JPH0534830B2 - - Google Patents

Info

Publication number
JPH0534830B2
JPH0534830B2 JP58160333A JP16033383A JPH0534830B2 JP H0534830 B2 JPH0534830 B2 JP H0534830B2 JP 58160333 A JP58160333 A JP 58160333A JP 16033383 A JP16033383 A JP 16033383A JP H0534830 B2 JPH0534830 B2 JP H0534830B2
Authority
JP
Japan
Prior art keywords
pellet
pellets
board
mounting
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58160333A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6053035A (ja
Inventor
Kunizo Sawara
Kanji Ootsuka
Takashi Ishida
Masatoshi Seki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58160333A priority Critical patent/JPS6053035A/ja
Publication of JPS6053035A publication Critical patent/JPS6053035A/ja
Publication of JPH0534830B2 publication Critical patent/JPH0534830B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H10W72/073—
    • H10W72/07337—

Landscapes

  • Semiconductor Memories (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58160333A 1983-09-02 1983-09-02 半導体装置の製造方法 Granted JPS6053035A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58160333A JPS6053035A (ja) 1983-09-02 1983-09-02 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58160333A JPS6053035A (ja) 1983-09-02 1983-09-02 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6053035A JPS6053035A (ja) 1985-03-26
JPH0534830B2 true JPH0534830B2 (enExample) 1993-05-25

Family

ID=15712698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58160333A Granted JPS6053035A (ja) 1983-09-02 1983-09-02 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6053035A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62260352A (ja) * 1986-05-06 1987-11-12 Mitsubishi Electric Corp 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
JPS5687395A (en) * 1979-12-18 1981-07-15 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS6053035A (ja) 1985-03-26

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