JPH0536270Y2 - - Google Patents

Info

Publication number
JPH0536270Y2
JPH0536270Y2 JP1989008387U JP838789U JPH0536270Y2 JP H0536270 Y2 JPH0536270 Y2 JP H0536270Y2 JP 1989008387 U JP1989008387 U JP 1989008387U JP 838789 U JP838789 U JP 838789U JP H0536270 Y2 JPH0536270 Y2 JP H0536270Y2
Authority
JP
Japan
Prior art keywords
capillary
tip
transducer
square hole
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989008387U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02101540U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989008387U priority Critical patent/JPH0536270Y2/ja
Publication of JPH02101540U publication Critical patent/JPH02101540U/ja
Application granted granted Critical
Publication of JPH0536270Y2 publication Critical patent/JPH0536270Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1989008387U 1989-01-30 1989-01-30 Expired - Lifetime JPH0536270Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989008387U JPH0536270Y2 (enExample) 1989-01-30 1989-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989008387U JPH0536270Y2 (enExample) 1989-01-30 1989-01-30

Publications (2)

Publication Number Publication Date
JPH02101540U JPH02101540U (enExample) 1990-08-13
JPH0536270Y2 true JPH0536270Y2 (enExample) 1993-09-14

Family

ID=31214221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989008387U Expired - Lifetime JPH0536270Y2 (enExample) 1989-01-30 1989-01-30

Country Status (1)

Country Link
JP (1) JPH0536270Y2 (enExample)

Also Published As

Publication number Publication date
JPH02101540U (enExample) 1990-08-13

Similar Documents

Publication Publication Date Title
US5611478A (en) Lead frame clamp for ultrasonic bonding
EP0297244A3 (en) Single lead automatic clamping and bonding system
EP0289102B1 (en) Method and means for bonding of lead wires for an integrated circuit device
JPH0536270Y2 (enExample)
CN109084916A (zh) 一种多维力传感器中应变片的固定装置、方法及传感器
JP2574378B2 (ja) 力覚センサの信号伝達体
JPS6313337A (ja) 半導体素子の実装方法
JPH088825Y2 (ja) サーマルヘッド
JP2602278B2 (ja) 樹脂封止型半導体装置
JPH0244520Y2 (enExample)
JPH0296342A (ja) ワイヤボンド装置
JPH0635382Y2 (ja) 混成集積回路のリード端子取付構造
JP3337574B2 (ja) ワイヤボンディング装置における放電用トーチ電極体の位置決め方法
JPS62213500A (ja) 圧電ブザ−
JPS6348126Y2 (enExample)
JPH087639Y2 (ja) 半導体モジュール
JPH03195065A (ja) 固体撮像装置
JPH06140457A (ja) ワイヤボンディング装置のキャピラリー固定方法
JPS6293976A (ja) 樹脂封止固体イメ−ジ・センサ−
JPH02153558A (ja) 半導体装置
JPH02168660A (ja) 樹脂封止型半導体装置の製造方法
JPS62122241A (ja) 半導体装置
JPS61182036U (enExample)
JP2000249612A (ja) 半導体圧力センサ
JPH0377461U (enExample)