JPH0530386Y2 - - Google Patents
Info
- Publication number
- JPH0530386Y2 JPH0530386Y2 JP1985035598U JP3559885U JPH0530386Y2 JP H0530386 Y2 JPH0530386 Y2 JP H0530386Y2 JP 1985035598 U JP1985035598 U JP 1985035598U JP 3559885 U JP3559885 U JP 3559885U JP H0530386 Y2 JPH0530386 Y2 JP H0530386Y2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- case
- elastic material
- fixed
- elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 32
- 239000013013 elastic material Substances 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985035598U JPH0530386Y2 (US06168776-20010102-C00028.png) | 1985-03-13 | 1985-03-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985035598U JPH0530386Y2 (US06168776-20010102-C00028.png) | 1985-03-13 | 1985-03-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61153388U JPS61153388U (US06168776-20010102-C00028.png) | 1986-09-22 |
JPH0530386Y2 true JPH0530386Y2 (US06168776-20010102-C00028.png) | 1993-08-03 |
Family
ID=30540022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985035598U Expired - Lifetime JPH0530386Y2 (US06168776-20010102-C00028.png) | 1985-03-13 | 1985-03-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0530386Y2 (US06168776-20010102-C00028.png) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5125773B2 (ja) * | 2008-05-30 | 2013-01-23 | 富士通株式会社 | 電子機器およびグラウンド接続構造 |
JP2011086720A (ja) * | 2009-10-14 | 2011-04-28 | Fujitsu Ltd | 電子機器、ワッシャ、およびワッシャ製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS483889U (US06168776-20010102-C00028.png) * | 1971-05-26 | 1973-01-17 | ||
JPS5948071B2 (ja) * | 1979-11-30 | 1984-11-24 | 豊田合成株式会社 | 自動車用合成樹脂製モ−ルを接着するための接着剤 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948071U (ja) * | 1982-09-24 | 1984-03-30 | 島田理化工業株式会社 | セラミツク回路基板の取付部 |
-
1985
- 1985-03-13 JP JP1985035598U patent/JPH0530386Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS483889U (US06168776-20010102-C00028.png) * | 1971-05-26 | 1973-01-17 | ||
JPS5948071B2 (ja) * | 1979-11-30 | 1984-11-24 | 豊田合成株式会社 | 自動車用合成樹脂製モ−ルを接着するための接着剤 |
Also Published As
Publication number | Publication date |
---|---|
JPS61153388U (US06168776-20010102-C00028.png) | 1986-09-22 |