JPH0530849Y2 - - Google Patents

Info

Publication number
JPH0530849Y2
JPH0530849Y2 JP1986183904U JP18390486U JPH0530849Y2 JP H0530849 Y2 JPH0530849 Y2 JP H0530849Y2 JP 1986183904 U JP1986183904 U JP 1986183904U JP 18390486 U JP18390486 U JP 18390486U JP H0530849 Y2 JPH0530849 Y2 JP H0530849Y2
Authority
JP
Japan
Prior art keywords
solder
duct
soldering
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986183904U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6390566U (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986183904U priority Critical patent/JPH0530849Y2/ja
Publication of JPS6390566U publication Critical patent/JPS6390566U/ja
Application granted granted Critical
Publication of JPH0530849Y2 publication Critical patent/JPH0530849Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1986183904U 1986-11-28 1986-11-28 Expired - Lifetime JPH0530849Y2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986183904U JPH0530849Y2 (ko) 1986-11-28 1986-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986183904U JPH0530849Y2 (ko) 1986-11-28 1986-11-28

Publications (2)

Publication Number Publication Date
JPS6390566U JPS6390566U (ko) 1988-06-11
JPH0530849Y2 true JPH0530849Y2 (ko) 1993-08-06

Family

ID=31131070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986183904U Expired - Lifetime JPH0530849Y2 (ko) 1986-11-28 1986-11-28

Country Status (1)

Country Link
JP (1) JPH0530849Y2 (ko)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851472B2 (ja) * 1976-02-25 1983-11-16 ケイディディ株式会社 テレビジヨン信号の１ライン間予測符号化方式

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851472U (ja) * 1981-10-05 1983-04-07 クラリオン株式会社 自動はんだ付け装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851472B2 (ja) * 1976-02-25 1983-11-16 ケイディディ株式会社 テレビジヨン信号の１ライン間予測符号化方式

Also Published As

Publication number Publication date
JPS6390566U (ko) 1988-06-11

Similar Documents

Publication Publication Date Title
TW404156B (en) Process for selective application of solder to circuit packages
JPH0530849Y2 (ko)
JPH08181424A (ja) プリント基板及びその半田付け方法
JPH05259355A (ja) 電子部品
JPS6343193B2 (ko)
JPS6039158Y2 (ja) はんだノズル
JP2002368404A (ja) プリント基板の部分はんだ付け方法および部分噴流はんだ槽
JPH11354915A (ja) プリント基板のはんだ付け方法および噴流はんだ槽
JPH0444305Y2 (ko)
JP3031478B2 (ja) ウェハの鍍金方法およびその装置
JPS6339117B2 (ko)
JPH0821768B2 (ja) プリント配線板
JPH03106563A (ja) 半導体装置の被覆方法
JPS6214687Y2 (ko)
JPS6199570A (ja) フラツクス塗布装置
JPH11284318A (ja) 電子部品実装基板
JP2002198641A (ja) フローはんだ装置
JP2774617B2 (ja) 微細構造の金属部を有するセラミックス構造体の製造方法
JPH0227971Y2 (ko)
JPH0634284U (ja) 表面実装用円筒形部品取り付けランド形状
JPH046220Y2 (ko)
JPH0587354B2 (ko)
JPS6051942B2 (ja) 噴流式はんだ槽
JPH0366472A (ja) はんだ付方法およびはんだ付装置
JPH08279675A (ja) 半田になじむ面をもつ半田槽