 is engaged, a limit switch (not shown) is turned on, and the air cylinder 27 shown in FIG. 7 is operated to lower the anti-warpage plate 26 below the level of the printed circuit board 1, as shown in FIG. 9(b). position. Next, when a limit switch (not shown) is turned on, the F-cylinder 34 is activated, and the warping prevention plate 26yil is moved horizontally at the same level, and as shown in No. 91'W(c), the front and back of the printed circuit board 10 both end edges 1b are moved. The position VCj is maintained with an extremely small gap. Next, when a limit switch (not shown) is turned on, the air cylinder 2T is actuated to raise the anti-warp plate 26 so that it engages with the lower surface of the printed circuit board 1 as shown in FIG. 9(d).

In this manner, the printed circuit board 1 is conveyed with the four sides of the printed circuit board 1 being held down by the suppressor 16 and the anti-warp plate 26, and soldered in the solder bath 61.

Next, the soldering is finished, the printed circuit board 1 is separated,
At the end of the Y travel, the pressing tool 16 rises and at the same time the warp prevention plate 26 is moved horizontally at the same level by the air cylinder 34, and the printed circuit board 1 is also detached as shown in FIG. 9(e). . Next, a limit switch (not shown) is turned on, and the anti-warpage plate 26 is raised by the operation of the air cylinder 27, returning to the initial position shown in FIG. 9(a).

As explained above, this invention prevents warping of printed circuit boards!
The anti-warpage plates to be prevented are set at positions where they can be placed on both end edges of the printed circuit board in a direction perpendicular to the direction in which the printed circuit board is transported, and at the center of the board in the direction perpendicular to the direction in which the printed circuit board is transported. At the same time as the pressing tool is lowered in order to press the printed circuit board and fix it to the holding claws with a pressing tool having a notch 7 to avoid contact with the electronic components arranged at the edge of the printed circuit board in the conveying direction. After the warpage prevention plate is lowered below the level of the printed circuit board, it is moved horizontally to a position where there is a very small gap with respect to the printed circuit board, and then raised and brought into contact with the lower surface of the printed circuit board, and then,
A slider equipped with a pressure plate and a warpage prevention plate is moved simultaneously with the movement of the printed circuit board to solder it to the printed circuit board, and after soldering is completed, the pressure tool is raised to release the pressure from the suppression tool at the same time. After moving the warpage prevention plate horizontally to remove it from contact with the printed circuit board, the warpage prevention plate is raised to return to its original position.
Furthermore, the slider was moved in the opposite direction to the conveyance direction of the printed circuit board and returned to its original position to hold the printed circuit board of the device during carrier-less soldering, so a volume control or the like was placed on the edge of the printed circuit board. Even if electronic components are placed, the printed circuit board can be stably held by pressing the printed circuit board with the suppressor formed to avoid the electronic components, so the printed circuit board is pushed upward by the jet force of the jet wave of the solder melt. In addition, since the printed circuit board is held down on all four sides by the pressing tool and the warp prevention plate, it is completely possible to prevent the printed circuit board from warping due to heating of melted solder, etc. It is possible to prevent the solder melt from covering the top surface, and furthermore, the pressing tool and the anti-warp plate can be automatically attached to and removed from the printed circuit board while the printed circuit board is running. There is no need to stop (the entire soldering process can be automated, reducing the time required for soldering)
It has the advantage of being able to reduce labor costs through labor saving.

[Brief explanation of drawings]

Fig. 1 is a side cross-sectional view showing an example of a mode in which a volume, which is an electronic component, is arranged at the edge of a printed circuit board, and Fig.
An explanatory diagram showing that it is impossible for the printed circuit board shown in the figure to engage with the mouth-shaped retaining claws. Fig. 1 is a plan view, Fig. 41 is a plan view showing one embodiment of the present invention, and Fig. 5 is a sectional view taken along the line
), <C) are a plan view and a side view showing a printed circuit board holding device. An enlarged cross-sectional view taken along the Y-Y line, FIG. 7 is a side view showing the printed circuit board warpage prevention device, FIG. 8 is an explanatory diagram showing the operation of the printed circuit board holding device, and FIG. 9 (al to <e) is FIG. 3 is an explanatory diagram showing the operation of a warpage prevention plate of a printed circuit board. In the figure, 1 is a printed circuit board, 2 is a volume, 11 is a carrier-less soldering device, 12 is a base, 13 is a conveyance chino, 14 is a holding claw, 16 is a pressing tool, 16a is a notch, 17
, 27, 34.65 are air cylinders, 20.33 are attachments, 21.43 are sliders, 21ai! Connector, 22.
37 is a rod, 24 is a traveling chino, 26 is a warpage prevention plate,
38 is a mounting base, 40.49 is a screw rod, 42.47 is a gasket, 44.degree. 45 is a connecting plate, 53 is a connecting shaft, 61 is a solder bath, 62.63 is a phototube, and 64 is an electromagnetic clutch.

Claims (1)

[Claims] Carrier-less soldering, in which a printed circuit board is placed on the holding claws of a conveyance cheno and soldered while running, is performed by placing a warpage prevention plate in a direction perpendicular to the direction of conveyance of the printed circuit board to prevent the printed circuit board from warping. It is set at a position where it can be placed on both end edges and at the center with respect to the direction perpendicular to the conveying direction of the printed circuit board, and then placed at the edge of the printed circuit board in the conveying direction. In order to press the printed circuit board with a pressing tool having a notch to avoid contact with electronic components and fix it to the holding claw, the pressing tool is lowered and at the same time the warpage prevention plate is lowered from the level of the printed circuit board. After descending downward, there is a very small gap with the printed circuit board! The slider is moved horizontally to a position where the printed circuit board is moved horizontally, and then raised and brought into contact with the lower surface of the printed circuit board.Next, the slider provided with the pressing plate and the anti-warpage plate is moved simultaneously with the movement of the printed circuit board to touch the printed circuit board. Soldering is performed, and after the soldering is completed, the pressing tool is raised to release the suppression of the pressing tool, and at the same time, the warping prevention plate is moved horizontally in order to separate the warping prevention plate from contact with the printed circuit board. After that, the warpage prevention plate is raised to return to its original position, and the slider is further moved in a direction opposite to the conveying direction of the printed circuit board to return it to its original position. A method of holding a printed circuit board in a soldering device.