JPH0536270Y2 - - Google Patents
Info
- Publication number
- JPH0536270Y2 JPH0536270Y2 JP1989008387U JP838789U JPH0536270Y2 JP H0536270 Y2 JPH0536270 Y2 JP H0536270Y2 JP 1989008387 U JP1989008387 U JP 1989008387U JP 838789 U JP838789 U JP 838789U JP H0536270 Y2 JPH0536270 Y2 JP H0536270Y2
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- tip
- transducer
- square hole
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案はワイヤボンデイング装置、特に、その
キヤピラリのトランスデユーサへの取付け構造に
関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a wire bonding device, and particularly to a structure for attaching a capillary to a transducer.
第２図はワイヤボンデイング装置の一例の主要
部分の構造の概要を示す。
FIG. 2 shows an outline of the structure of the main parts of an example of a wire bonding device.
図において１はXYモータ、２はXYテーブル、
３はＺモータ、４はカム、５はリンクおよびアー
ム、６は金線、７はITVカメラ、８は光学系、
９は上クランパ、１０は下クランパ、１１はトラ
ンスデユーサ、１２はキヤピラリ、１３はリード
フレーム搬送、位置決め部である。 In the figure, 1 is the XY motor, 2 is the XY table,
3 is the Z motor, 4 is the cam, 5 is the link and arm, 6 is the gold wire, 7 is the ITV camera, 8 is the optical system,
9 is an upper clamper, 10 is a lower clamper, 11 is a transducer, 12 is a capillary, and 13 is a lead frame conveyance and positioning section.
トランスデユーサ１１の先端部に取付けられた
キヤピラリ１２の先端の穴から金線６を導出し、
金線６の先端を電気トーチか酸水素トーチ（図示
してない）で溶融して、ボールを形成する。 Lead out the gold wire 6 from the hole at the tip of the capillary 12 attached to the tip of the transducer 11,
The tip of the gold wire 6 is melted with an electric torch or an oxyhydrogen torch (not shown) to form a ball.
キヤピラリ１２先端を位置決めされたリードフ
レームのダイアイランド面に接着されたペレツト
のボンデイングバツト上に高精度に精度位置合わ
せして、キヤピラリ１２の先端でボールをボンデ
イングバツトに超音波振動を加えながら押えて、
熱圧着する。 The tip of the capillary 12 is precisely positioned on the bonding butt of the pellet bonded to the die island surface of the positioned lead frame, and the tip of the capillary 12 presses the ball while applying ultrasonic vibration to the bonding butt. ,
Heat and press.
超音波振動を与えながら行なうのは、ペレツト
の熱負担がかからないように、低温で圧着するた
めである。 The purpose of applying ultrasonic vibration is to compress the pellets at a low temperature so as not to place any heat burden on the pellets.
第３図ａ，ｂは従来のワイヤボンデイング装置
のトランスデユーサの構造及びキヤピラリ取付け
構造の一例を示す。 FIGS. 3a and 3b show an example of a transducer structure and a capillary mounting structure of a conventional wire bonding apparatus.
図において１１，１２は第２図の同一符号と同
一または相当するものを示す、１１１は電源端
子、１１２は超音波ホーン、１１３はキヤピラリ
取付け用すり割り入り丸穴、１１４はすり割り締
めつけ用ねじである。 In the figure, 11 and 12 are the same as or equivalent to the same reference numerals in Figure 2, 111 is a power terminal, 112 is an ultrasonic horn, 113 is a slotted round hole for attaching a capillary, and 114 is a slotted screw for tightening. It is.
電源端子１１１は超音波電源に接続され、超音
波が超音波ホーン１１２を経て先端部に取付けら
れたキヤピラリ１２に伝わる。 The power terminal 111 is connected to an ultrasonic power source, and ultrasonic waves are transmitted through an ultrasonic horn 112 to a capillary 12 attached to the tip.
第４図はトランスデユーサ１１のキヤピラリ１
３取付け部分の拡大図で、第３図と同一符号は同
一のものを示す。 Figure 4 shows capillary 1 of transducer 11.
3 is an enlarged view of the attachment part, and the same reference numerals as in FIG. 3 indicate the same parts.
キヤピラリ１２はトランスデユーサ１１の先端
部のすり割り入り丸穴１１３に挿入され、すり割
りがねじ１１４で締めつけられ、キヤピラリ１２
の外周面に丸穴１１３の内周面が全周接触する状
態に取付けられる。 The capillary 12 is inserted into a round hole 113 with a slot at the tip of the transducer 11, and the slot is tightened with a screw 114.
The inner circumferential surface of the round hole 113 is in contact with the outer circumferential surface of the round hole 113 over the entire circumference.
上記のような従来のキヤピラリの取付け構造
は、一般的で、確実であると考えられているが、
ねじ締め付け過不足の場合や、長時間の使用によ
る、超音波振動に影響されて先端部が徐々に開い
てきた場合、平面上全周支持の状態になつている
はずが、実は２点支持の状態になることが多く、
キヤピラリにがたつきが生じ、ボンド位置ずれが
生ずるという問題点があつた。
The conventional capillary mounting structure as described above is considered to be common and reliable; however,
If the screw is over-tightened or under-tightened, or if the tip gradually opens due to the influence of ultrasonic vibration after long-term use, it should be supported all around on a plane, but in reality it is supported at two points. The condition is often
There was a problem in that the capillary rattled and the bond position shifted.
本考案は上記の問題を解決するためになされた
もので、キヤピラリにがたつきが生じにくい取付
け構造を提供することを目的とする。 The present invention was made in order to solve the above problem, and its purpose is to provide a mounting structure in which the capillary is less likely to rattle.
本考案は、上記目的を達成するために、キヤピ
ラリの取付け穴を角穴にし、円筒形状のキヤピラ
リをトランスデユーサの先端部のすり割り入り角
穴に挿入し、すり割りをねじで締め付け、キヤピ
ラリをその外周面に上記角穴の内周面が線接触
（平面上では点支持）で圧接する状態に取付ける
構造としたものである。
In order to achieve the above object, the present invention makes the capillary installation hole a square hole, inserts a cylindrical capillary into the slotted square hole at the tip of the transducer, and tightens the slot with a screw. The structure is such that the inner circumferential surface of the square hole is in pressure contact with the outer circumferential surface of the rectangular hole in line contact (point support on a plane).
第１図ａ，ｂは本考案のワイヤボンデイング装
置のキヤピラリ取付け構造を示す。
Figures 1a and 1b show the capillary mounting structure of the wire bonding device of the present invention.
図において１１，１２，１１４は第３図、第４
図の同一符号と同一または相当するものを示し、
１１３ａはすり割り入り角穴である。 In the figure, 11, 12, 114 are in Figure 3 and 4.
Indicates the same or equivalent to the same reference numeral in the figure,
113a is a slotted square hole.
円筒形状のキヤピラリ１２が角穴１１３ａに挿
入され、ねじ１１４ですり割りが締め付けられる
と、キヤピラリ１２の外周面に角穴１１３ａの４
つの内周平面がそれぞれ線接触で圧接しキヤピラ
リ１２が支持される。平面上では図ａに示すよう
に４点支持構造となる。 When the cylindrical capillary 12 is inserted into the square hole 113a and the slot is tightened with the screw 114, the four holes of the square hole 113a are formed on the outer peripheral surface of the capillary 12.
The capillary 12 is supported by the two inner circumferential planes being pressed into line contact with each other. On a plane, it has a four-point support structure as shown in Figure a.
そして、ねじ締め付け過不良の場合でも、長時
間使用により超音波振動の影響があらわれてきて
先端部が徐々に開いた場合でも、この４点支持構
造が保たれ、キヤピラリ１２にがたつきが生じに
くい。 Even if the screws are over-tightened or if the tip gradually opens due to the effects of ultrasonic vibration after long-term use, this four-point support structure is maintained and the capillary 12 will not wobble. Hateful.
上記には角にＲをつけた角穴１１３ａを示した
が、Ｒをつけなくてもよい。 Although the square hole 113a with rounded corners is shown above, it is not necessary to have rounded corners.
また、平面上で４点支持構造になる例を示した
が、４点以上の多点支持構造になる角穴としても
よい。 Further, although an example has been shown in which a four-point support structure is provided on a plane, a square hole may be used to provide a multi-point support structure with four or more points.
以上説明したように、本考案によれば、キヤピ
ラリの径にばらつきがある場合も、すり割りの締
め付けが過不足の場合も、長時間使用の場合も、
キヤピラリにがたつきが生じにくく、ボンド位置
の精度が保たれ、歩留り、信頼性向上に寄与する
効果大である。
As explained above, according to the present invention, even if there are variations in the diameter of the capillary, if the slot is not tightened too much, or if it is used for a long time,
The capillary is less prone to rattling, the accuracy of bond position is maintained, and this is highly effective in contributing to improved yield and reliability.
第１図ａ，ｂは本考案のワイヤボンデイング装
置のキヤピラリ取付け構造を示す平面図、側面
図、第２図はワイヤボンデイング装置の一例の主
要部分の構造の概要を示す説明図、第３図ａ，ｂ
は従来のワイヤボンデイング装置のトランスデユ
ーサの構造及びキヤピラリの取付け構造の一例を
示す側面図、平面図、第４図は第３図ｂのトラン
スデユーサのキヤピラリ取付け部分の拡大図であ
る。
１１……トランスデユーサ、１２……キヤピラ
リ、１１３ａ……角穴、１１４……ねじ、なお図
中同一符号は同一または相当するものを示す。
Figures 1a and b are a plan view and side view showing the capillary mounting structure of the wire bonding device of the present invention, Figure 2 is an explanatory diagram showing an outline of the structure of the main parts of an example of the wire bonding device, and Figure 3a ,b
4 is a side view and a plan view showing an example of a transducer structure and a capillary mounting structure of a conventional wire bonding apparatus, and FIG. 4 is an enlarged view of the capillary mounting portion of the transducer shown in FIG. 3b. DESCRIPTION OF SYMBOLS 11...Transducer, 12...Capillary, 113a...Square hole, 114...Screw, and the same reference numerals in the drawings indicate the same or equivalent parts.
Claims (1)
形状のキヤピラリの先端の穴から金線を導出し、
該金線の先端をトーチで溶融してボールを形成
し、該ボールを上記キヤピラリが超音波振動を加
えながら熱圧着して金線をボンドする構造のワイ
ヤボンデイング装置において、 上記円筒形状のキヤピラリが上記トランスデユ
ーサの先端部のすり割り入り角穴に挿入され、上
記すり割りがねじで締めつけられ、上記キヤピラ
リがその外周面に上記角穴の内周面が線接触で圧
接する状態に取付けられていることを特徴とする
ワイヤボンデイング装置。[Claim for Utility Model Registration] A gold wire is led out from a hole at the tip of a cylindrical capillary attached to the tip of a transducer,
A wire bonding apparatus has a structure in which a tip of the gold wire is melted with a torch to form a ball, and the ball is thermocompressed and bonded to the gold wire while the capillary applies ultrasonic vibration, wherein the cylindrical capillary is The capillary is inserted into the slotted square hole at the tip of the transducer, the slot is tightened with a screw, and the capillary is installed so that the inner peripheral surface of the square hole is in line contact with the outer peripheral surface of the capillary. A wire bonding device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989008387U JPH0536270Y2 (en) | 1989-01-30 | 1989-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989008387U JPH0536270Y2 (en) | 1989-01-30 | 1989-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02101540U JPH02101540U (en) | 1990-08-13 |
| JPH0536270Y2 true JPH0536270Y2 (en) | 1993-09-14 |
Family
ID=31214221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989008387U Expired - Lifetime JPH0536270Y2 (en) | 1989-01-30 | 1989-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536270Y2 (en) |
-
1989
- 1989-01-30 JP JP1989008387U patent/JPH0536270Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02101540U (en) | 1990-08-13 |
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