JPH0534409B2 - - Google Patents
Info
- Publication number
- JPH0534409B2 JPH0534409B2 JP1133378A JP13337889A JPH0534409B2 JP H0534409 B2 JPH0534409 B2 JP H0534409B2 JP 1133378 A JP1133378 A JP 1133378A JP 13337889 A JP13337889 A JP 13337889A JP H0534409 B2 JPH0534409 B2 JP H0534409B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- present
- solder
- strength
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010949 copper Substances 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910018104 Ni-P Inorganic materials 0.000 claims description 2
- 229910018536 Ni—P Inorganic materials 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 description 53
- 239000000956 alloy Substances 0.000 description 53
- 229910000679 solder Inorganic materials 0.000 description 23
- 230000000694 effects Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 238000012360 testing method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000006104 solid solution Substances 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004881 precipitation hardening Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13337889A JPH032341A (ja) | 1989-05-26 | 1989-05-26 | 高強度高導電性銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13337889A JPH032341A (ja) | 1989-05-26 | 1989-05-26 | 高強度高導電性銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH032341A JPH032341A (ja) | 1991-01-08 |
| JPH0534409B2 true JPH0534409B2 (ko) | 1993-05-24 |
Family
ID=15103339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13337889A Granted JPH032341A (ja) | 1989-05-26 | 1989-05-26 | 高強度高導電性銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032341A (ko) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3550233B2 (ja) * | 1995-10-09 | 2004-08-04 | 同和鉱業株式会社 | 高強度高導電性銅基合金の製造法 |
| US5865910A (en) * | 1996-11-07 | 1999-02-02 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US5820701A (en) * | 1996-11-07 | 1998-10-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US6679956B2 (en) | 1997-09-16 | 2004-01-20 | Waterbury Rolling Mills, Inc. | Process for making copper-tin-zinc alloys |
| US5893953A (en) * | 1997-09-16 | 1999-04-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| US6436206B1 (en) | 1999-04-01 | 2002-08-20 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| KR100894076B1 (ko) * | 2007-04-10 | 2009-04-21 | 주식회사 풍산 | 고전도성, 고강도 및 고가공성을 갖는 전기 및 전자부품용동합금 및 그 제조방법 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50147420A (ko) * | 1974-05-20 | 1975-11-26 | ||
| JPS60245754A (ja) * | 1984-05-22 | 1985-12-05 | Nippon Mining Co Ltd | 高力高導電銅合金 |
| JPS61264144A (ja) * | 1985-05-20 | 1986-11-22 | Nippon Mining Co Ltd | 半田耐熱剥離性に優れた高力高導電銅合金 |
| JPS63286544A (ja) * | 1987-05-18 | 1988-11-24 | Mitsubishi Electric Corp | 多極コネクタ−用銅合金 |
-
1989
- 1989-05-26 JP JP13337889A patent/JPH032341A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50147420A (ko) * | 1974-05-20 | 1975-11-26 | ||
| JPS60245754A (ja) * | 1984-05-22 | 1985-12-05 | Nippon Mining Co Ltd | 高力高導電銅合金 |
| JPS61264144A (ja) * | 1985-05-20 | 1986-11-22 | Nippon Mining Co Ltd | 半田耐熱剥離性に優れた高力高導電銅合金 |
| JPS63286544A (ja) * | 1987-05-18 | 1988-11-24 | Mitsubishi Electric Corp | 多極コネクタ−用銅合金 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH032341A (ja) | 1991-01-08 |
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