JPH053134B2 - - Google Patents

Info

Publication number
JPH053134B2
JPH053134B2 JP59125239A JP12523984A JPH053134B2 JP H053134 B2 JPH053134 B2 JP H053134B2 JP 59125239 A JP59125239 A JP 59125239A JP 12523984 A JP12523984 A JP 12523984A JP H053134 B2 JPH053134 B2 JP H053134B2
Authority
JP
Japan
Prior art keywords
chip
semiconductor device
applying
signal
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59125239A
Other languages
English (en)
Japanese (ja)
Other versions
JPS615549A (ja
Inventor
Akihiko Utsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Microcomputer System Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Microcomputer System Ltd, Hitachi Ltd filed Critical Hitachi Microcomputer System Ltd
Priority to JP12523984A priority Critical patent/JPS615549A/ja
Publication of JPS615549A publication Critical patent/JPS615549A/ja
Publication of JPH053134B2 publication Critical patent/JPH053134B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP12523984A 1984-06-20 1984-06-20 半導体装置 Granted JPS615549A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12523984A JPS615549A (ja) 1984-06-20 1984-06-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12523984A JPS615549A (ja) 1984-06-20 1984-06-20 半導体装置

Publications (2)

Publication Number Publication Date
JPS615549A JPS615549A (ja) 1986-01-11
JPH053134B2 true JPH053134B2 (es) 1993-01-14

Family

ID=14905233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12523984A Granted JPS615549A (ja) 1984-06-20 1984-06-20 半導体装置

Country Status (1)

Country Link
JP (1) JPS615549A (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5842877A (en) * 1996-12-16 1998-12-01 Telefonaktiebolaget L M Ericsson Shielded and impedance-matched connector assembly, and associated method, for radio frequency circuit device
US6724084B1 (en) 1999-02-08 2004-04-20 Rohm Co., Ltd. Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
JP4497683B2 (ja) * 2000-09-11 2010-07-07 ローム株式会社 集積回路装置
EP1328015A3 (de) * 2002-01-11 2003-12-03 Hesse & Knipps GmbH Verfahren zum Flip-Chip-Bonden
EP1796160A1 (en) * 2004-08-20 2007-06-13 Rohm Co., Ltd. Semiconductor device, power supply apparatus using the same, and electronic device
JP5119225B2 (ja) 2009-09-11 2013-01-16 株式会社日立製作所 半導体実装基板および半導体装置
CN102598262A (zh) * 2009-11-10 2012-07-18 日本电气株式会社 半导体装置和噪声抑制方法
JP2015060909A (ja) * 2013-09-18 2015-03-30 オリンパス株式会社 半導体装置
WO2018042518A1 (ja) * 2016-08-30 2018-03-08 株式会社日立製作所 半導体装置及びプリント基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574241B2 (es) * 1977-12-29 1982-01-25

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574241U (es) * 1980-06-10 1982-01-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574241B2 (es) * 1977-12-29 1982-01-25

Also Published As

Publication number Publication date
JPS615549A (ja) 1986-01-11

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