JPH0736469B2 - Printed circuit board warpage prevention device in carrierless soldering equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to prevention of warpage of a printed circuit board in a carrierless soldering device in which warp prevention plates can be automatically engaged with and disengaged from both end portions of the printed circuit board at a right angle to the conveying direction. It relates to the device.

[0002]

2. Description of the Related Art As shown in FIG.
Although the edge portion 1a in the direction parallel to the conveyance direction is engaged with the holding claw 3, the edge portion 1b in the direction perpendicular to the conveyance direction (front-back direction of the conveyance direction) is not engaged, so that the solder melting The printed circuit board 1 has a large warp due to the heat generated by the liquid.

Therefore, in order to prevent the warp of the printed circuit board 1, it has been considered that the printed circuit board 1 is placed on the warp preventing tool 4 to prevent the warp (Japanese Patent Laid-Open No. 58-100).
(See Japanese Patent No. 492), the engaging claw at the tip of the rod is engaged and disengaged from the printed circuit board 1 by the rotation of the rod, so that the support length of the printed circuit board 1 cannot be made sufficiently long. That is, the engaging claw is trying to increase the support length.
If you increase the value,
It will come into contact with the parts mounted on the board and its lead wires,
Destroy the mounting state of mounted components and use them in reality
I can't. Or the mounting area of components on the printed circuit board
You will be severely constrained. And further support
If the engagement claw is enlarged to lengthen the
This is also a realistic use, as it will hit the chain.
Cannot be used.

[0004]

A conventional warp preventive tool is as follows.
Supporting length is rather short, as described above, Me was unable long support length <br/>, the effect as a warp preventing member 4 has a drawback such as not sufficiently appear against warpage of the printed circuit board 1. That is,
The printed circuit board 1 having a long end line portion 1b has a long shape.
In case of large printed circuit board 1 where warpage is a problem
The length to be supported becomes insufficient, and it is placed on the engaging claw.
The problem that can not be prevented because the warp occurs in the part that does not
was there. That is, the printed circuit board 1 is held or mounted.
Except for the part where it is placed, warpage occurs, and the edge 1b
There is a problem that it warps in a "W" shape. Also, JP-A-58-10
As shown in Japanese Patent No. 0492, the front side edge of the printed circuit board
Mechanism that mounts and supports the rear part and the rear edge, that is, "automatic
In order to warp prevention mechanism "is to operate independently, to escort, up
"Engagement" on the front and rear edges of the lint board
The engagement accuracy of the "claw" is poor, and the "automatic warpage prevention mechanism"
The accuracy when traveling with the printed circuit board is also likely to deteriorate. So
Therefore, the printed circuit board may not have enough depth for engagement.
Is the problem that the printed circuit board is easily disengaged from the "engaging claws".
There was a problem.

The present invention has been made in order to solve the above-mentioned drawbacks, and a printed circuit board is provided with a short depth over a long distance.
Also, it is an object of the present invention to provide a warp prevention device that can be supported accurately and stably , and that even while the printed circuit board is running, the warp prevention plates can be engaged with both end edges of the printed circuit board in the direction perpendicular to the conveying direction. And

[0006]

SUMMARY OF THE INVENTION A printed circuit board warp prevention device in a carrierless soldering apparatus according to the present invention is provided with both end edges in a direction perpendicular to the direction in which the printed circuit board is conveyed.
Place each part to prevent warping due to heating of the printed circuit board.
An L-shaped warp prevention plate having a rectangular bottom plate portion for preventing, an interval setting means for presetting positions of both the warp prevention plates so that a printed circuit board can be inserted between the bottom plate portions of these warp prevention plates, and a warpage prevention device. A width direction moving means for moving and setting the plate in a direction perpendicular to the printed board conveying direction, and a warp stop plate vertical direction moving means for moving the warp stop plate in a vertical direction substantially perpendicular to the plate surface of the printed board. , How to convey the printed circuit board from the position set by the interval setting means
A horizontal direction moving unit that moves in a direction parallel to the board surface of the printed circuit board in a direction parallel to the direction and locks the two warp prevention plates on the printed circuit board.
Moving means, anti-warp plate vertical moving means and horizontal direction
The moving means are assembled together to form an assembly
At the same time, this assembly is
A sli that can slide on a rod installed in the parallel direction.
The warp prevention plate driving means is configured to convey the printed board at the same speed in the conveying direction via the dam, to stop it, or to return it in the opposite direction to restore it.

[0007]

According to the present invention, both end edges of the direction perpendicular to the conveying direction of the printed board, warp is supported lifting is prevented by a rectangular bottom plate portion of the warp stop plate of L-shaped. That is,
The warpage prevention plate extends over both edges of the printed circuit board over a long range.
It is possible to support the
You can And the warpage prevention plate is assembled together
The distance setting means, the width direction moving means, the warp prevention plate vertical movement means, the horizontal direction movement means, and the like are set to desired positions, and the warp prevention plate driving means assembles them.
Conveying although obtained, stop, control of the recovery is performed. did
As a result, the warpage prevention plate for both edges of the printed circuit board
The engagement accuracy is good and stable, and the
You can also run accurately.

[0008]

1 is a plan view showing an embodiment of the present invention, FIG.
Is an enlarged cross-sectional view taken along line XX of FIG. 1, FIG.
(B) and (c) are a plan view showing a printed circuit board holding device, a side view, an enlarged sectional view taken along line YY, FIG. 4 is a side view showing a printed circuit board warp prevention device, and FIG. It is explanatory drawing which shows operation | movement of a holding | maintenance apparatus.

In FIG. 1 and FIG. 2, reference numeral 11 shows the entire carrierless soldering apparatus. Reference numeral 12 is a base of the carrierless soldering apparatus 11, 13 is a pair of endless transfer chains, 14 is a holding claw attached to each of the transfer chains 13, and is a transfer direction of the printed circuit board 1 (direction of arrow A). Both edge portions 1a 1 and 1a 1 in the direction parallel to are placed. Reference numeral 15 is a chain guide of the transfer chain 13, and 16 is each of the holding claws 1.
3 (a) and 3 (b) are a pair of pressing tools that press and engage both end edges 1a 1 of the printed circuit board 1 placed on 4 in the direction parallel to the conveying direction (arrow A direction). As shown in
The notch 16a is formed to avoid contact with the volume 2. 17 is an air cylinder for moving the pressing tool 16 up and down, 18 is a rod of the air cylinder 17, and the pressing tool 16 is adjustably tightened and fixed by a nut 19. Reference numeral 20 is a fixture for the air cylinder 17, 21 is a fixture for fixing the fixture 20, and a pressing tool 1
6, a slider for moving the air cylinder 17 in synchronism with the traveling of the printed circuit board 1 and the holding claws, and 21a is a U-shape for connecting the sliders 21 on one side in parallel to the transport direction of the printed circuit board 1. A connecting tool 22 is a rod for guiding the sliders 21, and the sliders 21 are slidably fitted therein. Reference numeral 23 is a bearing for fixing the rod 22, 24 is an endless traveling chain for traveling the slider 21 in the direction of the arrow A by a predetermined distance, and a part thereof is fixed to the slider 21. Incidentally, the traveling direction of the arrow A of the traveling chain 2 4 is transmitted by the same drive source and the transport chain 13 through the electromagnetic clutch will be described later, traveling Cheng 2
The return operation of 4 (the direction opposite to the arrow A direction) is performed by the operation of the air cylinder described later (FIG. 5). Reference numeral 25 is a chain guide of the traveling chain 24. Numeral 26 is an L-shaped warp prevention plate having a rectangular bottom plate portion for engaging both end edges 1b 1 , 1b in a direction perpendicular to the conveying direction of the printed circuit board 1 (direction of arrow A). Prevents warping due to heating by the solder melt. Reference numeral 27 is an air cylinder for moving the warp prevention plate 26 up and down in order to disengage the warp prevention plate 26 from the printed circuit board 1, 28 is a rod of the air cylinder 27, 29 is a connecting plate, and as shown in FIG. It is fixed to the rod 28 by 30. Three
Reference numeral 1 denotes a rod connecting the warp prevention plate 26 and the connecting plate 29, which is adjustably attached by a nut 32. Reference numeral 33 is a fixture for the air cylinder 27, 34 is an air cylinder for moving the warp prevention plate 26 in the front-back direction of the conveyance direction of the printed circuit board 1 via the fixture 33, 35 is a rod of the air cylinder 34, and a nut. It is fixed to the fixture 33 by 36. A rod 37 is slidably fitted to the fixture 33 of the air cylinder 27. Reference numeral 38 is a mounting base for fixing the air cylinder 34 and the rod 37, and 39 is a guide integrally provided with the mounting base 38, which is screwed to a threaded rod 40. 41 is the threaded rod 4
0 is a handle, 42 is a sliding contact plate formed on a long plate so that the mounting base 38 can be slid smoothly by the rotation of the screw rod 40, and 43 is the warp prevention plate 26 of the printed circuit board 1
A plurality of sliders (three in this embodiment, each of which is formed in an L shape) moving in the direction perpendicular to the transport direction of the sliders, and 44, 45 are elongated shapes for integrally connecting the sliders 43. The connecting plate 46 is a bearing that rotatably supports the screw rod 40, and is attached to the connecting plate 44.
Reference numeral 47 is a sliding contact plate for smoothly sliding the connecting plate 45, and 48 is a guide integrally provided with the connecting plate 45, in which a screw hole is formed and a screw rod 49 is screwed. 5
Reference numeral 0 denotes a bearing that rotatably supports the screw rod 49 and is attached to the slider 21. 51 is the screw rod 4
9 is a handle, 52 is a sprocket of each traveling chain 24, and 53 is a connecting shaft that connects one end side of each sprocket 52. The anti-warp plates 26, 26
And between the bottom plate portions of these anti-warp plates 26, 26.
Of the anti-warp plates 26, 26 so that the printed circuit board 1 can be inserted.
Interval setting means for setting the position in advance, and warp stop plate
26 is moved in the direction perpendicular to the conveyance direction of the printed circuit board 1 and installed.
Print the width direction moving means to set and the warp stop plate 26
Move it in the vertical direction, which is a direction substantially perpendicular to the plate surface of the substrate 1.
Anti-warp vertical movement means and spacing setting means
The direction parallel to the transport direction of the printed circuit board 1 from the fixed position
In parallel with the board surface of the printed circuit board 1
A horizontal direction in which the warp prevention plates 26, 26 are locked to the board 1.
The direction moving means is assembled together to form an assembly.
And the printed circuit board 1 is conveyed by the warp prevention drive means.
It is configured to accompany you.

In FIG. 5, 61 is a solder bath,
A jet type is used. Reference numeral 62 designates a light source and a photoelectric tube, which are provided so as to face each other to detect that the printed circuit board 1 has been conveyed to the front of the solder bath 61, and 63 denotes an opposite, which detects the holding claw 14 or a gap between the holding claws 14. The light source and the photoelectric tube, and 64 are electromagnetic clutches, which engage and disengage with a motor (not shown) which is a drive source for causing the transport chain 13 to travel, thereby causing the travel chain 24 to travel or to be in a free state. Reference numeral 65 is an air cylinder for returning the pressing tool 16 to the initial position, 66 is a rod of the air cylinder 65, and a slider 2 is provided via a connecting plate 67.
1 (FIG. 2).

Next, the operation will be described. First, the preparatory operation before soldering in the solder bath 61 will be described.

First, the number of holding claws 14 corresponding to the distance L1 shown in FIG. 5 is set in a preset counter attached to a switchboard (not shown). That is, the air cylinder 17 operates to lower the pressing tool 16, press the printed circuit board 1 to engage the holding claws 14, solder in the solder bath 61, and after the soldering is completed, the pressing tool 16 is pressed.
To set the preset counter numerical values plus the number of 1-2 with a margin divided by the pitch p of the holding claws 14 a distance L1 to increase the.

Next, by turning the handle 41, each of the warp prevention plates 26 is attached to each of the air cylinders 2 with respect to the printed circuit board 1 at both end edges 1b in the direction perpendicular to the conveying direction of the printed circuit board 1.
Positions that can be engaged by the operation of 7, 34 (printed circuit board 1
(A little away from the distance), and then turn the handle 51 to set each warp prevention plate 26 so that it is located at the center of both end edges 1b 1b of the direction perpendicular to the traveling direction of the printed circuit board 1 and solder it. The preparation operation of is ended.

Next, the operation of engaging and disengaging the pressing tool 16 from the printed circuit board 1 will be described. The printed circuit board 1 is placed on the holding claws 14 and is transported in the direction of arrow A as the transport chain 13 travels. Next, the front edge portion 1b of the conveyed printed circuit board 1 is detected by the light source and the photoelectric tube 62 provided facing each other as shown in FIG. 5, and at the same time, a timer (not shown) is activated. The operating time of this timer is set to the time for the printed circuit board 1 to travel the distance L2 before the solder bath 61. Then, when the timer times out, the air cylinders 17, 27, 34 start operating at the same time. In the air cylinder 17, when the operation is started, the pressing tool 16 is lowered to press the printed circuit board 1 to hold the holding claws 14.
Fixed to. Further, in each of the air cylinders 27 and 34, the warp prevention plate 26 is moved downward, horizontally moved, and raised by the start of operation, and the both edge portions 1b 1 and 1b of the printed circuit board 1 are placed. The details of the operation of the warp prevention plate 26 will be described later with reference to FIG.

Simultaneously with the time-out of the timer, the connecting chain 53 is driven by the operation of the electromagnetic clutch 64 to cause the traveling chain 24 to travel at the same speed as the transport chain 13, so that the pressing tool 16 presses and warps. The pressing tool 16 and the warp stop plate 26 travel at the same speed while the stop plate 26 holds the printed circuit board 1, and are soldered in the solder bath 61. After that, when the printed circuit board 1 finishes traveling the distance L1, the limit switch (not shown) is turned on by the count up of the counter previously set on the switchboard, and the pressing tool 16 is raised by the air cylinder 17.
At the same time, the engagement with the connecting shaft 53 is released by the operation of the electromagnetic clutch 64, and the traveling chain 24 is brought into a free state. Next, the air cylinder 65 operates to move the pressing tool 16 in the direction opposite to the arrow A direction and return it to the initial position.

Next, the operation of the warp prevention plate 26 will be described with reference to FIGS. 4, 5 and 6. 6 (a) to 6 (e)
FIG. 6 is an explanatory view showing the operation of the warp stop plate 26. As shown in FIG. 6A, the warp prevention plate 26 is initially above the printed circuit board 1 and in the conveyance direction of the printed circuit board 1 (arrow A).
Direction) is set at a position separated by a predetermined dimension 1 before and after both edge portions 1b 1 and 1b 2 in the direction perpendicular to the direction.

Next, as shown in FIG. 5, the printed circuit board 1
When the limit switch (not shown) is turned on at the time when the pressing tool 16 is engaged with, the warping prevention plate 26 is lowered below the level of the printed circuit board 1 by the operation of the air cylinder 27 of FIG. ) Position. Then, by turning on a limit switch (not shown), the air cylinder 3
4 operates, the warp prevention plate 26 is horizontally moved at the same level, and as shown in FIG. 6 (c), the printed circuit board 1 is placed at a position where a very small gap is held before and after both edge portions 1b 1 and 1b 2. To do. Then, the air cylinder 27 is actuated by turning on a limit switch (not shown) to raise the warp stop plate 26 and engage with the lower surface of the printed circuit board 1 as shown in FIG. 6D. In this way, the printed board 1 is transported and soldered in the solder bath 61 while the four sides of the printed board 1 are held by the pressing tool 16 and the warp prevention plate 26.

At the time when the printed circuit board 1 has finished traveling the distance L1 after the soldering is completed, the pressing member 16 rises, and at the same time, the warp prevention plate 26 is horizontally moved by the air cylinder 34 at the same level. As shown in (e), the printed board 1 is detached. Next, a limit switch (not shown) is turned on, and the warp prevention plate 26 is raised by the operation of the air cylinder 27, and returns to the initial position shown in FIG. 6 (a).

The correspondence between the constituent elements of the claims and the embodiments is as follows.

[0020]

[Table 1]

[0021]

Warp prevention apparatus of the printed circuit board on the carrier-less soldering apparatus according to the present invention, the printing
Place both edges at right angles to the substrate transfer direction.
Place the L-shaped warp prevention plates with a rectangular bottom plate to prevent warpage due to heating of the printed circuit board and the positions of both warp prevention plates so that the printed circuit board can be inserted between the bottom plate parts of these warpage prevention plates. and interval setting means for setting in advance, the width direction moving means for setting to move the warp stop plate in the conveying direction and perpendicular direction of the printed circuit board, printed circuit warping stop plate
A warp stop plate vertical movement means for moving the board in a vertical direction substantially at right angles to the plate surface, and a direction parallel to the conveyance direction of the printed circuit board from the position set by the gap setting means.
Bei a horizontal moving means for locking the two warp stop plate to the printed circuit board by moving the plate surface and parallel to the direction of the printed circuit board
E, warp stop plate, spacing setting means, width direction moving means, warp
Stop plate vertical movement means and horizontal movement means are integrated
Assembled to form an assembly,
The assembly is parallel to the PCB transfer direction.
A warp stop plate driving means for carrying the same at a same speed in the carrying direction of the printed substrate through a slidable slider on the provided rod , stopping it, or returning it in the opposite direction to restore it. since consisting of a rectangular bottom plate portion of the printed circuit board warpage <br/> reliably over a long range of the edge portion by the supporting lifting of the warp stop plate can be prevented. Moreover, at the time of use, it is only necessary to set the distance between the warp prevention plates according to the length of the printed circuit board by means of the distance setting means, and the warp prevention plate vertical movement means, horizontal movement means, and warp prevention plate drive means will automatically warp. since the stop plate is placed on the printed circuit board, correspondence against the soldering of printed circuit boards of various sizes also good
Yes .

Further, since the warp prevention plate places the end edge portion of the printed circuit board by the movement by the horizontal movement means and the movement by the vertical movement means, the end edge portion of the printed board is covered over a long range. In addition, it can be supported with a reduced depth, so that the electric components can be arranged in a wide area of the printed circuit board. Conversely speaking, it is slightly on the edge of the printed circuit board.
With a sufficient mounting depth, the printed circuit board can be supported and warped
Can be prevented. Moreover, the warp prevention plate does not collide with the transport chain when the warp prevention plate comes into contact with or separates from the printed circuit board.

Further, the both edges of the printed circuit board are placed.
Each anti-warp plate to support was assembled together
Mounted by being engaged with both edges of the printed circuit board by the mechanism
Accuracy, because it supports, supports, and accompanies the transfer of the printed circuit board.
High stable support is possible. In addition, the warpage prevention plate can be automatically engaged and disengaged while the printed circuit board is being transported. Therefore, it is not necessary to stop the transportation of the printed circuit board, and the soldering process time can be shortened. It has advantages such as reduction of cost.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along line XX of FIG.

3A and 3B are a plan view, a side view, and an enlarged cross-sectional view taken along line YY showing a printed circuit board holding device.

FIG. 4 is a side view showing a warp prevention device for a printed circuit board.

FIG. 5 is an explanatory diagram showing the operation of the printed circuit board holding device.

FIG. 6 is an explanatory diagram showing the operation of the warp prevention plate of the printed circuit board.

FIG. 7 is an explanatory diagram of an operation of a conventional warp prevention plate of a printed circuit board.

[Explanation of symbols]

1 Printed Circuit Board 1b Edge Edge 2 Volume 11 Carrierless Soldering Device 12 Base 13 Transport Chain 14 Holding Claw 16 Pressing Tool 16a Cutout 17 Air Cylinder 18 Rod 20 Fixing Tool 21 Slider 21a Connecting Tool 22 Rod 24 Traveling Chain 26 Warping Stop plate 27 Air cylinder 31 Rod 33 Mounting tool 34 Air cylinder 35 Rod 37 Rod 38 Mounting base 40 Screw rod 41 Handle 42 Sliding contact plate 43 Slider 44 Connecting plate 45 Connecting plate 47 Sliding contact plate 49 Screw rod 51 Handle 53 Connecting shaft 61 Solder bath 62 Light source and phototube 63 Photoelectric and phototube 64 Electromagnetic clutch 65 Air cylinder

Claims (1)

[Claims] 1. A carrierless soldering apparatus for holding a printed circuit board by holding claws of a transfer chain for soldering, wherein both end edges of a direction perpendicular to the transfer direction of the printed circuit board are respectively placed. An L-shaped warp prevention plate having a rectangular bottom plate portion for preventing warpage due to heating of the board, and positions of the both warp prevention plates in advance so that the printed circuit board is inserted between the bottom plate portions of these warp prevention plates. Interval setting means for setting, width direction moving means for moving and setting the warp prevention plate in a direction perpendicular to the conveyance direction of the printed circuit board, and the warpage prevention plate for the print substrate.
A warp stop plate vertical movement means for moving the board in a vertical direction substantially at right angles to the plate surface, and a direction parallel to the conveyance direction of the printed circuit board from a position set by the spacing setting means.
And a horizontal movement means such direction to move the plate surface and parallel to the direction of the printed circuit board engaging the said two warp stop plate on the printed board, the warp stop plate, spacing the hand
Step, width direction moving means, warp prevention plate vertical direction moving means and
And horizontal movement means are assembled together to form an assembly
And the assembly forms the printed substrate.
Slide on a rod that is parallel to the plate transport direction.
Carrierless soldering, characterized in that it comprises warp stop plate driving means for carrying at the same speed in the carrying direction of the printed circuit board through a movable slider , stopping it, or returning it in the opposite direction to restore. Device for preventing warpage of printed circuit boards.