JPH0535715B2 - - Google Patents

Info

Publication number
JPH0535715B2
JPH0535715B2 JP62149756A JP14975687A JPH0535715B2 JP H0535715 B2 JPH0535715 B2 JP H0535715B2 JP 62149756 A JP62149756 A JP 62149756A JP 14975687 A JP14975687 A JP 14975687A JP H0535715 B2 JPH0535715 B2 JP H0535715B2
Authority
JP
Japan
Prior art keywords
single crystal
crucible
pulling
heat
melt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62149756A
Other languages
Japanese (ja)
Other versions
JPS63315589A (en
Inventor
Kaoru Kuramochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KYUSHU DENSHI KINZOKU KK
OOSAKA CHITANIUMU SEIZO KK
Original Assignee
KYUSHU DENSHI KINZOKU KK
OOSAKA CHITANIUMU SEIZO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KYUSHU DENSHI KINZOKU KK, OOSAKA CHITANIUMU SEIZO KK filed Critical KYUSHU DENSHI KINZOKU KK
Priority to JP14975687A priority Critical patent/JPS63315589A/en
Publication of JPS63315589A publication Critical patent/JPS63315589A/en
Publication of JPH0535715B2 publication Critical patent/JPH0535715B2/ja
Granted legal-status Critical Current

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  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はチヨクラルスキー法による単結晶成長
装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a single crystal growth apparatus using the Czyochralski method.

〔従来技術〕[Prior art]

第4図は一般的なチヨクラルスキー法(CZ法)
による単結晶製造装置の要部の模式的断熱面図で
ある。チヤンバ10内にはその中央部に坩堝1を
配設し、この坩堝1の外側に黒鉛製のヒータ2
を、更にその外側に保温壁3を同心状に配設して
ある。坩堝1はグラフアイト製の容器1aの内側
に石英製の容器1bを配した二重構造に構成さ
れ、その下底部中央にはこれを回転、並びに昇降
移動させる軸1cが連結されている。また坩堝1
の上方には下端に種結晶6を固定した引上軸7が
垂直に配設されている。
Figure 4 shows the general Czyochralski method (CZ method)
FIG. 2 is a schematic adiabatic cross-sectional view of a main part of a single crystal manufacturing apparatus according to the present invention. A crucible 1 is disposed in the center of the chamber 10, and a heater 2 made of graphite is placed outside the crucible 1.
Further, a heat insulating wall 3 is disposed concentrically on the outside thereof. The crucible 1 has a double structure in which a quartz container 1b is arranged inside a graphite container 1a, and a shaft 1c for rotating and moving the crucible up and down is connected to the center of its lower bottom. Crucible 1 again
A pulling shaft 7 having a seed crystal 6 fixed to its lower end is vertically disposed above the pull-up shaft 7.

而して、このような単結晶製造装置にあつては
坩堝1内に投入した原料をヒータ2により加熱溶
融せしめ、その融液に種結晶6を浸した後、引上
軸7にて回転しつつ上昇させ、種結晶6の下端に
単結晶8を成長せしめるようになつている。
In such a single crystal manufacturing apparatus, the raw material put into the crucible 1 is heated and melted by the heater 2, and after the seed crystal 6 is immersed in the melt, it is rotated by the pulling shaft 7. The single crystal 8 is grown at the lower end of the seed crystal 6.

一般に単結晶の引上げを行う場合、その引上げ
速度は、引上げ方向における単結晶の温度勾配と
密接な関係にあり、効率的な単結晶の引上げを行
うには単結晶に所定以上の温度勾配を設定する必
要がある。
Generally, when pulling a single crystal, the pulling speed is closely related to the temperature gradient of the single crystal in the pulling direction, and in order to pull the single crystal efficiently, set a temperature gradient above a certain level in the single crystal. There is a need to.

ところで上記した如き装置では単結晶8の周囲
には坩堝1、ヒータ2及び反射率が0.7と極めて
高い融液等の輻射熱源があつてこれらから受ける
輻射熱量が極めて多く、必然的に単結晶8の引上
方向における温度勾配が小さくなり、単結晶の引
上げ効率が低いという欠点があつた。
By the way, in the above-mentioned apparatus, around the single crystal 8 there is a radiant heat source such as the crucible 1, the heater 2, and a melt with an extremely high reflectance of 0.7, and the amount of radiant heat received from these is extremely large. The drawback was that the temperature gradient in the pulling direction was small, and the single crystal pulling efficiency was low.

この対策として従来にあつては、第5図に示す
如く坩堝1の上方であつて単結晶8の引上げ域の
周囲に、扁平な環状リム11aとその内側端縁か
ら坩堝1内の融液上であつて、単結晶8の引上域
の周囲に下方に向かうに従い縮径されて円錐台形
をなすテーパ部11cとからなる輻射スクリーン
11を配設する構成が提案されている(特公昭57
−40119号)。
As a countermeasure against this problem, conventionally, as shown in FIG. A configuration has been proposed in which a radiation screen 11 consisting of a tapered part 11c having a truncated conical shape and whose diameter decreases as it goes downward is disposed around the pulling area of the single crystal 8 (Japanese Patent Publication No. 57
−40119).

この輻射スクリーン11によつて坩堝1、ヒー
タ2及び融液等からの輻射熱を遮断し、単結晶8
の引上方向における温度勾配を大きくし、また同
時にチヤンバ10の上方から坩堝1に向けて給送
されるAr等のキヤリアガスを坩堝1内に誘導し、
坩堝1から生成されるSiOガス等を坩堝1の周縁
部側に導き、坩堝1の下方からチヤンバ10の外
部に排出するようにしてある。
This radiant screen 11 blocks radiant heat from the crucible 1, heater 2, melt, etc., and
The temperature gradient in the pulling direction is increased, and at the same time, a carrier gas such as Ar, which is fed from above the chamber 10 toward the crucible 1, is guided into the crucible 1,
SiO gas and the like generated from the crucible 1 are guided to the periphery side of the crucible 1 and discharged from below the crucible 1 to the outside of the chamber 10.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した如き従来の装置にあつてはSiO等の排
ガスを効果的に排出出来、また輻射スクリーン1
1によつて坩堝1、ヒータ2、融液等と単結晶8
との間で熱遮蔽されて、これらからの1次輻射熱
は遮断される反面、融液表面から単結晶に向けて
放射される反射熱や輻射スクリーン11自体が高
温に加熱された結果、二次輻射熱が単結晶8に向
けて放射され、単結晶8自体に対する冷却効果が
不足して、デバイスプロセス後に結晶欠陥が生じ
易いとされている550℃〜850℃の温度域を経るの
に要する時間が長くなり、結晶品質の低下が避け
られない。
In the case of the conventional device as described above, exhaust gases such as SiO can be effectively discharged, and the radiation screen 1
1, crucible 1, heater 2, melt etc. and single crystal 8
Although the primary radiant heat from these is blocked, the reflected heat radiated from the melt surface toward the single crystal and the radiant screen 11 itself heated to a high temperature result in secondary radiant heat being blocked. Radiant heat is emitted toward the single crystal 8, and the cooling effect on the single crystal 8 itself is insufficient, resulting in the time required for the temperature to pass through the temperature range of 550°C to 850°C, where crystal defects are likely to occur after device processing. As the crystal length increases, a decrease in crystal quality is inevitable.

また輻射スクリーン11自体は金属で形成され
るが、融液から発生するSiOガス、或いは高温の
ために溶融劣化されて寿命が短く、溶融劣化物が
坩堝1内の融液中に落下して融液を汚染し、また
落下による衝撃自体によつて多結晶化を誘引する
等の問題があつた。
Furthermore, although the radiation screen 11 itself is made of metal, it has a short lifespan due to melting and deterioration due to SiO gas generated from the melt or high temperatures, and the molten and deteriorated products fall into the melt in the crucible 1 and melt. There were problems such as contaminating the liquid and inducing polycrystallization due to the impact itself caused by dropping.

本発明はかかる事情に鑑みなされたものであつ
て、その目的とするところは排ガスの排出機能を
損なうことなくヒータ、坩堝及び融液等からの輻
射熱を効果的に遮断し、単結晶にその引上方向に
適当な温度勾配を形成し、単結晶の引上げ速度を
高め得、製造効率の向上を図れるようにした単結
晶製造装置を提供するにある。
The present invention has been made in view of the above circumstances, and its purpose is to effectively block radiant heat from heaters, crucibles, melts, etc. without impairing the exhaust gas discharge function, and to effectively block radiant heat from the single crystal. It is an object of the present invention to provide a single crystal manufacturing apparatus that can form an appropriate temperature gradient in the upward direction, increase the pulling rate of the single crystal, and improve manufacturing efficiency.

〔問題点を解決するための手段〕 本発明装置にあつては、製造すべき単結晶の原
料を加熱溶融する坩堝と、該坩堝内の融液から単
結晶を引上げる手段と、前記坩堝内の融液の上方
にあつて、単結晶の引上げ域の周囲に配設された
熱遮蔽部材とを備えた単結晶製造装置において、
前記熱遮蔽部材は環状リム部と、該環状リム部の
内側端から融液面上であつて単結晶の引上げ域の
周囲に垂下され、単結晶の引上げ域と対向する内
面側は上端側から下端側に向かうに従つて縮径さ
れた逆円錐台形環状に形成され、該内面側と外面
側の内部に融液面に近づくに従つて、一部又は全
体に亘つて厚さを大きくした断熱材を有する熱遮
蔽体とを具備する。
[Means for Solving the Problems] The apparatus of the present invention includes a crucible for heating and melting a raw material for a single crystal to be produced, a means for pulling the single crystal from the melt in the crucible, and a In a single crystal production apparatus, the apparatus includes a heat shielding member disposed above the melt and around the single crystal pulling area,
The heat shielding member has an annular rim portion, and is suspended from the inner end of the annular rim portion over the melt surface and around the pulling region of the single crystal, and the inner surface facing the pulling region of the single crystal is suspended from the upper end side. A heat insulator formed in an inverted truncated conical ring shape whose diameter decreases toward the lower end, and whose thickness increases partially or entirely as it approaches the melt surface inside the inner and outer surfaces. and a heat shield having a material.

〔作 用〕[Effect]

これによつて輻射熱を遮断し、単結晶の引上方
向における温度勾配を高め得て結晶引上げ速度を
高く、またデバイスプロセス後の結晶欠陥発生頻
度の大きい温度域を短時間で通過させ得る。
This blocks radiant heat, increases the temperature gradient in the pulling direction of the single crystal, increases the crystal pulling rate, and allows the crystal to pass through the temperature range where crystal defects occur frequently after device processing in a short time.

〔実施例〕〔Example〕

以下本発明をその実施例を示す図面に基づき具
体的に説明する。第1図は本発明に係る単結晶製
造装置(以下本発明装置という)の模式的縦断面
図、第2図は熱遮蔽部材の部分拡大断面図であ
り、図中1は坩堝、2はヒータ、3は保温壁、4
は熱遮蔽部材、6は種結晶、8は単結晶、10は
チヤンバを示している。チヤンバ10内にはその
中心部に坩堝1が配設され、その外側にヒータ2
が、更にその外側に保温壁3が同心状に配設さ
れ、そして前記保温壁3の上方から坩堝1内の融
液面の周縁部にわたつてヒータ2、保温壁3、坩
堝1を覆う態様で熱遮蔽部材4が配設されてい
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on drawings showing embodiments thereof. FIG. 1 is a schematic vertical cross-sectional view of a single crystal manufacturing apparatus according to the present invention (hereinafter referred to as the present invention apparatus), and FIG. 2 is a partially enlarged cross-sectional view of a heat shielding member, in which 1 is a crucible and 2 is a heater. , 3 is a heat insulation wall, 4
1 is a heat shielding member, 6 is a seed crystal, 8 is a single crystal, and 10 is a chamber. A crucible 1 is disposed in the center of the chamber 10, and a heater 2 is placed outside of the crucible 1.
However, a heat insulating wall 3 is further disposed concentrically on the outside thereof, and covers the heater 2, the heat insulating wall 3, and the crucible 1 from above the heat insulating wall 3 to the peripheral edge of the melt surface in the crucible 1. A heat shielding member 4 is provided.

坩堝1は黒鉛製の容器1aの内側に石英製の容
器1bを配設した二重構造に構成されており、そ
の下底部中央には坩堝1を回転、並びに昇降させ
る軸1cが連結されている。
The crucible 1 has a double structure in which a quartz container 1b is arranged inside a graphite container 1a, and a shaft 1c for rotating and raising and lowering the crucible 1 is connected to the center of the bottom of the crucible 1. .

また坩堝1の上方には種結晶6及びこれに単結
晶8を成長させつつ引上げる引上軸7が配設され
ている。熱遮蔽部材4は厚肉の環状リム部41の
外周縁寄りの下面に支持筒部42を設け、また内
周縁には断面直角三角形状をなす環状の熱遮蔽体
43を設けて構成されており、支持筒部42を保
温壁3上に配した支持板3a上面に当接せしめる
ことにより熱遮蔽体43を坩堝1内の融液面上に
吊り下げた状態で臨ませてある。
Further, above the crucible 1, there is disposed a seed crystal 6 and a pulling shaft 7 for growing a single crystal 8 thereon and pulling it up. The heat shielding member 4 includes a support tube 42 provided on the lower surface of a thick annular rim portion 41 near the outer periphery, and an annular heat shield 43 having a right triangular cross section on the inner periphery. By bringing the support tube 42 into contact with the upper surface of the support plate 3a disposed on the heat retaining wall 3, the heat shield 43 is suspended above the surface of the melt in the crucible 1.

熱遮蔽体43は断面L形をなす環状の外側環部
43aと逆円錐台形をなす内側環部43bとを
内、外に重ね合わせて相互の間に断面直角三角形
状をなす環状の空間43cを形成し、この空間4
3c内に断熱材43bを密に詰めて構成してあ
り、前記外側環部43a,内側環部43b夫々の
上端部外側に張り出したフランジ部43e,43
fを前記環状リム部41の内側上面に形成した座
部41aに係合せしめることにより環状リム部4
1に懸架せしめてある。
The heat shield 43 has an annular outer annular portion 43a having an L-shaped cross section and an inner annular portion 43b having an inverted truncated cone shape, which are overlapped inwardly and outwardly to form an annular space 43c having a right triangular cross section. Form this space 4
The outer ring part 43a and the inner ring part 43b have flange parts 43e and 43 that protrude outward at their upper ends, respectively.
By engaging the seat part 41a formed on the inner upper surface of the annular rim part 41, the annular rim part 4
It is suspended from 1.

この状態では熱遮蔽体43における外側環部4
3aの円筒部分は垂直に坩堝1の周壁内側に沿つ
て融液面直上にまで垂下され、熱遮蔽体43内に
は融液面に近づくに従つて厚さを大きくした断熱
材43dを位置させて融液面に近づくに従つて断
熱機能を大きくし、また水平環縁部は融液面と略
平行にその周縁部近傍から単結晶引上域の近傍に
わたつて位置している。
In this state, the outer ring portion 4 of the heat shield 43
The cylindrical part 3a is vertically suspended along the inner side of the peripheral wall of the crucible 1 to just above the melt surface, and a heat insulating material 43d whose thickness increases as it approaches the melt surface is placed inside the heat shield 43. As it approaches the melt surface, the heat insulating function increases, and the horizontal ring edge is located approximately parallel to the melt surface, extending from the vicinity of the peripheral edge to the vicinity of the single crystal pulling region.

外側環部43a、内側環部43bはいずれも高
密度の黒鉛製であり、また断熱材43dとしては
耐熱性に優れ、しかも熱伝導率の低い材料、例え
ば黒鉛フエルト、石英フエルト等が用いられる。
ちなみに黒鉛フエルトは熱伝導率が0.2kcal/
m・hr・℃であり、熱伝導率が100kcal/m・
hr・℃の黒鉛の500倍以上の断熱性を備えている。
Both the outer ring part 43a and the inner ring part 43b are made of high-density graphite, and the heat insulating material 43d is made of a material with excellent heat resistance and low thermal conductivity, such as graphite felt or quartz felt.
By the way, graphite felt has a thermal conductivity of 0.2kcal/
m・hr・℃, and the thermal conductivity is 100kcal/m・
It has more than 500 times the insulation properties of graphite at hr/℃.

なお、引上げ装置によつては、単結晶温度が
550℃〜850℃の温度領域が発生する箇所が異なる
ので、適宜その引上げ装置に応じて断熱材43d
の厚みを調節するか、内側環部43bと外側環部
43aとの内部に断熱材43dを介在させる位置
を変更することにより、引上げ装置に応じて適正
な温度勾配を付与することが可能である。
In addition, depending on the pulling equipment, the single crystal temperature may vary.
Since the temperature range of 550°C to 850°C is generated at different locations, the insulation material 43d may be used as appropriate depending on the pulling device.
It is possible to provide an appropriate temperature gradient depending on the pulling device by adjusting the thickness of the heat insulating material 43d or by changing the position of the heat insulating material 43d inside the inner ring part 43b and the outer ring part 43a. .

第3図は本発明装置と従来装置との単結晶に対
する断熱性についての比較試験結果を示すグラフ
であり、横軸に単結晶温度(℃)を、また縦軸に
融液面からの距離(mm)をとつて示してある。グ
ラフ中白丸でプロツトしたのは本発明装置の、ま
た黒丸でプロツトしたのは第5図に示す従来装置
の各結果である。
Figure 3 is a graph showing the results of a comparative test of the thermal insulation properties of a single crystal between the device of the present invention and a conventional device, with the horizontal axis representing the single crystal temperature (°C), and the vertical axis representing the distance from the melt surface ( mm). The results plotted with white circles in the graph are those of the apparatus of the present invention, and the results plotted with black circles are those of the conventional apparatus shown in FIG.

このグラフから明らかな如く、単結晶の温度は
従来装置に依つた場合に比較して本発明装置に依
つた場合は大幅に低減し得ていることが解る。ま
たこの試験において従来装置における単結晶引上
速度は1.6mm/分であつたのが本発明装置に依つ
た場合は2.0mm/分に上昇し得ることが確認され
た。
As is clear from this graph, the temperature of the single crystal can be significantly reduced using the apparatus of the present invention compared to when using the conventional apparatus. Further, in this test, it was confirmed that the single crystal pulling speed in the conventional apparatus was 1.6 mm/min, but it could be increased to 2.0 mm/min in the case of the apparatus of the present invention.

更に結晶欠陥の生じ易い温度領域とされている
単結晶温度が550〜850℃の領域は従来装置では
300mm程度あつたが、本発明装置では250mmに短縮
し得た。これによつて単結晶が550℃〜850℃の範
囲に留まる時間は従来装置では188分であつたが、
本発明装置では125分に短縮し得た。この結果、
単結晶をデバイスプロセスに通しても内部微小欠
陥の密度は酸素濃度が15×1017atm/c.c.のレベル
で106個/cm2から104個/cm2以下に低減し得、しか
も同時にウエーハー表面の積層欠陥密度の低減も
可能となつた。
Furthermore, conventional equipment cannot handle the single crystal temperature range of 550 to 850°C, which is considered to be a temperature range where crystal defects are likely to occur.
The length was about 300 mm, but with the device of the present invention, it was possible to shorten it to 250 mm. As a result, the time the single crystal remained in the range of 550°C to 850°C was 188 minutes with conventional equipment, but
With the device of the present invention, the time could be shortened to 125 minutes. As a result,
Even if a single crystal is subjected to a device process, the density of internal microdefects can be reduced from 10 6 defects/cm 2 to less than 10 4 defects/cm 2 at an oxygen concentration of 15×10 17 atm/cc, and at the same time It has also become possible to reduce the stacking fault density on the surface.

〔効 果〕〔effect〕

以上の如く本発明装置にあつては輻射熱源であ
る坩堝、ヒータ、保温壁と引上げられる単結晶と
の間に配設される熱遮蔽部材は単結晶と対向する
前面板は上端側から下端側に向かうに従つて内径
が縮小される逆円錐台形に形成され、前面板と外
面板の間には融液面に近づくに従つて、一部又は
全体に亘つて厚さを大きくした断熱材を介在させ
たから、融液面に近づくに従つて断熱効果が高め
られ、引上げ途中の単結晶の温度勾配を積極的に
変えることで、欠陥結晶を生じ易い温度領域を通
過する時間を短くし得、まデバイスプロセス後の
結晶欠陥密度を低減し得て、大幅な品質の向上を
図れるなど本発明は優れた効果を奏するものであ
る。
As described above, in the apparatus of the present invention, the heat shielding member disposed between the crucible, heater, and heat insulating wall that are radiant heat sources and the single crystal to be pulled is arranged so that the front plate facing the single crystal is arranged from the upper end side to the lower end side. It is formed in the shape of an inverted truncated cone, with the inner diameter decreasing as it approaches the melt surface, and a heat insulating material that partially or entirely becomes thicker as it approaches the melt surface is interposed between the front plate and the outer plate. Therefore, the insulation effect increases as it approaches the melt surface, and by actively changing the temperature gradient of the single crystal during pulling, it is possible to shorten the time it takes for the device to pass through the temperature range where defective crystals are likely to occur. The present invention has excellent effects such as being able to reduce the crystal defect density after processing and significantly improving quality.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明装置の模式的縦断面図、第2図
は熱遮蔽部材の部分拡大断面図、第3図は本発明
装置と従来装置との比較試験結果を示すグラフ、
第4,5図は従来装置の模式的縦断面図である。 1…坩堝、2…ヒータ、3…保温壁、4…熱遮
蔽部材、6…種結晶、8…単結晶、41…環状リ
ム部、42…支持筒部、43…熱遮蔽体。
FIG. 1 is a schematic vertical sectional view of the device of the present invention, FIG. 2 is a partially enlarged sectional view of the heat shielding member, and FIG. 3 is a graph showing the results of a comparative test between the device of the present invention and a conventional device.
4 and 5 are schematic vertical cross-sectional views of the conventional device. DESCRIPTION OF SYMBOLS 1... Crucible, 2... Heater, 3... Heat insulation wall, 4... Heat shielding member, 6... Seed crystal, 8... Single crystal, 41... Annular rim part, 42... Support cylinder part, 43... Heat shielding body.

Claims (1)

【特許請求の範囲】 1 製造すべき単結晶の原料を加熱溶融する坩堝
と、該坩堝内の融液から単結晶を引上げる手段
と、前記坩堝内の融液の上方であつて、単結晶の
引上げ域の周囲に配設された熱遮蔽部材が、環状
リム部と、該環状リム部の内側縁から単結晶の引
上げ域の周囲に垂下された熱遮蔽体からなる単結
晶製造装置において、 該熱遮蔽体は、単結晶の引上げ域と対向する内
面側は上端側から下端側に向かうに従つて縮径さ
れた逆円錐台形環状に形成され、該内面側と外面
側の間に融液面に近づくに従つて、一部又は全体
に亘つて厚さを大きくした断熱材を有することを
特徴とする単結晶製造装置。 2 前記断熱材は黒鉛フエルト又は石英フエルト
である特許請求の範囲第1項記載の単結晶製造装
置。
[Scope of Claims] 1. A crucible for heating and melting a raw material for a single crystal to be produced, a means for pulling the single crystal from the melt in the crucible, and a means for pulling the single crystal from the melt in the crucible. In a single crystal manufacturing apparatus, the heat shielding member disposed around the pulling area of the single crystal is composed of an annular rim part and a heat shielding member hanging around the pulling area of the single crystal from the inner edge of the annular rim part, The heat shield is formed into an inverted truncated conical ring shape whose diameter decreases from the upper end to the lower end on the inner surface facing the pulling region of the single crystal, and between the inner surface and the outer surface there is a molten liquid. A single crystal production device characterized by having a heat insulating material whose thickness increases partially or entirely as it approaches the surface. 2. The single crystal manufacturing apparatus according to claim 1, wherein the heat insulating material is graphite felt or quartz felt.
JP14975687A 1987-06-16 1987-06-16 Single crystal production apparatus Granted JPS63315589A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14975687A JPS63315589A (en) 1987-06-16 1987-06-16 Single crystal production apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14975687A JPS63315589A (en) 1987-06-16 1987-06-16 Single crystal production apparatus

Publications (2)

Publication Number Publication Date
JPS63315589A JPS63315589A (en) 1988-12-23
JPH0535715B2 true JPH0535715B2 (en) 1993-05-27

Family

ID=15482062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14975687A Granted JPS63315589A (en) 1987-06-16 1987-06-16 Single crystal production apparatus

Country Status (1)

Country Link
JP (1) JPS63315589A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997021853A1 (en) * 1995-12-08 1997-06-19 Shin-Etsu Handotai Co., Ltd. Single crystal production apparatus and process
WO2004027124A1 (en) * 2002-09-18 2004-04-01 Sumitomo Mitsubishi Silicon Corporation Thermal shield member of silicon single crystal pulling system

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JP2709310B2 (en) * 1989-11-11 1998-02-04 住友シチックス株式会社 Single crystal pulling device
JP2549445B2 (en) * 1989-12-05 1996-10-30 新日本製鐵株式会社 Method for producing silicon single crystal
JP3016897B2 (en) * 1991-03-20 2000-03-06 信越半導体株式会社 Method and apparatus for producing silicon single crystal
JP2562245B2 (en) * 1991-06-24 1996-12-11 コマツ電子金属株式会社 Single crystal pulling device
JP2606046B2 (en) * 1992-04-16 1997-04-30 住友金属工業株式会社 Control method of single crystal oxygen concentration during single crystal pulling
US6503594B2 (en) 1997-02-13 2003-01-07 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects and slip
SG64470A1 (en) 1997-02-13 1999-04-27 Samsung Electronics Co Ltd Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnace and ingots and wafers manufactured thereby
US6485807B1 (en) 1997-02-13 2002-11-26 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects, and methods of preparing the same
US6340392B1 (en) 1997-10-24 2002-01-22 Samsung Electronics Co., Ltd. Pulling methods for manufacturing monocrystalline silicone ingots by controlling temperature at the center and edge of an ingot-melt interface
MY131022A (en) * 2000-09-29 2007-07-31 Samsung Electronics Co Ltd Silicon wafers having controlled distribution of defects, and methods of preparing the same
JP4736401B2 (en) * 2004-11-02 2011-07-27 住友金属工業株式会社 Method for producing silicon carbide single crystal
CN101838846A (en) * 2010-02-23 2010-09-22 上海汉虹精密机械有限公司 Single crystal furnace device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62138386A (en) * 1985-12-11 1987-06-22 Shin Etsu Handotai Co Ltd Device for pulling single crystal

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62138386A (en) * 1985-12-11 1987-06-22 Shin Etsu Handotai Co Ltd Device for pulling single crystal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997021853A1 (en) * 1995-12-08 1997-06-19 Shin-Etsu Handotai Co., Ltd. Single crystal production apparatus and process
WO2004027124A1 (en) * 2002-09-18 2004-04-01 Sumitomo Mitsubishi Silicon Corporation Thermal shield member of silicon single crystal pulling system

Also Published As

Publication number Publication date
JPS63315589A (en) 1988-12-23

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