JPH0530358Y2 - - Google Patents
Info
- Publication number
- JPH0530358Y2 JPH0530358Y2 JP1987070743U JP7074387U JPH0530358Y2 JP H0530358 Y2 JPH0530358 Y2 JP H0530358Y2 JP 1987070743 U JP1987070743 U JP 1987070743U JP 7074387 U JP7074387 U JP 7074387U JP H0530358 Y2 JPH0530358 Y2 JP H0530358Y2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- holder
- elastic pressing
- plungers
- pot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987070743U JPH0530358Y2 (cs) | 1987-05-12 | 1987-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987070743U JPH0530358Y2 (cs) | 1987-05-12 | 1987-05-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63178323U JPS63178323U (cs) | 1988-11-18 |
| JPH0530358Y2 true JPH0530358Y2 (cs) | 1993-08-03 |
Family
ID=30912655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987070743U Expired - Lifetime JPH0530358Y2 (cs) | 1987-05-12 | 1987-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530358Y2 (cs) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57123222U (cs) * | 1981-01-26 | 1982-07-31 | ||
| JPS6146050A (ja) * | 1984-08-10 | 1986-03-06 | Nec Ic Microcomput Syst Ltd | 半導体集積回路装置 |
-
1987
- 1987-05-12 JP JP1987070743U patent/JPH0530358Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63178323U (cs) | 1988-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013247315A (ja) | 樹脂封止成形装置 | |
| US11472077B2 (en) | Injection molding mold apparatus and method for manufacturing injection-molded article | |
| JPH0530358Y2 (cs) | ||
| KR100228836B1 (ko) | 고형가능한 액체가 몰드의 캐비티에 적어도 부분적으로 충진되기 전에 클로징시키는 방법과 이 방법을 수행하는데 적합한 프레스와 이 프레스에 사용되기에 적합한 몰드부 | |
| US5366368A (en) | Multi-plunger manual transfer mold die | |
| CN210590244U (zh) | 卡盖注塑模具 | |
| JP6012893B1 (ja) | 樹脂成形装置 | |
| KR101935480B1 (ko) | 트랜스퍼 금형 장치 및 이를 활용한 트랜스퍼 금형 방법 | |
| CN217046165U (zh) | 一种peek平垫装配工装 | |
| JP4016168B2 (ja) | 注入ヘッドの保持構造 | |
| CN223545672U (zh) | 一种二次成型防粘前模弹块结构 | |
| TW201713495A (zh) | 沖壓機構、沖壓方法、壓縮成形裝置以及壓縮成形方法 | |
| JP2000326364A (ja) | 半導体装置樹脂封止用金型 | |
| CN219345187U (zh) | 一种浮动压头c型限位机构及具有它的保压治具 | |
| JPS6334271Y2 (cs) | ||
| CN222096836U (zh) | 一种可调式注塑模具 | |
| JP3389332B2 (ja) | 成形型および成形方法 | |
| JP3710219B2 (ja) | 樹脂モールド装置のプランジャ支持構造 | |
| JP2609849B2 (ja) | 多品種少量生産に適した半導体封止用のマルチプランジヤー型樹脂モールド装置 | |
| JP2000183084A (ja) | 半導体封止装置 | |
| JP2903042B2 (ja) | 多品種少量生産に適した半導体封止用のマルチプランジャー型樹脂モールド装置 | |
| JPS6350104Y2 (cs) | ||
| US20210323203A1 (en) | Apparatus and method for forming molded products | |
| JPH0722939B2 (ja) | 弁体成形装置 | |
| JPH079612Y2 (ja) | 離型装置 |