JPH0532232Y2 - - Google Patents
Info
- Publication number
- JPH0532232Y2 JPH0532232Y2 JP1986091384U JP9138486U JPH0532232Y2 JP H0532232 Y2 JPH0532232 Y2 JP H0532232Y2 JP 1986091384 U JP1986091384 U JP 1986091384U JP 9138486 U JP9138486 U JP 9138486U JP H0532232 Y2 JPH0532232 Y2 JP H0532232Y2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- nozzle
- lead frame
- pellet
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1986091384U JPH0532232Y2 (en:Method) | 1986-06-17 | 1986-06-17 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1986091384U JPH0532232Y2 (en:Method) | 1986-06-17 | 1986-06-17 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS62202375U JPS62202375U (en:Method) | 1987-12-23 | 
| JPH0532232Y2 true JPH0532232Y2 (en:Method) | 1993-08-18 | 
Family
ID=30952121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP1986091384U Expired - Lifetime JPH0532232Y2 (en:Method) | 1986-06-17 | 1986-06-17 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPH0532232Y2 (en:Method) | 
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US8303082B2 (en) * | 2009-02-27 | 2012-11-06 | Fujifilm Corporation | Nozzle shape for fluid droplet ejection | 
| PT2586537E (pt) * | 2011-10-31 | 2015-11-23 | Miguel Jurado Blázquez | Injector para aplicar vedantes com uma ponta em sino ou capuz e um botão de injecção | 
| JP6892686B2 (ja) * | 2017-12-27 | 2021-06-23 | 株式会社日本スペリア社 | はんだ塗布装置用ノズル | 
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS5715860A (en) * | 1980-06-30 | 1982-01-27 | Matsushita Electric Works Ltd | Spray tip for discharging synthetic resin | 
- 
        1986
        - 1986-06-17 JP JP1986091384U patent/JPH0532232Y2/ja not_active Expired - Lifetime
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPS62202375U (en:Method) | 1987-12-23 | 
Similar Documents
| Publication | Publication Date | Title | 
|---|---|---|
| JP3838797B2 (ja) | 部品の貼り着け方法とその装置 | |
| KR940002761B1 (ko) | 와이어 본딩 방법 및 장치 | |
| JPH0532232Y2 (en:Method) | ||
| US7731078B2 (en) | Semiconductor system with fine pitch lead fingers | |
| US6474532B2 (en) | Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | |
| KR200183547Y1 (ko) | 반도체 다이 본딩장치 | |
| JP2006156437A (ja) | リードフレーム及び半導体装置 | |
| JP2002198382A (ja) | ボンディングペーストの転写装置および転写ピンならびにボンディングペーストの転写方法 | |
| JPH0376139A (ja) | 半導体素子突上げ方法 | |
| JP3019630B2 (ja) | 接着剤塗布装置 | |
| JPH0586857B2 (en:Method) | ||
| JPH03169045A (ja) | ダイシング用粘着テープ | |
| JP2770566B2 (ja) | 熱圧着用ボンディングヘッド | |
| JPH0793336B2 (ja) | ダイボンダーにおけるペースト塗布装置 | |
| JP3264268B2 (ja) | ボール搭載治具およびボール搭載方法 | |
| JPS6344998Y2 (en:Method) | ||
| JP3987164B2 (ja) | Ic pad上への突起電極の形成方法 | |
| CN119368863A (zh) | 一种芯片料带压焊装置 | |
| JP2000195897A (ja) | フラックス転写装置とその転写方法 | |
| JP2765202B2 (ja) | 熱圧着用ボンディングヘッド | |
| JP2765201B2 (ja) | 熱圧着用ボンディングヘッド | |
| JPH022546Y2 (en:Method) | ||
| KR20020035576A (ko) | 기판 상의 회로로부터 반도체 칩으로의 와이어 본드부를형성하는 장치 및 반도체 칩 조립체를 형성하는 방법 | |
| JPH04117439U (ja) | バンプ電極形成装置 | |
| JPH09266219A (ja) | 半導体装置の製造装置 |