JPH0535574B2 - - Google Patents

Info

Publication number
JPH0535574B2
JPH0535574B2 JP60256364A JP25636485A JPH0535574B2 JP H0535574 B2 JPH0535574 B2 JP H0535574B2 JP 60256364 A JP60256364 A JP 60256364A JP 25636485 A JP25636485 A JP 25636485A JP H0535574 B2 JPH0535574 B2 JP H0535574B2
Authority
JP
Japan
Prior art keywords
adhesive tape
wafer
film
semiconductor wafer
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60256364A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62115840A (ja
Inventor
Takeshi Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Radio Co Ltd
Original Assignee
Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Radio Co Ltd filed Critical Japan Radio Co Ltd
Priority to JP60256364A priority Critical patent/JPS62115840A/ja
Publication of JPS62115840A publication Critical patent/JPS62115840A/ja
Publication of JPH0535574B2 publication Critical patent/JPH0535574B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Packaging Frangible Articles (AREA)
JP60256364A 1985-11-15 1985-11-15 半導体ウエハの保護方法 Granted JPS62115840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60256364A JPS62115840A (ja) 1985-11-15 1985-11-15 半導体ウエハの保護方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60256364A JPS62115840A (ja) 1985-11-15 1985-11-15 半導体ウエハの保護方法

Publications (2)

Publication Number Publication Date
JPS62115840A JPS62115840A (ja) 1987-05-27
JPH0535574B2 true JPH0535574B2 (en:Method) 1993-05-26

Family

ID=17291654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60256364A Granted JPS62115840A (ja) 1985-11-15 1985-11-15 半導体ウエハの保護方法

Country Status (1)

Country Link
JP (1) JPS62115840A (en:Method)

Also Published As

Publication number Publication date
JPS62115840A (ja) 1987-05-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees