JPH0534133Y2 - - Google Patents
Info
- Publication number
- JPH0534133Y2 JPH0534133Y2 JP11015887U JP11015887U JPH0534133Y2 JP H0534133 Y2 JPH0534133 Y2 JP H0534133Y2 JP 11015887 U JP11015887 U JP 11015887U JP 11015887 U JP11015887 U JP 11015887U JP H0534133 Y2 JPH0534133 Y2 JP H0534133Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- counterbore
- insulating
- case material
- metal substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000005192 partition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11015887U JPH0534133Y2 (US07943777-20110517-C00090.png) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11015887U JPH0534133Y2 (US07943777-20110517-C00090.png) | 1987-07-17 | 1987-07-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6413798U JPS6413798U (US07943777-20110517-C00090.png) | 1989-01-24 |
JPH0534133Y2 true JPH0534133Y2 (US07943777-20110517-C00090.png) | 1993-08-30 |
Family
ID=31347058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11015887U Expired - Lifetime JPH0534133Y2 (US07943777-20110517-C00090.png) | 1987-07-17 | 1987-07-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0534133Y2 (US07943777-20110517-C00090.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2722820B2 (ja) * | 1990-12-27 | 1998-03-09 | 松下電器産業株式会社 | メタルベース基板 |
-
1987
- 1987-07-17 JP JP11015887U patent/JPH0534133Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6413798U (US07943777-20110517-C00090.png) | 1989-01-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4931908A (en) | Housing for an electronic circuit | |
JPH0534133Y2 (US07943777-20110517-C00090.png) | ||
JPH0534132Y2 (US07943777-20110517-C00090.png) | ||
JPS6175558A (ja) | 混成集積回路装置 | |
JPH04273200A (ja) | シールド装置 | |
JP2821315B2 (ja) | シングルインラインモジュール | |
JPH0442937Y2 (US07943777-20110517-C00090.png) | ||
JPS61166149A (ja) | 多層混成集積回路装置 | |
JPH0528800Y2 (US07943777-20110517-C00090.png) | ||
JPH0378793B2 (US07943777-20110517-C00090.png) | ||
JP2001243436A (ja) | 情報カード及びそのカード状筐体 | |
JPH056715Y2 (US07943777-20110517-C00090.png) | ||
JP2680619B2 (ja) | 混成集積回路 | |
JPH02110990A (ja) | 混成集積回路 | |
JPH0445253Y2 (US07943777-20110517-C00090.png) | ||
JPH0476210B2 (US07943777-20110517-C00090.png) | ||
JPH06824Y2 (ja) | 混成集積回路 | |
JP2664440B2 (ja) | 混成集積回路 | |
JPH043500Y2 (US07943777-20110517-C00090.png) | ||
JPH064605Y2 (ja) | 混成集積回路 | |
JPH0430565A (ja) | 高出力用混成集積回路装置 | |
JPH01257391A (ja) | 多層混成集積回路装置 | |
JPH01184984A (ja) | 電子回路装置 | |
JPH0430564A (ja) | 高出力用混成集積回路装置 | |
JPS6350090A (ja) | 電子回路基板 |